LM740
Abstract: BC05MM
Text: LM740 Bluetooth Multimedia Module Product: LM740 Part No: 740-0411 Datasheet Rev1.0/21-05-12 Class 2 Module with CSR BC05 MM Ext Chip 1 General Description LM LM T T A AVRCP UART A L C CSR B D T PIO T P B M B A DP M A B T F A DP S 2 Features BC MM E HFP H
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LM740
LM740
PIO10
PIO11
PIO12
NC/0603
1uF/0603
10uF/16V/1206
BC05MM
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2450FB15K0008
Abstract: 2450FB15K0008-EB1SMA CSR BC capacitor bc series ic 4001 2450FB15K0008E CSR BC 05
Text: "High Frequency Ceramic Solutions" 2450 MHz Matched Balun-Filter for CSR BC 04/05 Series Chipset P/N 2450FB15K0008 Page 1 of 3 Detail Specification: 1/14/11 General Specifications Part Number 2450FB15K0008 Frequency Range 2400~2500 MHz 30 min.@1710~1880 MHz
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2450FB15K0008
960MHz
5000MHz
7500MHz
2450FB15K0008
2450FB15K0008-EB1SMA
CSR BC
capacitor bc series
ic 4001
2450FB15K0008E
CSR BC 05
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2450FB15K0008
Abstract: johanson antenna
Text: "High Frequency Ceramic Solutions" 2450 MHz Matched Balun-Filter for CSR BC 04/05/06 Series Chipset Detail Specification: P/N 2450FB15K0008 Page 1 of 3 3/6/2012 General Specifications Part Number 2450FB15K0008 Frequency Range 2400~2500 MHz 45 min.@ 880~960MHz
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2450FB15K0008
2450FB15K0008
960MHz
5000MHz
7500MHz
johanson antenna
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CSR BC04
Abstract: BC05 CSR CSR BC05 bc04 csr 2450FB15K0003 Bc-04 BC04 BC05
Text: High Frequency Ceramic Solutions 2.45 GHz, conjugate match for CSR Chipsets BC 04, 05 P/N 2450FB15K0003 Page 1 of 2 Detail Specification: 07/17/09 General Specifications Part Number 2450FB15K0003 Frequency MHz 2400~2500 Unbalanced Impedence 50 Ω Differential Balanced Imp.
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2450FB15K0003
960MHz
1990MHz
5000MHz
20-j50)
7500MHz
CSR BC04
BC05 CSR
CSR BC05
bc04 csr
2450FB15K0003
Bc-04
BC04
BC05
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CSR BC04
Abstract: CSR BC05 bc04 csr BC05 CSR 2450FB15K0003 Bc-04 BC05 BC04
Text: High Frequency Ceramic Solutions 2.45 GHz, conjugate match for CSR Chipsets BC 04, 05 P/N 2450FB15K0003 Page 1 of 2 Detail Specification: 07/02/08 General Specifications Part Number 2450FB15K0003 48 min.@ 880~960MHz Frequency MHz 2400~2500 30 min.@1710~1880 MHz
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2450FB15K0003
960MHz
1990MHz
5000MHz
20-j50)
7500MHz
CSR BC04
CSR BC05
bc04 csr
BC05 CSR
2450FB15K0003
Bc-04
BC05
BC04
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Untitled
Abstract: No abstract text available
Text: LM730 Bluetooth Multimedia Module Product: LM730 Part No: 730-0330 Datasheet Rev1.1/15-05-12 Class 2 Module with CSR BC05 MM Ext Chip 1 General Description LM LM T T A AVRCP UART L C CSR B A D T M B A DP P T PIO B M A B T F A DP S 2 Features 4 S S B S MB R HS
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LM730
LM730
PIO10
PIO11
PIO12
NC/0603
1uF/0603
10uF/16V/1206
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MSM66301
Abstract: MSM66301 NX8 OKI nX-8 MSM66201 OLMS-66K RAS66K msm665x 09F0h nX-8 pcfad
Text: OKI nX-8/500S Core Instruction Manual CMOS 16-bit microcontroller SECOND EDITION ISSUE DATE: JUNE, 1999 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Please make sure before using the product that the information you are referring to is up-to-date.
