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    BAI 59

    Abstract: plaskon FBGA PACKAGE thermal resistance
    Text: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


    Original     		PDF CY62127VLL-BAI CY62137VLL-BAIB BAI 59 plaskon FBGA PACKAGE thermal resistance

    1024X2048

    Abstract: No abstract text available
    Text: CY62137BV MoBL2 128K x 16 Static RAM Features • Low voltage range: — CY62137BV18: 1.75V−1.95V • Ultra-low active, standby power • Easy memory expansion with CE and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected


    Original     		PDF CY62137BV CY62137BV18: CY62137BV18 CY62137VB 1024X2048