FPD63310
Abstract: TFTLCD LMC7532 bare die
Text: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die TFT-LCD Panels Applications Bare Die/Known Good Die TFT-LCD Panels 1 7 2 CD 1 CD N 3 4 6 5 www.national.com 1 N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die
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FPD63310
TFTLCD
LMC7532
bare die
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bare die
Abstract: No abstract text available
Text: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die Portable Digital Assistant Applications Bare Die/Known Good Die Portable Digital Assistant 1 2 3 4 5 6 7 8 www.national.com 1 N January 1998 Die Products Business Unit Applications
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LMxxx
Abstract: No abstract text available
Text: DPBU Die Datasheet LMXXX MDA MWA EXAMPLE DIE DATASHEET DEVICE DISCRIPTION November 14,2002 DIE LAYOUT A-STEP DIE/WAFER CHARACTERISTICS Fabrication Attributes Physical Die Identification Die Step General Die Information LMXXX Bond Pad Opening Size 000µm x 000µm
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000mm
LMxxx
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Untitled
Abstract: No abstract text available
Text: Application Note Switch Die Measurement Fixture Rev 0 RELEVANT PRODUCTS • calibration structure and the other 24 elements are used to measure die. Figure 1 illustrates a measurement element for a single pole, double throw SPDT switch die. All ANADIGICS Switch Die
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Untitled
Abstract: No abstract text available
Text: Direct Link 1173 Products & Technologies Miniaturisierte Drucksensorelemente Februar 2009 Robuster Allrounder Nur noch 1,65 x 1,65 mm² messen die Sensorelemente der Familie C32. Die neuen Chips stattet EPCOS mit optimierten Bondpads aus, die über räumlich abgesetzte Testpad-Strukturen für Waferprober verfügen. Wie die
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C32Variante
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LRIS64K
Abstract: DSASW003741
Text: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):
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TN0193
LRIS64K
LRIS64K
M24RF64A1
DSASW003741
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F37011
Abstract: No abstract text available
Text: TN0055 Technical note SRI4K die description Product information ● Product name: SRI4K ● Die code: P117ZMY Wafer and die features October 2007 Wafer diameter 8" Wafer thickness 180 µm Die technology F6SPs40s 3M 1P Diffusion Plant Chartered Die identification
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TN0055
P117ZMY
F6SPs40s
F37011
F37011
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astro tool
Abstract: m22520 astro tool m22520
Text: DIE M22520/23-04 4 GAGE [AMT23004DA] - : Astro Tools HOME PRODUCTS LOG IN Home : Products : Die Sets & Locators : DIE (M22520/23-04) 4 GAGE SEARCH Enter Model #, NSN, MPN Here Advanced Search M39029 Search Die Sets & Locators Product 3/239
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M22520/23-04)
AMT23004DA]
M39029
AMT23004DA
25lbs
503-591-7766ARCH
astro tool
m22520
astro tool m22520
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lexan 920
Abstract: Lexan-920 lexan .920 VI-260-CV VI-J00 Wakefield Engineering
Text: 8 Sicherheits-Vorschriften Sicherungen. Die Zulassungsbestimmungen der Sicherheitsbehörden machen es erforderlich, daß die Module abgesichert werden. Die Sicherung muß in die +Input Leitung geschaltet werden, nicht in die –Input Leitung, da eine Unterbrechung der –Input Leitung bewirken würde, daß die GateAnschlüsse auf das Spannungspotential der +Input Leitung
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SPANSION date code format
Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Text: Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar
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47821
Abstract: 69051 47824 47820 Terminal crimping training 59974-1 408-1729 47822 HAND TERMINAL CRIMPING TOOL tyco ram repair
Text: Instruction Sheet 408-1729 Crimping Dies 47820 through 47825, 47915, and 47918 Typical Crimping Dies 29 NOV 07 Rev H 2. DESCRIPTION Stationary Die Nest Locator Each crimping die consists of a stationary die (nest) and a moving die (anvil). The stationary die features a
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AM29
Abstract: 29f800bb AMD xp
Text: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray
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IRG41BC20W
Abstract: IRG41BC20UD Drive circuit for IGBT using IR2130 IR2184 application notes IR2110 driver CIRCUIT FOR INVERTERS DC MOTOR SPEED CONTROL USING IGBT IRG41BC30W IR2181 application notes IR2103 bldc driver 1KW dc motor
Text: TABLE OF CONTENTS Selection Guides Fast Diode Die Data Sheets FRED Die Data Sheets HEXFET Power MOSFET Die Data Sheets HEXFRED® Rectifier Die Data Sheets IC Data Sheets IGBT Die Data Sheets IGBT Modules for Motor Drive & UPS IGBT Modules for Motor Drives in Industrial Electric Vehicles
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O-220
IR2130
230VAC
IR2133
460VAC
IR2233
IR2137/IR2171
IRG41BC20W
IRG41BC20UD
Drive circuit for IGBT using IR2130
IR2184 application notes
IR2110 driver CIRCUIT FOR INVERTERS
DC MOTOR SPEED CONTROL USING IGBT
IRG41BC30W
IR2181 application notes
IR2103 bldc driver
1KW dc motor
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Untitled
Abstract: No abstract text available
Text: Die Specifications Die Information EXAR offers a wide variety of standard products in die form. This new section contains a data sheet for each product available in die form, with specific ordering information, electrical specifications, and physical characteristics useful to the end user.