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nX-8/500S
16-bit
MSM66301
MSM66301 NX8
OKI nX-8
MSM66201
OLMS-66K
RAS66K
msm665x
09F0h
nX-8
pcfad
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PC 1498H
Abstract: 1444H A6779 1484H PAR64 REQ64
Text: DMA Controller Unit 19 This chapter describes the integrated Direct Memory Access DMA Controller Unit. The operation modes, setup, external interface, and implementation of the DMA Controller are detailed in this chapter. 19.1 Overview The DMA Controller provides low-latency, high-throughput data transfer capability. The DMA
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32-bit
64-bit
PC 1498H
1444H
A6779
1484H
PAR64
REQ64
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cpu aeroflex
Abstract: No abstract text available
Text: ACT–F2M32 High Speed 64 Megabit FLASH Multichip Module CIRCUIT TECHNOLOGY Features 4 Low Power 2M x 8 FLASH Die in One MCM Package • Organized as 2M x 32 ■ ● User ■ ■ Industry Standard Pinouts Packaging – Hermetic Ceramic 68 Lead, 1.56" x 1.56" x .140" Low Profile CQFP, Aeroflex
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F2M32
120nS
MIL-STD-883
F2M32-B
cpu aeroflex
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FB2012
Abstract: ACX balun ACX filter ACX band pass ACX Multilayer Chip bluetooth csr BC multilayer GHz
Text: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth
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FB2012
FB20122400
05N2R4C_
E5071B
ACX balun
ACX filter
ACX band pass
ACX Multilayer Chip
bluetooth csr BC
multilayer GHz
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56-PIN
Abstract: LH28F016LL LH28F016SU camera with iCCD matrix BSR10
Text: LH28F016LL FEATURES • User-Configurable x8 or x16 Operation • 3 V Write/Erase Operation 3 V VPP – 2.7 - 3.6 V Write-Erase Operation • 120 ns Maximum Access Time (VCC = 3.0 V) • 150 ns Maximum Access Time (VCC = 2.7 V) • • • • 16M (1M x 16, 2M × 8) Flash Memory
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LH28F016LL
56-PIN
J63428
SMT96120
LH28F016LL
LH28F016SU
camera with iCCD matrix
BSR10
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MSM66301 NX8
Abstract: 09F0h OLMS66K OLMS-66K D16h MAC66K
Text: 1 FJXLNX-8-500S-01 OLMS 66K シリーズ nX-8/500S コア インストラクションマニュアル CMOS 16bit マイクロコントローラ 第 2 版 ’00.10 作成 ご注意 1. 本書に記載された内容は製品改善及び技術改良等により将来予告なしに変更することがあります。したがって、
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FJXLNX-8-500S-01
nX-8/500S
16bit
Copyright2000OKIELECTRICINDUSTRYCO.
MSM66301 NX8
09F0h
OLMS66K
OLMS-66K
D16h
MAC66K
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LH28F008SA
Abstract: LH28F016SA
Text: LH28F016SA 16M 1M x 16/2M × 8 Flash Memory FEATURES DESCRIPTION • User-Selectable 3.3 V or 5 V VCC SHARP’s LH28F016SA 16M Flash Memory is a revolutionary architecture which enables the design of truly mobile, high-performance, personal computing and
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LH28F016SA
16/2M
LH28F016SA
56-Lead,
56-Lead
56-pin
LH28F008SA
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LH28F016SUT-70
Abstract: LH28F008SA LH28F016SU LH28F16SUT-70
Text: LH28F016SU 16M 1M x 16/2M × 8 5 V Single Voltage Flash Memory FEATURES DESCRIPTION • 5 V Write/Erase Operation (5 V VPP) – No Requirement for DC/DC Converter to Write/Erase SHARP’s LH28F016SU 16M Flash Memory is a revolutionary architecture which enables the design of truly
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LH28F016SU
16/2M
LH28F016SU
56-Lead
56-pin
LH28F016SUT-70
LH28F016SUT-70
LH28F008SA
LH28F16SUT-70
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56-PIN
Abstract: LH28F008SA LH28F016SA
Text: LH28F016SA FEATURES • • • • • • • 16M 1M x 16, 2M × 8 Flash Memory 56-PIN TSOP TOP VIEW User-Configurable x8 or x16 Operation User-Selectable 3.3 V or 5 V VCC 3/5 1 56 CE1 2 55 WE 70 ns Maximum Access Time NC 3 54 OE 0.43 MB/sec Write Transfer Rate
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LH28F016SA
56-PIN
LH28F008SA
J63428
SMT96112
LH28F008SA
LH28F016SA
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56-PIN
Abstract: LH28F008SA LH28F016SU
Text: LH28F016SU FEATURES • • • • • • • 16M 1M x 16, 2M × 8 Flash Memory 56-PIN TSOP TOP VIEW User-Configurable x8 or x16 Operation 3/5 1 56 WP CE1 2 55 WE 70 ns Maximum Access Time NC 3 54 OE 0.32 MB/sec Write Transfer Rate A20 4 53 RY/BY A19
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LH28F016SU
56-PIN
J63428
SMT96111
LH28F008SA
LH28F016SU
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56-PIN
Abstract: LH28F008SA LH28F800SU TSOP056-P-1420 LH28F800SUT
Text: LH28F800SU FEATURES • User-Configurable x8 or x16 Operation • User-Selectable 3.3 V or 5 V VCC • 5 V Write/Erase Operations 5 V VPP – No Requirement for DC/DC Converter to Write/Erase • 70 ns Maximum Access Time • Minimum 2.7 V Read capability
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LH28F800SU
LH28F008SA
56-Pin,
J63428
SMT96107
56-PIN
LH28F008SA
LH28F800SU
TSOP056-P-1420
LH28F800SUT
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28F008SA
Abstract: 28F016SA DD28F032SA 29042
Text: DD28F032SA 32-MBIT 2 MBIT X 16 4 MBIT X 8 FlashFile TM MEMORY Y Y Y Y Y Y Y User-Selectable 3 3V or 5V VCC User-Configurable x8 or x16 Operation 70 ns Maximum Access Time 28 6 MB sec Burst Write Transfer Rate 1 Million Typical Erase Cycles per Block 56-Lead 1 2 x 14 x 20 mm Advanced
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DD28F032SA
32-MBIT
56-Lead
28F016SA
DD28F032SA
32-Mbit
28F016SA
28F008SA
29042
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D1553
Abstract: 3100-CC
Text: SHARP LH28F016LLT 16 MBIT 1 MBIT x 16, 2 MBIT x 8 3V SINGLE VOLTAGE FLASH MEMORY FEATURES • 3V Write/Erase Operation (3V Vpp) - 2.7V-3.6V Write»Erase»Read Operation • User-Configurable x8 or x16 Operation • 120 ns Maximum Access Time (Vcc=3.0V) • 150ns Maxumam Access Time (Vcc=2.7V)
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LH28F016LLT
150ns
56-Lead,
LH28F016SU
16-Mbit
LH28F016LLT
001555b
D1553
3100-CC
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tec cf4
Abstract: No abstract text available
Text: I I I I I I I I I I I I I I I I ACT-F2M32 High Speed 64 Megabit FLASH Multichip Module .i.i.i. i. i.i. i. i. i.i.i.i.i.i.i.i.i.i. i. i. i.i. i. ^EROFLEX Features i 4 Low Power 2M x 8 FLASH Die in One MCM
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ACT-F2M32
120nS
Pow85
IL-STD-883
F2M32-B
1/B/97
tec cf4
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Untitled
Abstract: No abstract text available
Text: 16M 1M FEATURES x 16, 2M x 8 Flash Memory 56-PIN TSOP TOP VIEW • User-Configurable x8 or x16 Operation -s 3/5 C 1« 56 □ WP CË, Z 2 55 □ WE • 70 ns Maximum Access Time NCZ 3 54 □ ÔË • 0.32 MB/sec Write Transfer Rate A20 z 4 53 □ RY/BY
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56-PIN
J63428
T96111
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Untitled
Abstract: No abstract text available
Text: SHARP November 1995 r FLASH MEMORY LH28F032SUTD-70 SHARP CORPORATION NOTICE • This publication is the proprietary product of Sharp and is copyrighted, with all rights reserved. Under the copy right taws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or
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LH28F032SUTD-70
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Untitled
Abstract: No abstract text available
Text: June 1997 FLASH MEMORY LH28F016SANS-70 Ver. 1.0 SHARP CORPORATION Engineering Department 2 Rash Memory Development Center Tenri Integrated Circuits 1C Group 1 LH28F016SANS-70 16 Mbit (1 Mbit x 16, 2 Mbit x 8) Flash Memory CONTENTS FEATURES PAGE . 2
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LH28F016SANS-70
LH28Fxxx
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Untitled
Abstract: No abstract text available
Text: SHARP J a n .1998 FLASH MEMORYÌ LH28F016SANS-70 Ver.1.1 V_ J SHARP CORPORATION Flash Memory Engineering Department 2 Memory Engineering Center Tenri Integrated C irc u its Development 1C Group SHARP L HF 1 6 S Z B 1 LH28F016SANS-70 16 Mbit (1 Mbit x 16, 2 Mbit x 8)
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LH28F016SANS-70
LH28F016SANS-70
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