silica gel
Abstract: polyethylene film
Text: Issued March 1997 232-6168 Data Pack K Silica gel desiccant Data Sheet RS stock numbers 601-041, 601-057, 601-063 RS silica gel dessicant is a 99.0% pure amorphous silica in the form of hard irregular shaped crystals. The material is designed to adsorb moisture from air,
|
Original
|
PDF
|
BS2540
silica gel
polyethylene film
|
PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
|
Original
|
PDF
|
|
camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
|
Original
|
PDF
|
|
murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION U SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC
|
Original
|
PDF
|
QM2A1UB029
QM2A1UB029/EL/
murata REEL label lot number
|
Untitled
Abstract: No abstract text available
Text: PREPARED BY: Reference DATE SPEC NO. FILE No. CHECKED BY: ELECTRONIC COMPOMENTS DATE AND DEVICES GROUP APPROVED BY: ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION DATE SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC
|
Original
|
PDF
|
QM2A1UB032A
QM2A1UB032A/EL/
|
murata REEL label lot number
Abstract: No abstract text available
Text: Reference PREPARED BY: SPEC NO. DATE FILE No. CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC
|
Original
|
PDF
|
QM2A1UB033A
QM2A1UB033A/EL/
murata REEL label lot number
|
murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE Reference SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC
|
Original
|
PDF
|
QM2A1UB028
QM2A1UB028/EL/
murata REEL label lot number
|
MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
|
Original
|
PDF
|
|
EGL210-J1-J3
Abstract: step down transformer EMP009-J1-LED egl 20109-b EMP009-J3-LED EGL210 EGL210-R1 resistance grounding desiccant powder class 1 div 2 relay
Text: EGL Static Grounding Indicator With Automated Pump Control and Static Ground Verification System Cl. I, Div. 1 & 2, Groups B, C, D Cl. I, Zone 1 & 2 IIB + H2 Cl. II, Div. 1, Groups E, F, G Cl. II, Div. 2, Groups F, G Cl. III UL/cUL Listed NEMA 3, 4X, 7BCD, 9FG, 12
|
Original
|
PDF
|
120-volt
277VAC;
600VAC
EGL210-J1-J3
step down transformer
EMP009-J1-LED
egl 20109-b
EMP009-J3-LED
EGL210
EGL210-R1
resistance grounding
desiccant powder
class 1 div 2 relay
|
NC-SMQ230
Abstract: tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste tamura solder paste PROFILE 97SC soft solder dispensing
Text: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents Moisture Barrier Envelope Packaging • • • • • • • The optical grade materials used in SMT LED components absorb moisture directly from the air. Moisture absorbed in SMT LED components that have been reflow soldered
|
Original
|
PDF
|
5989-2268EN
AV01-0654EN
NC-SMQ230
tamura rma
tamura solder paste rma
tamura solder paste
tamura solder paste rma-10-61a
JEDEC SMT reflow profile
VISCOSITY tamura solder paste
tamura solder paste PROFILE
97SC
soft solder dispensing
|
strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
|
Original
|
PDF
|
|
SPRU811
Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
|
Original
|
PDF
|
SPRU811A
SPRU811
SPRU811
BGA reflow guide
ionograph
ionograph spec
SZZA021B
bga dye pry
EndoScope
schematic endoscope
case to board
cte table flip chip substrate
|
desiccant powder
Abstract: WI-E-045
Text: SPECIFICATIONS FOR REFOND SURFACE MOUNT LED MODEL : RF-WTFA50DS-SIA Company Name: Confirmed By Customer: DATE: REFOND WI-E-045 <Cat.No.:731001> Package outlines [3] [5] [5] [3] [1] [2] [4] [6] [6] [4] [2] 1 3 5 2 4 6 MATERIALS Lens color Yellow Resin Dice
|
Original
|
PDF
|
RF-WTFA50DS-SIA
WI--E--045
012inch)
000pcs)
250mm
360mm
265mm
255mm)
desiccant powder
WI-E-045
|
A22 SMD CODE
Abstract: No abstract text available
