burndy connector
Abstract: burndy cwe3 X24C00 eeprom 256kb DH23 Nippon capacitors
Text: MOTOROLA Order this document by MPC2104/D SEMICONDUCTOR TECHNICAL DATA Advance Information 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms MPC2104 MPC2105 MPC2106 MPC2107 The MPC2104/5/6/7 are designed to provide burstable, high performance L2
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MPC2104/D
256KB
512KB
MPC2104
MPC2105
MPC2106
MPC2107
MPC2104/5/6/7
MPC2104,
MPC2105,
burndy connector
burndy
cwe3
X24C00
eeprom 256kb
DH23
Nippon capacitors
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DH23
Abstract: dh14 71V432 DH15 IDT7MPV6253 "32K x 32" SRAM burndy terminal module block DH0 165 32k sram 20 pin card
Text: 256KB AND 512KB SECONDARY CACHE MODULES FOR THE PowerPC IDT7MPV6253 IDT7MPV6255/56 Integrated Device Technology, Inc. x 8 asynchronous static RAMs and the IDT7MPV6255/56 use IDT’s 71V432 32K x 32 pipelined synchronous burst static RAMs in plastic surface mount packages mounted on a
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IDT7MPV6253
IDT7MPV6255/56
IDT7MPV6255/56
71V432
IDT7MPV6256
7MPV6253
7MPV6255
DH23
dh14
DH15
IDT7MPV6253
"32K x 32" SRAM
burndy terminal module block
DH0 165
32k sram 20 pin card
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TAG 86
Abstract: TAG 88 BA28 DH17 tag11 TAG 36 DH16 MPC2105C MPC2106C Q1 burndy corp
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms The MPC2105C and the MPC2106C are designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance
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MPC2105C
MPC2106C
MPC2106C
MPC2105C/D
TAG 86
TAG 88
BA28
DH17
tag11
TAG 36
DH16
Q1 burndy corp
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TAG 106 D
Abstract: TAG 36 BA28 DH16 MPC2105B MPC2106B dh25 Nippon capacitors DP484
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms The MPC2105B and the MPC2106B are designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance
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MPC2105B
MPC2106B
MPC2106B
TAG 106 D
TAG 36
BA28
DH16
dh25
Nippon capacitors
DP484
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burndy connector
Abstract: 16K RAM Dh16 MPC2105A MPC2105B MPC2106A Nippon capacitors
Text: MOTOROLA Order this document by MPC2105A/D SEMICONDUCTOR TECHNICAL DATA 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms The MPC2105A/B and the MPC2106A/B are designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance
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MPC2105A/D
512KB
MPC2105A/B
MPC2106A/B
MPC2105A
MPC2106A
burndy connector
16K RAM
Dh16
MPC2105B
Nippon capacitors
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dh03
Abstract: dh28 dh29 dh14 dh25 SRAM 10ns IDT7MPV6356
Text: 256KB, 512KB SECONDARY CACHE MODULES WITH PARITY FOR THE PowerPC PRELIMINARY IDT7MPV6355 IDT7MPV6356 Integrated Device Technology, Inc. FEATURES DESCRIPTION • Ideal for CHRP based PowerPC systems. • 256KB, 512KB Flow Through Burst SRAM options in the
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512KB
IDT7MPV6355
IDT7MPV6356
ELF178KSC-3Z50
IDT7MPV6355/56
IDT7MPV6355/56
256KB/512KB
dh03
dh28
dh29
dh14
dh25
SRAM 10ns
IDT7MPV6356
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Untitled
Abstract: No abstract text available
Text: PDM4M6110/4M6111/4M6112 PDM4M6110 Preliminary PDM4M6111 PDM4M6112 256KB and 512KB Second Cache Modules for the PowerPC Features Description • 256KB asynchronous and 256KB/512KB pipelined cache modules. ■ Ideal for use with PowerPC based systems. ■ Separate 5V and 3.3V power supplies.
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PDM4M6110/4M6111/4M6112
PDM4M6110
PDM4M6111
PDM4M6112
256KB
512KB
256KB/512KB
178-pin
ELF182JSC-3Z50
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JTSPC603E
Abstract: THOMSON-CSF PRODUCTS ABB A29 30 10
Text: JTSPC603e PowerPC 603e MICROPROCESSOR DICE PID6-603e Specification DESCRIPTION The PID6-603e implementation of PC603e after named 603e is a low-power implementation of reduced instruction set computer (RISC) microprocessors PowerPC family. The 603e
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JTSPC603e
603eTM
PID6-603e
PC603e
32-bit
JTSPC603E
THOMSON-CSF PRODUCTS
ABB A29 30 10
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dh03
Abstract: DH07 DH09 AB-04 MDATA62 dh23 AD-05 T14 N03 w04 68 mark w06
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz. • 83.33 MHz. • Synchronous DRAM interface operates at the processor bus speed with support for ECC.