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Burr Brown part marking
Abstract: OPA21 OPA2111 fet operational amplifier
Text: DIE PRODUCTS B U R R -B R O W N * OPA2111 DIE 1 Dual, Low Noise, Precision Difet OPERATIONAL AM PLIFIER DIE FEATURES DESCRIPTION • LOW NOISE: 100% TESTED The OPA2111 die is a high-precision monolithic D ifet Dielectrically isolated FET operational ampli
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OPA2111
OPA2111
Mil-STD-883,
MIL-STD-883.
Burr Brown part marking
OPA21
fet operational amplifier
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burr brown date code marking
Abstract: burr brown date code
Text: DIE PRODUCTS BURR-BROW N* OPA128 DIE Difet Electronics Grade OPERATIONAL AMPLIFIER DIE FEATURES DESCRIPTION • • • • • The OPA128 die is an ultra-low bias current mono lithic operational amplifier. Using advanced geome try, dielectrically isolated FET Difet inputs, this
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OPA128
100fA
110dB
18VDC
36VDC
OPA128
MIL-STD-883,
burr brown date code marking
burr brown date code
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Untitled
Abstract: No abstract text available
Text: DIE PRODUCTS BURR-BROWN* •B B OPA633 DIE I High Speed Buffer AMPLIFIER DIE FEATURES DESCRIPTION • • • • The OPA633 die is a monolithic unity-gain buffer am plifier featuring very wide bandwidth and high slew rate. A dielectric isolation process incorporating both
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OPA633
OPA633
MIL-STD-883,
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HI-508
Abstract: HI-508KD ad 508 die
Text: DIE PRODUCTS B U R R -B R O W N * HI-508 DIE 1 [ Single-Ended 8-Channel CMOS ANALOG MULTIPLEXER DIE FEATURES DESCRIPTION • ANALOG OVERVOLTAGE PROTECTION: 70Vp-p The HI-508KD die is an 8-channel single-ended analog multiplexer with input overvoltage pro
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HI-508
70Vp-p
HI-508KD
-28mW
ad 508 die
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marking E5 amplifier
Abstract: mdb 501 E5 monolithic amplifier M11 marking OPA633 OPA633AD isolation amplifier ad
Text: DIE PRODUCTS « Ü R R -B R Q W M » OPA633 DIE High Speed Buffer AMPLIFIER DIE FEATURES DESCRIPTION • • • • The OPA633 die is a monolithic unity-gain buffer am plifier featuring very wide bandwidth and high slew rate. A dielectric isolation process incorporating both
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OPA633
200mA
OPA633
MIL-STD-883.
MIL-STD483,
marking E5 amplifier
mdb 501
E5 monolithic amplifier
M11 marking
OPA633AD
isolation amplifier ad
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Burr Brown part marking
Abstract: 506K 50s MARKING CODE marking 1be HI-506 HI-506KD IN1613 burr brown date code
Text: DIE PRODUCTS B U R R -B R O W N l B B HI-506 DIE | Single-Ended 16-Channel CMOS ANALOG MULTIPLEXER DIE FEATURES DESCRIPTION • ANALOG OVERVOLTAGE PROTECTION: 70Vp-p The HI-506KD die is a 16-channel single-ended analog multiplexer with input overvoltage pro
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HI-506
16-Channel
70Vp-p
HI-506KD
Burr Brown part marking
506K
50s MARKING CODE
marking 1be
IN1613
burr brown date code
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Untitled
Abstract: No abstract text available
Text: DIE PRODUCTS BURR-BROW N* [ DAC703 DIE 1 Current Output 16-BIT DIGITAL-TO-ANALOG CONVERTER DIE FEATURES • HIGH ACCURACY • MONOTONIC AT 14 BITS OVER FULL MILITARY TEMPERATURE RANGE DIE TOPOGRAPHY 23 22 21 20 191817 _ _ 16 15 14 13 12 11 3 PAD 1 2 3 4 5
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DAC703
16-BIT
5M111
DAC703
MIL-STD-883,
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1NA110
Abstract: marking 1be INA110AD AZK734 INA110 1na1 OA 95
Text: DIE PRODUCTS INA110 DIE BURR-BROWN* 1 Fast-Settling FET-lnput Very-High Accuracy INSTRUMENTATION AMPLIFIER DIE FEATURES APPLICATIONS • • • • • FAST SCANNING RATE MULTIPLEXED INPUT DATA ACQUISITION SYSTEM AMPLIFIER • FAST DIFFERENTIAL PULSE AMPLIFIER
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INA110
INA110
M1L-STD-883,
MIL-STD-883,
1NA110
marking 1be
INA110AD
AZK734
1na1
OA 95
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transistor B 1184
Abstract: No abstract text available
Text: SIPMOS Chip-Produkte/SIPMOS Die Products SIPMOS Power Transistor Dice Die type Recommended source bond wire diameter1 urn Die topology Page 1.500 0.600 SIPC08P20 SIPC08P10 250 250 - 50 0.030 0.035 0.055 0.055 0.070 0.070 0.100 0.100 SIPC20AN05 SIPC20AN05L
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SIPC08P20
SIPC08P10
SIPC20AN05
SIPC20AN05L
SIPC14AN05
SIPC14AN05L
SIPC08AN05
SIPC08AN05L
SIPC06AN05
SIPC06AN05L
transistor B 1184
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MPY534
Abstract: Sd 602
Text: BURR-BROÜJN CORP h e d 17313b5 I 0 0 1 S S 27 - :-:- 4 ~T L ' T ï n T R? .r°V T | -7LPI DIE PRODUCTS - MPY534 DIE l,= B i Precision ANALOG MULTIPLIER DIE DESCRIPTION
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17313b5
MPY534
MPY534J,
500mW
-659C
MPY534S,
MPY534K.
MPY534*
Sd 602
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