Text: A22 0.5W Series Features Applications Moisture Sensitivity Level: 3 High Wattage Replacement Bulb Main Parameters: Luminous Flux, Down Light Forward Voltage , Chromaticity and Recessed Can Light Color Rendering Index Low/High Bay Light
|
Original
|
PDF
|
DHE-0001807
EHP-A22/
DHE-0001807
A22 SMD CODE
|
|
|
daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
|
Original
|
PDF
|
AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
|
A22 SMD CODE
Abstract: No abstract text available
Text: A22 1W/5S Series Features Applications Multi-Chip PLCC Solution High Wattage Replacement Bulb Moisture Sensitivity Level: 3 Down Light Main Parameters: Luminous Flux, Recessed Can Light Forward Voltage , Chromaticity and Low/High Bay Light
|
Original
|
PDF
|
DHE-0001811
EHP-A22/
DHE-0001811
EHP-A22/KT35H-P01/57K/K53/TR
A22 SMD CODE
|
Untitled
Abstract: No abstract text available
Text: A22 0.5W Series Features Applications Moisture Sensitivity Level: 3 High Wattage Replacement Bulb Main Parameters: Luminous Flux, Down Light Forward Voltage , Chromaticity and Recessed Can Light Color Rendering Index Low/High Bay Light
|
Original
|
PDF
|
DHE-0001807
|
Untitled
Abstract: No abstract text available
Text: A22 1W/5S Series Features Applications Multi-Chip PLCC Solution High Wattage Replacement Bulb Moisture Sensitivity Level: 3 Down Light Main Parameters: Luminous Flux, Recessed Can Light Forward Voltage , Chromaticity and Low/High Bay Light
|
Original
|
PDF
|
DHE-0001811
Peri-18
EHP-A22/KT35H-P01/57K/K53/TR
|
HSMX-T400
Abstract: 3M Touch Systems HP LED handbook FC-53-11
Text: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents • Surface Mount LED Indicators • Standard EIA Tape and Reel Packaging • Moisture Barrier Envelope Packaging • SMT LED Device Lead Material • PC Board Pad Design • Automatic Placement
|
Original
|
PDF
|
HSMX-TX00
EIA-535
5091-6704E
HSMX-T400
3M Touch Systems
HP LED handbook
FC-53-11
|
Untitled
Abstract: No abstract text available
Text: A22 1W/5S Series Features Applications LM-80 Certified High Wattage Replacement Bulb Multi-Chip PLCC Solution Down Light Moisture Sensitivity Level: 3 Recessed Can Light Main Parameters: Luminous Flux, Low/High Bay Light Forward Voltage , Chromaticity and
|
Original
|
PDF
|
LM-80
DHE-0001811
EHP-A22/KT35H-P01/57K/K53/TR
|
cwi 1011
Abstract: 0910037 L5106 4mm banana plug socket B8170 IC 555 conductivity meter velcro straps J5260F Earth connection strip M5 screws working of light sensitive alarm with timer 555
Text: 1031 Technical portal and online community for Design Engineers - www.element-14.com Static Protection & Cleanroom Products Page Cleaning Products . . . . . . . . . . . . . . . . . . . . . . . . . Clothing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
Original
|
PDF
|
element-14
508MM
030-0005F
178MM
O-220
cwi 1011
0910037
L5106
4mm banana plug socket
B8170
IC 555 conductivity meter
velcro straps
J5260F
Earth connection strip M5 screws
working of light sensitive alarm with timer 555
|
SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
|
Original
|
PDF
|
LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
|
SMT LED
Abstract: h730 HSMX-C650
Text: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents • Surface Mount LED Indicators • Standard EIA Tape and Reel Packaging • Moisture Barrier Envelope Packaging • SMT LED Device Lead Material • PC Board Pad Design • Automatic Placement
|
Original
|
PDF
|
5988-7835EN
5988-9462EN
SMT LED
h730
HSMX-C650
|
Untitled
Abstract: No abstract text available
Text: Polymer Guide www.vishay.com Vishay Polytech Guide for Tantalum Solid Electrolyte Chip Capacitors with Polymer Cathode INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary
|
Original
|
PDF
|
27-May-15
|