DIP-18A

Abstract: DIP-28A 18-A
Contextual Info: MITSUMI Packages Packages Units : mm DIP-18A DIP-28A DIP-28B

D1604

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN PLASTIC DIP-16P-M05 EIAJ code : ∗DIP016-P-0300-3 Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold Package width 283mil 16-pin plastic DIP DIP-16P-M05 16-pin plastic DIP (DIP-16P-M05) +0.20 19.45 –0.30 +.008

DIP028-P-0300-1

Contextual Info: SKINNY DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M04 EIAJ code : ∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04) +0.20 35.36 –0.30 1.392 +.008 –.012

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A07 EIAJ code : ∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014) 1.27(.050) REF 15.11±0.25

Contextual Info: SLIM DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A10 EIAJ code : ∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51 (1.400±.020) R1.27(.050)

28 pin ceramic dip

Abstract: dip-28c
Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A01 EIAJ code : ∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014) R1.27(.050) REF 15.11±0.25

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30

DIP028-P-0300-1

Abstract: DIP-28P-M
Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M04 EIAJ code :∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04)

28 pin ceramic dip

Abstract: DIP28C-C02
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38

070-007

Abstract: SDIP028-P-0400-1 020MIN
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20 26.00 –0.30 1.024 +.008 –.012

Contextual Info: SLIM DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M06 EIAJ code : ∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20 35.36 –0.30 +.008 1.392 –.012

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)

LC7060AN

Abstract: LC7566 LC6502 LC7520 MFP-36S M1A5 LC7535 ScansU9X24
Contextual Info: SANYO SEMICONDUCTOR CORP b3E ]> * Under Development Graohic Eauaiizer Tyoe Nq Pack age Volume LC 7520 DIP-28 7 Bands LC7522 DIP-28S 7 Bands LC7523 LC7523M DIP-28S MFP-30 7 Bands • * LC7527E QIP-64E LC 7565 LC7565A DIP-42S QIP-48A LC7566 DIP-42S OtSDlay Controller

28 pin ceramic dip

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A10 EIAJ code :∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014)

SDIP028-P-0400-1

Abstract: DIP-28P-M03 dip28pm03 910025
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20

DIP-28P-M06

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20

16-Pin Plastic DIP

Abstract: DIP-16P-M05
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC DIP-16P-M05 EIAJ code :∗DIP016-P-0300-3 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold Package width 283 mil DIP-16P-M05 16-pin plastic DIP (DIP-16P-M05)

footprint 24PIN DIP

Abstract: 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint
Contextual Info: DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information. J-4 DIP Packages

IR2110 application note

Abstract: IR2101 full bridge IR2113 APPLICATION NOTE h bridge ir2110 full bridge ir2110 Full-bridge IR2110 IR2112 application note IR2104 APPLICATION NOTE h bridge ir2113 ballast Self-Oscillating
Contextual Info: International Rectifier Control IC Navigator Function Features Voltage Offset 8 Lead DIP 14 Lead DIP 14 Lead DIP w/o leads 4 & 5 16 Lead DIP w/o leads 4 & 5 28 Lead DIP 9 Pin SIP w/o leads 5&7 8 Lead SOIC Narrow Body Basic 600 IR2117 G IR2118 (G) IR2117S (G)

DO220

Abstract: DO-220 DIP-22 DIP28 dip18pin DIP18
Contextual Info: TO 220 7-pin HW Special Case Plastic 5*leads Version V Special Case Plastic 5*leads Version H DO 220 TOP 3 TO 92 16*pin DIP spec.case 12-pin QIP Special case , 8 leads 4*pin DIP SIP 8 SIP 6 6*pin DIP 8*pin DIP 14*pin DIP 16*pin DIP 18*pin DIP 20*pin DIP 22*pin DIP

LC7566

Abstract: LC7060AN LC 7560 sanyo sanyo lc7060 LC-7566 DIP42S DIP-42S LC7535 LC7565
Contextual Info: SANYO SE MI COND UCT OR CORP b3E ]> 7 t1ci7D7ti D D i m i 313 « T S A J ^Under Development G-ao^'c rauiJii^er Type NQ Package Volume LC7520 DIP-28 LC7522 DIP-: LC 7523 LC7523M DIP-28S MFP-30 * LC7527E QIP-64E LC 7565 LC7565A DIP-42S QIP-48A LC7566 DIP-42S

Contextual Info: 28 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: