CT3725 Search Results

CT3725ALNF

Abstract: 1010715 MIL-STD-454
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE, LEAD FREE ASSEMBLY DWG: 1102074 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3

MIL-STD-454

Abstract: CT3725
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725 DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101214 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4

CT3725TALN

Abstract: 1010125
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725TALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 2900124 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.20:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725TALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 2900124 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.20:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725F DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA, LEAD FREE PLATING ASSEMBLY DWG: 1102084 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3

CT3725S

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725S DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101844 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725 DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101214 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4

Contextual Info: MI DRG. NO. NOTES: POWER DERATING 1 2) 3) 4) CT3725AB5C-33A CT3725AB5C—33 RoHS COMPLIANT EPOXY PROTECTIVE COAT Ag OVERCOAT PLATED THICK FILM RESISTIVE ELEMENT CHIP TERMINATION, HIGH POWER ALN SPECIFICATIONS 50 75 100 125 15 FLANGE TEMPERATURE \ .094 ±.020

Contextual Info: CT3725AB5C-03 AlN Chip Termination 150 Watts CW Power: 50 W ± 5% Resistance: 1.25 :1 VSWR: Frequency Range: DC to 3.5 GHz RoHS Compliant Substrate: AlN a Typical Performance VSWR 1.6 1.5 VSWR 1.4 1.3 1.2 1.1 1 0.0 500 1000 1500 2000 2500 3000 3500 Frequency ( MHz)

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101514 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101514 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE, LEAD FREE ASSEMBLY DWG: 1102074 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725F DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA, LEAD FREE PLATING. ASSEMBLY DWG: 1101854 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3

CT3725S

Abstract: 1010375
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725S DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101844 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4

SC0066M

Abstract: SC0052M SC0051M
Contextual Info: fTTS Teclmohgif Chips - High R eliability Term inations EMC Technology also offers the SC series chip termination with BeO Beryllium Oxide substrates fo r applications with critical reliability requirements. G eneral S pecifications Resistance Values . . . . 50 and 100 Ohms Standard

SC0066M

Contextual Info: Terminations Introduction Features • Nominal Impedance 50 or 100 Ohms • Power Rating 5 to 250 Watts • Frequency Range from DC to 26.5 GHz • Substrates in BeO, AlN or Alumina • Three Package Styles Available Surface Mount, Chip, and Pill • S-parameter Data Available

TF800BB14-061

Abstract: P1999 8051 microwave oven ec 9410 cf K 2676 9343-11R1 TF800BA14-061 2320-1SL 9816SL 9410-3SL-1
Contextual Info: < ] ^  _dZkijho$@e^Wdied^Wibed]X[[dh[Ye]d_p[ZWiW $ J^[jhWZ_j_edYedj_dk[i°

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

CT3523

Contextual Info: H I G H P O W E R C H I P T E R M I N A T I O N S EMC's high power chip terminations are optimized for RF performance. Since most types are printed to value, the variability of capacitive reactance and localized hot spots associated with trimming are eliminated. Reduced lot variation

MTVA0300N07

Abstract: MTVA0300
Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

Contextual Info: TERMINATIONS AND RESISTORS The EMC Difference: ^ EMC'S high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability of capacitive reactance and localized hot spots associated with trimming are eliminated.

trm a55

Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

Contextual Info: ^ EMC'S high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability o f capacitive reactance and localized hot spots associated w ith trimming are eliminated. Reduced lot vanation means your circuit performs so consistently that in most cases no tuning is required.

ina 124

Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Contextual Info: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz