Untitled
Abstract: No abstract text available
Text: PA28-28-DP -PP Data Sheet 28 pin DIP ZIF socket/28 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-28-DP adapter accepts 28 pin DIP devices and plugs into 28 pin PLCC production sockets. This allows DIP devices or emulators with DIP plugs to be used during development of
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Original
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PA28-28-DP
socket/28
PA28-28-DP-PP
28PLUG
PA28-28-DP
PA28-28-DP-PP
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PDF
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PA28-28-DP
Abstract: PA28-28-DP-PP 28 PIN plcc socket dip 24 dimension 20 pin zif socket dip 28 dimension 16 pin dp 24 pin zif connector 28-pin 8 pin zif connector
Text: PA28-28-DP -PP Data Sheet 28 pin DIP ZIF socket/28 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-28-DP adapter accepts 28 pin DIP devices and plugs into 28 pin PLCC production sockets. This allows DIP devices or emulators with DIP plugs to be used during development of
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Original
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PA28-28-DP
socket/28
PA28-28-DP-PP
28PLUG
PA28-28-DP
PA28-28-DP-PP
28 PIN plcc socket
dip 24 dimension
20 pin zif socket
dip 28 dimension
16 pin dp
24 pin zif connector
28-pin
8 pin zif connector
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PDF
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A10 EIAJ code : ∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51 (1.400±.020) R1.27(.050)
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Original
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DIP-28C-A10
DIP028-C-0400-2
100mil
400mil
28-pin
DIP-28C-A10)
D28024SC-1-3
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PDF
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28 pin ceramic dip
Abstract: dip-28c
Text: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A01 EIAJ code : ∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014) R1.27(.050) REF 15.11±0.25
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Original
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DIP-28C-A01
DIP028-C-0600-1
100mil
600mil
28-pin
DIP-28C-A01)
D28005SC-2-3
28 pin ceramic dip
dip-28c
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30
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Original
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DIP-28P-M05
DIP028-P-0600-2
28-pin
DIP-28P-M05)
D28013S-3C-2
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PDF
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DIP028-P-0300-1
Abstract: DIP-28P-M
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M04 EIAJ code :∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04)
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Original
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DIP-28P-M04
DIP028-P-0300-1
28-pin
DIP-28P-M04)
D28018S-2C-3
DIP028-P-0300-1
DIP-28P-M
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PDF
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28 pin ceramic dip
Abstract: DIP28C-C02
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38
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Original
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DIP-28C-C02
DIP028-G-0600-1
28-pin
DIP-28C-C02)
D28010SC-3-3
28 pin ceramic dip
DIP28C-C02
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PDF
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DIP028-P-0300-1
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M04 EIAJ code : ∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04) +0.20 35.36 –0.30 1.392 +.008 –.012
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Original
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DIP-28P-M04
DIP028-P-0300-1
100mil
300mil
28-pin
DIP-28P-M04)
D28018S-2C-3
DIP028-P-0300-1
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PDF
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28 pin ceramic dip
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A07 EIAJ code : ∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014) 1.27(.050) REF 15.11±0.25
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Original
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DIP-28C-A07
DIP028-C-0600-2
100mil
600mil
28-pin
DIP-28C-A07)
D28019SC-2-3
28 pin ceramic dip
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PDF
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070-007
Abstract: SDIP028-P-0400-1 020MIN
Text: SHRINK DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20 26.00 –0.30 1.024 +.008 –.012
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Original
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DIP-28P-M03
SDIP028-P-0400-1
70mil
400mil
28-pin
DIP-28P-M03)
D28012S-3C-3
070-007
SDIP028-P-0400-1
020MIN
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PDF
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M06 EIAJ code : ∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20 35.36 –0.30 +.008 1.392 –.012
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Original
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DIP-28P-M06
DIP028-P-0400-1
100mil
400mil
28-pin
DIP-28P-M06)
D28022S-1C-3
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1
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Original
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DIP-28P-M05
DIP028-P-0600-2
100mil
600mil
28-pin
DIP-28P-M05)
D28013S-3C-2
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PDF
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28 pin ceramic dip
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)
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Original
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DIP-28C-C02
DIP028-G-0600-1
100mil
600mil
28-pin
DIP-28C-C02)
28 pin ceramic dip
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PDF
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DIP-28C
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A07 EIAJ code :∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014)
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Original
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DIP-28C-A07
DIP028-C-0600-2
28-pin
DIP-28C-A07)
D28019SC-2-3
DIP-28C
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014)
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Original
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DIP-28C-A01
DIP028-C-0600-1
28-pin
DIP-28C-A01)
D28005SC-2-3
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PDF
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SDIP028-P-0400-1
Abstract: DIP-28P-M03 dip28pm03 910025
Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20
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Original
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DIP-28P-M03
SDIP028-P-0400-1
28-pin
DIP-28P-M03)
D28012S-3C-3
SDIP028-P-0400-1
DIP-28P-M03
dip28pm03
910025
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PDF
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DIP-28P-M06
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20
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Original
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DIP-28P-M06
DIP028-P-0400-1
28-pin
DIP-28P-M06)
D28022S-1C-3
DIP-28P-M06
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PDF
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28 pin ceramic dip
Abstract: 28-pin
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP
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Original
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DIP-28C-A01
DIP028-C-0600-1
28-pin
DIP-28C-A01)
D28005SC-2-3
28 pin ceramic dip
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A07 EIAJ code :∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP
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Original
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DIP-28C-A07
DIP028-C-0600-2
28-pin
DIP-28C-A07)
D28019SC-2-3
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PDF
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28-pin
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP
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Original
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DIP-28P-M05
DIP028-P-0600-2
28-pin
DIP-28P-M05)
D28013S-3C-2
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PDF
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28 pin ceramic dip
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP
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Original
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DIP-28C-C02
DIP028-G-0600-1
28-pin
DIP-28C-C02)
D28010SC-3-3
28 pin ceramic dip
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PDF
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28PIN
Abstract: 28-pin
Text: a 28-Pin Plastic DIP Package N-28 Dimensions shown in inches and (mm)
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Original
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28-Pin
28PIN
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PDF
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Untitled
Abstract: No abstract text available
Text: PA28TSOP3 Data Sheet 28 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA28TSOP3 adapter converts the pinout of a 28 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM memories
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Original
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PA28TSOP3
socket/28
27C256
27C512
28C16
28C64
Adapte20
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PDF
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A 4506
Abstract: 8 pin ic A 4506 ic a 4506 A4506 PSB4505 PSB45030 Q67000-A6005 ic psb 4505 PSB RESISTORS ic vr PDIP28
Text: S IE M E N S Enhanced Speech Circuit ESC PSB 4505 PSB 4505A PSB 4506 PSB 4506A Preliminary Data Type PSB PSB PSB PSB 4505 4505 A 4506 4506 A Bipolar 1C Ordering Code Package Q67000-A8161 Q67000-A6005 Q67000-A8211 Q67000-A6004 P-DIP-28 P-DIP-28 P-DIP-28 P-DIP-28
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OCR Scan
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Q67000-A8161
Q67000-A6005
Q67000-A8211
Q67000-A6004
P-DIP-28
P-DIP-28
4506/4506A
PSB4505
A 4506
8 pin ic A 4506
ic a 4506
A4506
PSB45030
ic psb 4505
PSB RESISTORS
ic vr PDIP28
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PDF
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