RTAX2000S
Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Text: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note
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208-Pin
RTAX250S/SL
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
RTAX2000S
RTAX1000S-SL
cga 624
RTAX1000S
RTAX250S
RTAX2000
624 CCGA
SL D8 E26
RTAX4000S
CCGA
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RTAX1000S
Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Text: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5
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208-Pin
RTAX250S
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
IO44NB2F2
RTAX1000S
RTAX2000S
CCGA
CQFP 208
RTAX2000
rtax2000* cqfp
292 CCGA
RTAX-S
624 CCGA
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CQFP 240
Abstract: No abstract text available
Text: a 240-Lead CQFP Package with Heat Slug Down and Formed Leads QS-240A Dimensions shown in inches and (mm) PIN 1 ID 1.441 (36.60) 1.422 (36.13) SQ 1.404 (35.65) 0.837 (21.25) 0.827 (21.00) SQ 0.817 (20.75) 1.270 (32.25) 1.260 (32.00) SQ 1.250 (31.75) 0.758 (19.25)
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240-Lead
QS-240A)
CQFP 240
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CQFP 240
Abstract: No abstract text available
Text: a 240-Lead CQFP Package with Heat Slug Up and Formed Leads QS-240 Dimensions shown in inches and (mm) 1.441 (36.60) 1.422 (36.13) SQ 1.404 (35.65) PIN 1 ID 1.270 (32.25) 1.260 (32.00) SQ 1.250 (31.75) 1.104 (28.05) 1.094 (27.80) SQ 1.085 (27.55) 240 181
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240-Lead
QS-240)
CQFP 240
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5271SC
Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Text: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP
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ACT5271SC
ACT4431SC
RM5271
25MHz,
75MHz,
150MHz
R4400
R4400
64-bit
SCD5271SC
5271SC
military mcm 1553
military mcm cpu
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MO-134AD
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP028B – JANUARY 1995 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 SQ 43,56 1,55 Dia 1,45 4 Places 5,50 Tie Bar Width 4,50 39,50 BSC 320 1 241 240 DETAIL ”C” 70,00 BSC
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MCFP028B
R-CQFP-F320)
4040232-4/F
MO-134AD
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MO-134AD
Abstract: No abstract text available
Text: MECHANICAL DATA MCQF008B – FEBRUARY 1996 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 4 Places 5,50 4,50 Tie Bar Width 39,50 BSC 320 1 241 240 DETAIL ”C” Heat Sink
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MCQF008B
R-CQFP-F320)
4040232-6/F
MO-134AD
MO-134AD
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DSP96000
Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Text: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.
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DSP56166/D
DSP56166
16-bit
DSP56166
DSP56100
DSP96000
DSP56000
DSP56166ROM
DSP96002
brand tai hen
FE60
marking ha02
Nippon capacitors
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FBGA-484
Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
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FBGA484
SI-SX32-ACQ256SFG484
SI-SX72-ACQ256SFG484)
SI-SX72-ACQ256SFG484
CQ256
FG484
SI-SX72ACQ256SFG484)
FBGA-484
A54SX32A-CQ256
actel FG484 package mechanical drawing
B22 filament base
land pattern QFP 208
SX72
A54SX32A-FG484
silicone paste p4
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AS8F2M32
Abstract: No abstract text available
Text: AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. FLASH AS8F2M32 FIGURE 1: PIN ASSIGNMENT Top View 2M x 32 FLASH 68 Lead CQFP FLASH MEMORY MODULE AVAILABLE AS MILITARY SPECIFICATIONS • Military Processing (MIL-STD-883C para 1.2.2) • Temperature Range -55C to 125C
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AS8F2M32
MIL-STD-883C
120ns,
150ns
120mA
AS8F2M32QW-120/XT
AS8F2M32QT-90/MIL
AS8F2M32
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MO-134
Abstract: No abstract text available
Text: MECHANICAL DATA MCQF008A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 (4 Places) 5,50 4,50 39,50 BSC 320 1 241 240 DETAIL “C” Heatsink 70,00 3,60 3,50 161 160 80 81 DETAIL “B”
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MCQF008A
R-CQFP-F320)
4040232-6/E
MO-134
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CQFP 240
Abstract: f320 MO-134AD
Text: MECHANICAL DATA MCFP028B – JANUARY 1995 – REVISED JUNE 1999 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 SQ 43,56 1,55 Dia 1,45 4 Places 5,50 Tie Bar Width 4,50 39,50 BSC 320 1 241 240 DETAIL ”C” 70,00 BSC
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MCFP028B
R-CQFP-F320)
4040232-4/F
MO-134AD
CQFP 240
f320
MO-134AD
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CQFP 240
Abstract: No abstract text available
Text: a 240-Lead CQFP Package Mount with Heat Slug Up and Unformed Leads QS-240 Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 61 120 121 60 61 120 60 121 SEAL RING 2؋ 2.594 (65.90) TOP VIEW
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240-Lead
QS-240)
CQFP 240
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Untitled
Abstract: No abstract text available
Text: AUSTIN SEMICONDUCTOR, INC. Austin Semiconductor, Inc. FLASH AS8F2M32 FIGURE 1: PIN ASSIGNMENT Top View 2M x 32 FLASH 68 Lead CQFP FLASH MEMORY MODULE AVAILABLE AS MILITARY SPECIFICATIONS • Military Processing (MIL-STD-883C para 1.2.2) • Temperature Range -55C to 125C
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AS8F2M32
MIL-STD-883C
120ns,
150ns
120mA
AS8F2M32QW-120/XT
AS8F2M32QT-90/MIL
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max3200
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP028A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 4 Places 5,50 4,50 39,50 BSC 320 1 241 240 “C” 70,00 3,60 3,50 161 160 80 81 2,60 2,50 “B” 2,60
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MCFP028A
R-CQFP-F320)
max3200
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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Untitled
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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WF2M32-XXX5
2Mx32
150ns
64KBytes
WF2M32U-XG2UX
64KByte
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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TEA 1732
Abstract: A09 N03
Text: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package
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240-pin
888888P
1234567I
TEA 1732
A09 N03
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Untitled
Abstract: No abstract text available
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID6-603e
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8N07
Abstract: 030 b03 cn/A/U 237 BG
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID7v-603e
8N07
030 b03
cn/A/U 237 BG
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2 010 073 007
Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a
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b09 n03
Abstract: B07 P03
Text: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.
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PID9v-604e
b09 n03
B07 P03
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DSP56116
Abstract: PB10 PB12 PC10 MDB301 DSP56116 users manual "saturation arithmetic" F1359 dsp56001
Text: Order this document by DSP56116/D MOTOROLA •SEMICONDUCTOR DSP56116 TECHNICAL DATA Advance Information 16-bit General Purpose Digital Signal Processor Pin Grid Array PGA ^ f Available in an 101 pin ceramic through-hole! package package. through- Ceramic Quad Flat Pack (CQFP)
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DSP56116/D
DSP56116
16-bit
DSP56116
1N4148
74LS04
PB10
PB12
PC10
MDB301
DSP56116 users manual
"saturation arithmetic"
F1359
dsp56001
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