CY27S03A
Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability
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CY7C122
CY27S03A
15JC10
CY7C190
cy7c9101
cy7c122 die
VIC068A user guide
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CY7C9101
Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the
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Untitled
Abstract: No abstract text available
Text: CY2909A CY2911A CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers Features • • • • F a st — C Y 2 9 0 9 A /1 1 A h a s a 4 0 ns m in . c lo c k to o u tp u t c y c le tim e; co m m er cia l — C Y 2 9 0 9 /1 1 h as a 4 0 n s (m in .) c lo c k to o u tp u t c y c le
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CY2909A
CY2911A
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am2911a
Abstract: CY2911APC CY2909
Text: CY2909A CY2911A CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers • Infinitely expandable in 4-bit Incre ments Features • Fast — CY2909A/I1A has a 40-ns min. clock-to-output cycle time (com mercial) — CY2909/11 has a 40-ns (min.) clock-to-output cycle time (m ili
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OCR Scan
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CY2909A
CY2911A
CY2909A/I1A
40-ns
CY2909/11
AM2909A/AM2911A
am2911a
CY2911APC
CY2909
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Untitled
Abstract: No abstract text available
Text: CY2909A CY2911A CYPRESS SEMICONDUCTOR Features • Fast — C Y 2 9 0 9 A /llA h a sa 4 0 -n s min. clock-to-output cycle tíme (com mercial) — CY2909/11 has a 40-ns (min.) clock-to-output cycle tim e (m ili tary! • Low power — I c e (max*) = 70 mA (commercial)
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OCR Scan
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CY2909A
CY2911A
CY2909/11
40-ns
AM2909A/AM2911A
CY2909A
CY2911A
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