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    DDR2 SDRAM 208 BGA Search Results

    DDR2 SDRAM 208 BGA Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    CSPT857CNLG Renesas Electronics Corporation 2.5V - 2.6V PLL Differential 1:10 SDRAM Clock Driver Visit Renesas Electronics Corporation
    CSPT857DPAG Renesas Electronics Corporation 2.5V-2.6V Phase Locked Loop Differential 1:10 SDRAM Clock Driver Visit Renesas Electronics Corporation
    CSPU877DBVG Renesas Electronics Corporation 1.8V Phase Locked Loop Differential 1:10 SDRAM Clock Driver Visit Renesas Electronics Corporation

    DDR2 SDRAM 208 BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: MEMORY MODULE DDR2 SDRam 128Mx72-BGA 3D2D8G72UB3369 DDR2 Synchronous Dynamic Ram 8Gbit DDR2 SDRam organized as 128Mx72, based on 128Mx16 MODULE Pin Assignment Top View BGA 208 - (11x19 - Pitch 1.00mm) (TOP VIEW - VIEWED BY TRANSPARENCY) 11 10 9 8 7 6 5 4


    Original     		PDF 128Mx72-BGA 3D2D8G72UB3369 128Mx72, 128Mx16 11x19 128Mx72 MMXX00000000XXX 3DFP-0369-REV

    Untitled

    Abstract: No abstract text available
    Text: MEMORY MODULE DDR2 SDRam 64Mx72-BGA 3D2D4G72UB3416 DDR2 Synchronous Dynamic Ram 4Gbit DDR2 SDRam organized as 64Mx72, based on 64Mx16 MODULE Pin Assignment Top View BGA 208 - (11x19 - Pitch 1.00mm) (TOP VIEW - VIEWED BY TRANSPARENCY) 11 10 9 8 7 6 5 4 3


    Original     		PDF 64Mx72-BGA 3D2D4G72UB3416 64Mx72, 64Mx16 11x19 64Mx72 MMXX00000000XXX 3DFP-0416-REV

    18CO

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch


    Original     		PDF W3H64M64E-XSBX 18CO

    84 FBGA

    Abstract: IPC17 FBGA-84
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 72 • 1.0mm pitch


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBXF W3H64M72E-XSBXF SN63Pb37 SAC305 84 FBGA IPC17 FBGA-84

    CEE 32

    Abstract: W3H32M64E-XSBX
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32

    W3H128M72

    Abstract: W3H128M72E-XSBX W3H128M72E
    Text: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XSBX W3H128M72 W3H128M72E-XSBX W3H128M72E

    W3H128M72E-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W3H128M72E-XSBX PRELIMINARY* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XSBX A0-12 A0-13 W3H128M72E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64EA-XSBX

    84 FBGA

    Abstract: W3H64M72E-XSBX fbga84 ccd400
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ Organized as 64M x 72 • 1.0mm pitch „ Weight: W3H64M72E-XSBX - 2.5 grams typical


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBX 84 FBGA fbga84 ccd400

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB W3H64M72E-XSBXF SN63Pb37 SAC305 256MB"

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64EA-XSBX ADVANCED* 256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64EA-XSBX 256MB 256MB"

    Untitled

    Abstract: No abstract text available
    Text: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  56% space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XSBX W3H128M72E-XNBX

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H64M72E-XSBX 667Mbs

    Untitled

    Abstract: No abstract text available
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs

    W3J128M72G-XPBX

    Abstract: w3j128m72
    Text: W3H32M72E-XSB2X 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  54% I/O reduction vs FPBGA


    Original     		PDF W3H32M72E-XSB2X W3J128M72G-XPBX w3j128m72

    icc20

    Abstract: No abstract text available
    Text: White Electronic Designs W3H128M64E-XSBX ADVANCED* 128M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 Mb/s „ Posted CAS additive latency: 0, 1, 2, 3 or 4 „ Package: „ Write latency = Read latency - 1* tCK • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M64E-XSBX W3H128M64E-XSBX CL4-ICC20 icc20

    W3H32M72E

    Abstract: BA0BA12
    Text: White Electronic Designs W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX 667Mbs 533Mbs) 650ps, -550ps, 500ps. W3H32M72E BA0BA12

    W3H32M72E

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSB2X Preliminary 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSBX * 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX 667Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H128M72E-XNBX ADVANCED* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 Mb/s „ Posted CAS additive latency: 0, 1, 2, 3 or 4 „ Package: „ Write latency = Read latency - 1* tCK • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XNBX