RTAX2000S
Abstract: rtax2000 RTSX32SU-CQ208E RTSX32SU-CQ84E 5962-0422101QXC rtax2000s-cq352e 5962-0422102QXC 5962-0422104QNA rtsx32su apa600-cq208b
Text: DSCC Cross Reference Guide Table 1: Actel Part Numbers to DSCC Drawing Numbers Actel Part Number Devices A1010B A1020B Pin-Package 84-CPGA 84-CPGA 84-CQFP A1240A A1280A 132-CPGA 176-CPGA 172-CQFP A1280XL 176-CPGA 172-CQFP A1425A A1460A A14100A 132-CQFP 207-CPGA
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A1010B
84-CPGA
A1010B-PG84B
5962-9096403MXC
5962-9096403MXA
A1010B-1PG84B
A1020B
5962-9096404MXC
5962-9096404MXA
RTAX2000S
rtax2000
RTSX32SU-CQ208E
RTSX32SU-CQ84E
5962-0422101QXC
rtax2000s-cq352e
5962-0422102QXC
5962-0422104QNA
rtsx32su
apa600-cq208b
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Text: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A
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EL28B
MS101107
EL64A
EL100A
EL116A
EL116B
EL128A
CERAMIC QUAD FLATPACK CQFP
CQFP64
Cqfp128
CQFP
CQFP256
CQFP-128
EL28B
64 ceramic quad flatpack
EL116A
EL132B
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Untitled
Abstract: No abstract text available
Text: data sheet CERAMIC / HERMETIC CQFP Ceramic Quad Flat Pack Package CQFP Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The
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DS806
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RTAX2000S
Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing
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AC274
CQ352
FG484
23x23
FG896
CQ256
RTAX2000S
RTAX2000
2-CQFP
RTAX2000S-CQ352
SK-AX1-CQ352-KITBTM
SK-AX250-CQ352RTFG484S
RTAX2000S-CQ256
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AX2000-CQ256
Abstract: RTAX2000S-CQ352
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing
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AC274
CQ352
FG484
23x23
FG896
CQ256
AX2000-CQ256
RTAX2000S-CQ352
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RTAX2000S
Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Text: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note
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208-Pin
RTAX250S/SL
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
RTAX2000S
RTAX1000S-SL
cga 624
RTAX1000S
RTAX250S
RTAX2000
624 CCGA
SL D8 E26
RTAX4000S
CCGA
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RTAX1000S
Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Text: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5
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208-Pin
RTAX250S
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
IO44NB2F2
RTAX1000S
RTAX2000S
CCGA
CQFP 208
RTAX2000
rtax2000* cqfp
292 CCGA
RTAX-S
624 CCGA
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CERAMIC QUAD FLATPACK CQFP
Abstract: No abstract text available
Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997
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160-pins
160-pin
7C375DT-GAUMB
CERAMIC QUAD FLATPACK CQFP
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PQFP chip size
Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP 240
Text: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most
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GA98111PDF2/99
CERAMIC QUAD FLATPACK CQFP
CQFP 240
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CQFP
Abstract: CQFP 240
Text: White Electronic Designs G2T & G2L PACKAGE COMPARISON Package 509: 68 Lead, Ceramic Quad Flat Pack, CQFP G2T * Package 528: 68 Lead, Ceramic Quad Flat Pack, CQFP (G2L) 25.15 (0.990) ± 0.25 (0.010) MAX 5.10 (0.200) MAX 22.36 (0.880) ± 0.25 (0.010) MAX 0.25 (0.010) ± 0.10 (0.002)
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heat slugs attach
Abstract: CQ256 AC174 CQ352
Text: Application Note AC174 Assembly Instructions for CQFP Packages SMT on PCB I n tro du ct i on To minimize board-level vibration failure, it is important to attach a ceramic quad flat pack CQFP to system boards in the correct way. Following the correct procedures will not
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AC174
heat slugs attach
CQ256
AC174
CQ352
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actel FG484 package mechanical drawing
Abstract: RTAX2000S-CQ352 actel package mechanical drawing FG484 CQ352 2-CQFP SK-AX2000-CQ352RTFG896 sk-ax FG896 rtax2000* cqfp
Text: &4 3 WR )%*$ $GDSWHU 6RFNHWV July 2004 Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 CQFP to FBGA Adapter Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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CQ352
FG484
actel FG484 package mechanical drawing
RTAX2000S-CQ352
actel package mechanical drawing
2-CQFP
SK-AX2000-CQ352RTFG896
sk-ax
FG896
rtax2000* cqfp
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Untitled
Abstract: No abstract text available
Text: Part Matrix White Electronic Designs Hi-Rel EEPROM ������� �������� ������������� DIP 32 pin for x8 devices, 40 pin for x16 devices. 32 SOJ (Evolutionary) 68 CQFP (0.88" sq., 0.180" high) 68 CQFP (0.94" sq., 0.140" high)
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MIL-PRF-38534
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CLCC68
Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Text: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors
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CDIP24
0586B
CDIP28
0589B
CDIP40
0590B
CLCC44
OT341-1
MO-150AH
CLCC68
CQFP80
CDIP40 package
cdip28
PLCC68 package
ANSI Y14.5
cqfp package outline
PLCC28 package
CDIP24
CDIP28 package
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TEA 1732
Abstract: A09 N03
Text: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package
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240-pin
888888P
1234567I
TEA 1732
A09 N03
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Untitled
Abstract: No abstract text available
Text: 1.5 PowerPC 604 Microprocessor Pinout Listings The follow ing sections contain the pinout listings for the 604 C4-CQFP and BGA packages. 1.5.1 Pinout Listing for the C4-CQFP Package Table 9 provides the pinout listing for the 6 0 4 C 4 -C Q F P package. Table 9. Pinout Listing for the C4-CQFP Package
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A0-A31
DH0-31
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Untitled
Abstract: No abstract text available
Text: TT 95-96 DATA BOOK ERRATA M/HITE / M I C R O E L E C T R O N I C S CHANGES TO 1995-1996 MEMORY/MICROPROCESSORS DATA BOOK Page What it is What it should be 1-20 68 Pin CQFP 5962-94613 01HWX* 68 Pin CQFP 5962-94613 02HWX* 68 Pin Low Profile CQFP 5962-94613 01HZX
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01HWX*
02HWX*
01HZX
02HZX
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Untitled
Abstract: No abstract text available
Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.
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O-220)
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Untitled
Abstract: No abstract text available
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID6-603e
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PDF
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Untitled
Abstract: No abstract text available
Text: 1.5 PowerPC 603e M ic ro p r o c e s s o r Pin A s s ig n m e n t s The following sections contain the pinout diagrams for the 603e. Note that the 603e is offered in both ceramic quad flat pack CQFP and ceramic ball grid array (BGA) packages. 1.5.1 Pinout Diagram for the CQFP Package
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PID7v-603e
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8N07
Abstract: 030 b03 cn/A/U 237 BG
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID7v-603e
8N07
030 b03
cn/A/U 237 BG
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2 010 073 007
Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a
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b09 n03
Abstract: B07 P03
Text: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.
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PID9v-604e
b09 n03
B07 P03
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