DH11
Abstract: DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29
Text: OFFICIAL - 9/17/97 CBGA Footprints Rev. F 603 Family CBGA C16 E04 D13 F02 D14 G01 D15 E02 D16 D04 E13 G02 E15 H01 E16 H02 F13 J01 F14 J02 F15 H03 F16 F04 G13 K01 G15 K02 H16 M01 J15 P01 L02 K04 C01 B04 B03 B02 A04 B07 J04 A10 L01 B06 E01 D08 A06 D07 B01 B05
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604ev
603ev.
604ev.
604ev
DH11
DH21
DH23
b09 n03
DH19
dh17
A09 N03
Dh14
dh28
Dh29
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dh23
Abstract: DH0 165 dh15 F04 MOTOROLA MPC2006 dh14 TAG 93 motorola f04 Nippon capacitors burndy baa
Text: MOTOROLA Order this document by MPC2004/D SEMICONDUCTOR TECHNICAL DATA Advance Information 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms MPC2004 MPC2005 The MPC2004 and MPC2005 are designed to provide burstable, high performance 256KB/512KB L2 cache for the PowerPC 60x microprocessor family in
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MPC2004/D
256KB
512KB
MPC2004
MPC2005
MPC2004
MPC2005
256KB/512KB
dh23
DH0 165
dh15
F04 MOTOROLA
MPC2006
dh14
TAG 93
motorola f04
Nippon capacitors
burndy baa
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Untitled
Abstract: No abstract text available
Text: PDM4M6110/4M6111/4M6112 PDM4M6110 Preliminary PDM4M6111 PDM4M6112 256KB and 512KB Second Cache Modules for the PowerPC Features Description • 256KB asynchronous and 256KB/512KB pipelined cache modules. ■ Ideal for use with PowerPC based systems. ■ Separate 5V and 3.3V power supplies.
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PDM4M6110/4M6111/4M6112
PDM4M6110
PDM4M6111
PDM4M6112
256KB
512KB
256KB/512KB
178-pin
ELF182JSC-3Z50
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JTSPC603E
Abstract: THOMSON-CSF PRODUCTS ABB A29 30 10
Text: JTSPC603e PowerPC 603e MICROPROCESSOR DICE PID6-603e Specification DESCRIPTION The PID6-603e implementation of PC603e after named 603e is a low-power implementation of reduced instruction set computer (RISC) microprocessors PowerPC family. The 603e
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JTSPC603e
603eTM
PID6-603e
PC603e
32-bit
JTSPC603E
THOMSON-CSF PRODUCTS
ABB A29 30 10
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dh28 560
Abstract: A09 N03 10C6 Diode cheetah dh28 DH07 11B8 DL03 5d7 switching regulator OVDD14
Text: 8 7 6 5 4 3 2 1 CHEETAH4.0 CPU D D CARD SCHEMATICS C C 1/15/98 B B THIS DOCUMENT CONTAINS PRELIMINARY INFORMATION AND IS SUBJECT TO CHANGE BY IBM WITHOUT NOTICE. IBM ASSUMES NO RESPONSIBILITY OF LIABIALITY FOR ANY USE OF THE INFORMATION CONTAINED HEREIN. NOTHING IN THIS DOCUMENT SHALL
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1-800-IBM-0181
CONNTEST14
15JAN98
dh28 560
A09 N03
10C6 Diode
cheetah
dh28
DH07
11B8
DL03
5d7 switching regulator
OVDD14
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dh03
Abstract: DH07 DH09 AB-04 MDATA62 dh23 AD-05 T14 N03 w04 68 mark w06
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz. • 83.33 MHz. • Synchronous DRAM interface operates at the processor bus speed with support for ECC.