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CPC700
60x/7xx
32-bit
25MHz
dh03
DH07
DH09
AB-04
MDATA62
dh23
AD-05
T14 N03
w04 68
mark w06
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DH-04
Abstract: No abstract text available
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3B66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the
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CPC700
60x/7xx
IBM25CPC700BB3B66)
IBM25CPC700BB3B83)
32-bit
25MHz
DH-04
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h25k5
Abstract: l2a3 RN15G RN14K L2A8 74LCX125DT l2a4 l2a10 L2D14 L2D51
Text: Freescale Semiconductor Application Note Document Number: AN2347 Rev. 1, 11/2006 Using an MPC8260 and an MPC7410 with Shared Memory by Dave McCartney NCSG Applications Freescale Semiconductor, Inc. East Kilbride, Scotland The MPC8260 PowerQUICC II is a versatile
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AN2347
MPC8260
MPC7410
MPC603e
h25k5
l2a3
RN15G
RN14K
L2A8
74LCX125DT
l2a4
l2a10
L2D14
L2D51
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L2A8
Abstract: dh29 code dh28 code RN10B CI 6268 logic diagram of ic 7475 DH27 h25k5 L2A1 P18CA
Text: Freescale Semiconductor, Inc. Application Note AN2347/D Rev. 0, 9/2002 Freescale Semiconductor, Inc. Using an MPC8260 and an MPC7410 with Shared Memory Dave McCartney NCSG Applications East Kilbride, Scotland The MPC8260 PowerQUICC II is a versatile communications processor that integrates on
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AN2347/D
MPC8260
MPC7410
MPC8260
MPC603eTM
L2A8
dh29 code
dh28 code
RN10B
CI 6268
logic diagram of ic 7475
DH27
h25k5
L2A1
P18CA
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b09 n03
Abstract: MDATA62 DH03 DH-04 aa09
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3B66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the
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CPC700
60x/7xx
IBM25CPC700BB3B66)
IBM25CPC700BB3B83)
32-bit
25MHz
b09 n03
MDATA62
DH03
DH-04
aa09
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IBM25CPC700BB3A661
Abstract: DH19 IBM25CPC700BB3A66 45L7531 marking AE02 MARKING CODE DH09 45L7530 CPC700 marking dh10 A31 H07
Text: . CPC700 Memory Controller and PCI Bridge Features • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3A66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the processor bus speed with support for ECC. • PCI Revision 2.1 Compliant Interface.
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CPC700
60x/7xx
IBM25CPC700BB3A66)
IBM25CPC700BB3B83)
32-bit
25MHz
IBM25CPC700BB3A661
DH19
IBM25CPC700BB3A66
45L7531
marking AE02
MARKING CODE DH09
45L7530
marking dh10
A31 H07
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AA09
Abstract: AA07 t04 68 3 pin controller IBM25CPC700CB3B66 DH06 A09 N03 CPC700 IBM25CPC700BB3B66 IBM25CPC700BB3B83 DH07
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3B66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the
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CPC700
60x/7xx
IBM25CPC700BB3B66)
IBM25CPC700BB3B83)
CPC700
AA09
AA07
t04 68 3 pin controller
IBM25CPC700CB3B66
DH06
A09 N03
IBM25CPC700BB3B66
IBM25CPC700BB3B83
DH07
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IBM25CPC700DB3A83
Abstract: DH27 DH06 DH07 IBM25CPC700DB3A83Z ae02 marking dh03 marking CODE W04 ae09 MARKING CODE k07
Text: . CPC700 Memory Controller and PCI Bridge Features • PowerPC 60x/7xx bus. • 66.66 MHz • 83.33 MHz • Synchronous DRAM interface operates at the processor bus speed with support for ECC. • PCI Revision 2.1 Compliant Interface. • ROM/SRAM/External peripheral controller.