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CPC700
60x/7xx
32-bit
25MHz
dh03
DH07
DH09
AB-04
MDATA62
dh23
AD-05
T14 N03
w04 68
mark w06
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DH-04
Abstract: No abstract text available
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3B66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the
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CPC700
60x/7xx
IBM25CPC700BB3B66)
IBM25CPC700BB3B83)
32-bit
25MHz
DH-04
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h25k5
Abstract: l2a3 RN15G RN14K L2A8 74LCX125DT l2a4 l2a10 L2D14 L2D51
Text: Freescale Semiconductor Application Note Document Number: AN2347 Rev. 1, 11/2006 Using an MPC8260 and an MPC7410 with Shared Memory by Dave McCartney NCSG Applications Freescale Semiconductor, Inc. East Kilbride, Scotland The MPC8260 PowerQUICC II is a versatile
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AN2347
MPC8260
MPC7410
MPC603e
h25k5
l2a3
RN15G
RN14K
L2A8
74LCX125DT
l2a4
l2a10
L2D14
L2D51
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L2A8
Abstract: dh29 code dh28 code RN10B CI 6268 logic diagram of ic 7475 DH27 h25k5 L2A1 P18CA
Text: Freescale Semiconductor, Inc. Application Note AN2347/D Rev. 0, 9/2002 Freescale Semiconductor, Inc. Using an MPC8260 and an MPC7410 with Shared Memory Dave McCartney NCSG Applications East Kilbride, Scotland The MPC8260 PowerQUICC II is a versatile communications processor that integrates on
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AN2347/D
MPC8260
MPC7410
MPC8260
MPC603eTM
L2A8
dh29 code
dh28 code
RN10B
CI 6268
logic diagram of ic 7475
DH27
h25k5
L2A1
P18CA
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5a2 zener diode
Abstract: ZENER 1B9 zener 5c2 zener DIODE 5c2 4c2 zener diode Zener Diode 1B9 2b9 zener diode 6c3 zener diode 4b2 zener diode RISCwatch 13h6422
Text: Application Note PowerPC Embedded Processors Design and Debug Considerations: PowerPC 750CX, 750CXe, and 750L Abstract - This application note discusses the use of certain reference designs and JTAG debugger probes with PowerPC 750CX/CXe processors and
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750CX,
750CXe,
750CX/CXe
PPC750
5a2 zener diode
ZENER 1B9
zener 5c2
zener DIODE 5c2
4c2 zener diode
Zener Diode 1B9
2b9 zener diode
6c3 zener diode
4b2 zener diode
RISCwatch 13h6422
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b09 n03
Abstract: MDATA62 DH03 DH-04 aa09
Text: . CPC700 Memory Controller and PCI Bridge Features map essential to making it appear like a device but does not preclude it from being a host. • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3B66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the
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CPC700
60x/7xx
IBM25CPC700BB3B66)
IBM25CPC700BB3B83)
32-bit
25MHz
b09 n03
MDATA62
DH03
DH-04
aa09
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IBM25CPC700BB3A661
Abstract: DH19 IBM25CPC700BB3A66 45L7531 marking AE02 MARKING CODE DH09 45L7530 CPC700 marking dh10 A31 H07
Text: . CPC700 Memory Controller and PCI Bridge Features • PowerPC 60x/7xx bus. • 66.66 MHz IBM25CPC700BB3A66 . • 83.33 MHz (IBM25CPC700BB3B83). • Synchronous DRAM interface operates at the processor bus speed with support for ECC. • PCI Revision 2.1 Compliant Interface.
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CPC700
60x/7xx
IBM25CPC700BB3A66)
IBM25CPC700BB3B83)
32-bit
25MHz
IBM25CPC700BB3A661
DH19
IBM25CPC700BB3A66
45L7531
marking AE02
MARKING CODE DH09
45L7530
marking dh10
A31 H07
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emcp 162
Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Text: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz
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WC64P603EV-XQ3X
32-bit
Bus/64-bit
16KByte
512KByte
64Kx72)
Packaging240
P603E
240-Pin
emcp 162
DL10
DL12
emcp
TEA 2111
WT111
eMCP qualification
dh29 code
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IBM25CPC700DB3A83
Abstract: ae02 marking DH06 marking CODE W04 CPC700 DH02 IBM25CPC700DB3A83Z dh03 dh04 DL05
Text: . CPC700 Memory Controller and PCI Bridge Features • PowerPC 60x/7xx bus. • 66.66 MHz • 83.33 MHz • Synchronous DRAM interface operates at the processor bus speed with support for ECC. • PCI Revision 2.1 Compliant Interface. • Supports independent primary and secondary
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CPC700
60x/7xx
CPC700
IBM25CPC700DB3A83
ae02 marking
DH06
marking CODE W04
DH02
IBM25CPC700DB3A83Z
dh03
dh04
DL05
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IBM25CPC700DB3A83
Abstract: DH27 DH06 DH07 IBM25CPC700DB3A83Z ae02 marking dh03 marking CODE W04 ae09 MARKING CODE k07
Text: . CPC700 Memory Controller and PCI Bridge Features • PowerPC 60x/7xx bus. • 66.66 MHz • 83.33 MHz • Synchronous DRAM interface operates at the processor bus speed with support for ECC. • PCI Revision 2.1 Compliant Interface. • ROM/SRAM/External peripheral controller.
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CPC700
60x/7xx
32-bit
25MHz
CPC700
IBM25CPC700DB3A83
DH27
DH06
DH07
IBM25CPC700DB3A83Z
ae02 marking
dh03
marking CODE W04
ae09
MARKING CODE k07
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5c2 zener diode
Abstract: zener 5c2 zener 11B2 zener DIODE 5c2 zener 1B9 6c3 zener diode ZENER A24 zener 2B1 zener 2B6 4c2 zener diode
Text: Application Note PowerPC Embedded Processors Design and Debug Considerations: PowerPC 750CX, 750CXe, and 750L Abstract - This application note discusses the use of certain reference designs and JTAG debugger probes with PowerPC 750CX/CXe processors and
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750CX,
750CXe,
750CX/CXe
750CXe_
PPC750
5c2 zener diode
zener 5c2
zener 11B2
zener DIODE 5c2
zener 1B9
6c3 zener diode
ZENER A24
zener 2B1
zener 2B6
4c2 zener diode
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CERAMIC QUAD FLATPACK CQFP
Abstract: BGA PACKAGE thermal resistance P603E DL10 DL12 WMC64P603EV-XQ3M DH0-31 P603
Text: WMC64P603EV-XQ3M RISC 603e MONOLITHIC MICROPROCESSOR PRELIMINARY* FEATURES • Processor Clock Frequencies of 80MHz and 100MHz • 16KByte data cache–four-way set-associative, physically addressed; Least Recently Used LRU replacement algorithm ■ Military Operating Temperature Range
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WMC64P603EV-XQ3M
80MHz
100MHz
16KByte
P603E
CERAMIC QUAD FLATPACK CQFP
BGA PACKAGE thermal resistance
DL10
DL12
WMC64P603EV-XQ3M
DH0-31
P603
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ABB A29 30 10
Abstract: DL10 DL12 dh23 CQFP 172 PIN
Text: WMC64P603P-200Q3M RISC 603e MONOLITHIC MICROPROCESSOR PRELIMINARY* FEATURES • Processor Clock Frequency of 200MHz • 16KByte data cache–four-way set-associative, physically addressed; Least Recently Used LRU replacement algorithm ■ Military Operating Temperature Range
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WMC64P603P-200Q3M
200MHz
16KByte
P603E
ABB A29 30 10
DL10
DL12
dh23
CQFP 172 PIN
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MDH2B
Abstract: AI561 ru52 5E25 AA13AB DH21 AD AE1B MDH24 DH23 dh25
Text: M6 MDH0 Ld MDH1 k§ MDH2 K2 MDH3 K5 mdhî u j 1 1 C A S -U U M 1 Z S \2 C A S -D Ü N E fC 2 C A S .U U M b f§3 C A S .D U ffi rÄ 1 0 C A S -D Ü N 3 r Ä ii C A S -D U N 2 - 'd i CAS_D üm C A S -D Ü M D MDH5 Jd MDH6 J6 MDH7 dd H5 MDH8 R A S _ U S /K § 11
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MDH10
MDH11
MDH12
MDH13
MDH16
MDH17
MDH18
MDH19
MDH20
MDH21
MDH2B
AI561
ru52
5E25
AA13AB
DH21 AD
AE1B
MDH24
DH23
dh25
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PDF
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DH21
Abstract: TAG 136 A TAG 106 D MOTOROLA PC2004
Text: M O TO RO LA SEMICONDUCTOR TECHNICAL DATA Advance Information 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC™ PReP/CHRP Platforms MPC2004 MPC2005 The M PC 2004 and M P C 2005 are designed to provide burstable, high perfor mance 256KB/512KB L2 cache for the PowerPC 60x microprocessor family in
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256KB
512KB
256KB/512KB
PC2004»
MPC2005
MPC2004
DH21
TAG 136 A
TAG 106 D
MOTOROLA PC2004
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Untitled
Abstract: No abstract text available
Text: Parad igm ' PDM4M6110 PDM4M6111 PDM4M6112 Preliminary 256KB and 512KB Second Cache Modules for the PowerPC Features □ □ □ □ □ □ □ □ Description 256KB asynchronous and 256KB/512KB pipelined cache modules. Ideal for use with PowerPC based systems.
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PDM4M6110
PDM4M6111
PDM4M6112
256KB
512KB
256KB/512KB
178-pin
ELF182JSC-3Z50
PDM4M6110)
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PDF
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32k sram 20 pin card
Abstract: H30P
Text: 256KB AND 512KB SECONDARY CACHE MODULES FOR THE PowerPC IDT7MPV6253 IDT7M PV6255/56 In t e g r a t e d D e v iz e T e c h n o lo g y , l i e . FEATURES x 8 asynchronous static RAMs and the IDT7MPV6255/56 use IDT’s 71V432 32K x 32 pipelined synchronous burst static
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OCR Scan
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256KB
512KB
IDT7MPV6253
PV6255/56
ELF182KSC-3Z50
66MHz
IDT7MPV6255/56
71V432
32Kl311VIOH3IAIIAIOO
PV6253/55/56
32k sram 20 pin card
H30P
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Untitled
Abstract: No abstract text available
Text: IBM14P3264 IBM14P6464 High Perform ance SRAM Modules Features • 256KB and 512KB secondary cache module family for PowerPC PReP/CHRP platforms • Organized as a 32K or 64Kx 64 package on a 5.06” x 1.10”, 182-lead, Dual Read-out DIMM • Available in asynchronous SRAMs
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IBM14P3264
IBM14P6464
256KB
512KB
182-lead,
ELF182JSC-3Z50
32KX8
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twe 87
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview 512KB BurstRAM Secondary Cache Module for PowerPC™ PReP/CHRP Platforms MPC2105P 178-LEAD CARD EDGE TOP VIEW CASE TBD The MPC2105P 512KB is designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance with the
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OCR Scan
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MPC2105P
178-LEAD
512KB
512KB)
MPC2105P
MPC2105P,
2105P
twe 87
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