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CPC700
60x/7xx
32-bit
25MHz
CPC700
IBM25CPC700DB3A83
DH27
DH06
DH07
IBM25CPC700DB3A83Z
ae02 marking
dh03
marking CODE W04
ae09
MARKING CODE k07
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CERAMIC QUAD FLATPACK CQFP
Abstract: BGA PACKAGE thermal resistance P603E DL10 DL12 WMC64P603EV-XQ3M DH0-31 P603
Text: WMC64P603EV-XQ3M RISC 603e MONOLITHIC MICROPROCESSOR PRELIMINARY* FEATURES • Processor Clock Frequencies of 80MHz and 100MHz • 16KByte data cache–four-way set-associative, physically addressed; Least Recently Used LRU replacement algorithm ■ Military Operating Temperature Range
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WMC64P603EV-XQ3M
80MHz
100MHz
16KByte
P603E
CERAMIC QUAD FLATPACK CQFP
BGA PACKAGE thermal resistance
DL10
DL12
WMC64P603EV-XQ3M
DH0-31
P603
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Nippon capacitors
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview Order this docum ent by MPC2104P/D MPC2104P 256KB BurstRAM Secondary Cache Modules for PowerPC™ PReP/CHRP Platforms The MPC2104P is designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance with the PowerPC
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MPC2104P/D
MPC2104P
256KB
MPC2104P
1ATX35434-0
Nippon capacitors
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Nippon capacitors
Abstract: No abstract text available
Text: MOTOROLA Order this document by MPC2105A/D SEMICONDUCTOR TECHNICAL DATA 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC™ PReP/CHRP Platforms MPC2105A MPC2106A The MPC2105A and the MPC2106A are designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance
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MPC2105A/D
512KB
MPC2105A
MPC2106A
1ATX35334-0
Nippon capacitors
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Untitled
Abstract: No abstract text available
Text: 256KB, 512KB SECONDARY CACHE MODULES WITH PARITY FOR THE PowerPC PRELIMINARY IDT7MPV6355 IDT7MPV6356 Integ-ated Device Technology, Inc. FEATURES DESCRIPTION • Ideal for CHRP based PowerPC systems. The IDT7MPV6355/56 modules belong to a fam ily of sec ondary caches intended for use with PowerPC CPU-based
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256KB,
512KB
IDT7MPV6355
IDT7MPV6356
ELF178KSC-3Z50
IDT7MPV6355/56
|
32k sram 20 pin card
Abstract: H30P
Text: 256KB AND 512KB SECONDARY CACHE MODULES FOR THE PowerPC IDT7MPV6253 IDT7M PV6255/56 In t e g r a t e d D e v iz e T e c h n o lo g y , l i e . FEATURES x 8 asynchronous static RAMs and the IDT7MPV6255/56 use IDT’s 71V432 32K x 32 pipelined synchronous burst static
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256KB
512KB
IDT7MPV6253
PV6255/56
ELF182KSC-3Z50
66MHz
IDT7MPV6255/56
71V432
32Kl311VIOH3IAIIAIOO
PV6253/55/56
32k sram 20 pin card
H30P
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Untitled
Abstract: No abstract text available
Text: IBM14P3264 IBM14P6464 High Perform ance SRAM Modules Features • 256KB and 512KB secondary cache module family for PowerPC PReP/CHRP platforms • Organized as a 32K or 64Kx 64 package on a 5.06” x 1.10”, 182-lead, Dual Read-out DIMM • Available in asynchronous SRAMs
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IBM14P3264
IBM14P6464
256KB
512KB
182-lead,
ELF182JSC-3Z50
32KX8
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EM80 MICrophone
Abstract: EM80 MIC PRIMO em80 dynamic microphone em80 em80 microphone data sheet PRIMO MICROPHONES MIC IN4004 2N3906 2N5401
Text: Data Sheet Low Voltage Speech Circuit The PBL 3781 is a bipolar integrated speech circuit for use in electronic telephones. The circuit is designed to operate at low supply voltages, down to 1.3 V, making it usable when con nected in parallel with other tele
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PBL3781
S-163
EM80 MICrophone
EM80 MIC
PRIMO em80
dynamic microphone
em80
em80 microphone data sheet
PRIMO MICROPHONES
MIC IN4004
2N3906
2N5401
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MIC IN4004
Abstract: No abstract text available
Text: integrated circuits PBL 3781 Data Sheet Low Voltage Speech Circuit The PBL 3781 is a bipolar integrated speech circuit for use in electronic telephones. The circuit is designed to operate at low supply voltages, down to 1.3 V, making it usable when con nected in parallel with other tele
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S-163
MIC IN4004
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