SN1004
Abstract: SDR0906 polyester resin enamelled copper wire SN100
Text: MATERIAL DATA SHEET Material SDR0906 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.726 Average mass (%) Sum (%) Iron & Compounds N/A Remainder
|
Original
|
SDR0906
04-October-2004
Sn100%
Ni/Sn100%
SN1004
SDR0906
polyester resin
enamelled copper wire
SN100
|
PDF
|
SDR1030
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material SDR1030 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.679 Average mass (%) Sum (%) Iron & Compounds N/A Remainder
|
Original
|
SDR1030
04-October-2004
Sn100%
Cu/Ni/Sn100%
SDR1030
|
PDF
|
Sn97-Cu3
Abstract: SDR1806 Sn97Cu3
Text: MATERIAL DATA SHEET Material SDR1806 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Solder Material group Ferrite Ni-Zn Series Material Weight g 2.3 Iron & Compounds N/A Remainder 100 Zinc & Compounds N/A
|
Original
|
SDR1806
04-October-2004
Sn100%
Sn97-Cu3
Cu/Ni/Sn100%
Sn97-Cu3
SDR1806
Sn97Cu3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SST-Ribbon Gel-Free Cables Features and Benefits Completely gel-free design No messy filling or flooding compounds eliminate time and labor associated with cleaning ribbons, thereby keeping work and splicing areas cleaner and simplifying splice preparation
|
Original
|
S-87-640
GR-20
PE-90
|
PDF
|
JIS D 5403
Abstract: TMCX118100 sj 2038 appleton clamp 7665s scotchcast 92 7665-S-8 8462 "cross reference" TMCX8875 TMCX402400
Text: Splice Rejacketing 387 Splice Repair 390 3 M Safety Sock Grounding Kits, Shielded and Jacketed URD Cable 391 Sealing and Grounding 393 3/C Cable Breakout Boots and 3/C Phase Rejacketing System 395 Insulating and Sealing Compounds 408 Mounting Brackets 410
|
Original
|
CCI-2-125
CCI-2/0-125
CCI-266-125
CCI-2/0-200
CCI-266-200
JIS D 5403
TMCX118100
sj 2038
appleton clamp
7665s
scotchcast 92
7665-S-8
8462 "cross reference"
TMCX8875
TMCX402400
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
|
Original
|
0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
|
PDF
|
B82603
Abstract: max3035 B82603-S0133-M1
Text: EPCOS Product Family Name Date Version Chokes for high Current B82603-S0xxx-M1 Ring core choke 12.12.2005 1.00 CAS if applicable Construction Element Material group Materials Active Part Metals Copper wire enameled 7440-50-8 Compounds Iron powder 7439-89-6
|
Original
|
B82603-S0xxx-M1
B82603-S0133-M1
B82603-S0772-M1
B82603
max3035
B82603-S0133-M1
|
PDF
|
Weighing scale circuit
Abstract: biomedical datasheet food storage tanks
Text: Model 65086 Vishay Sensortronics Sanimount Weigh Module FEATURES • Capacity ranges of 1000 to 25000 pounds • Stainless steel construction throughout • All cavities sealed with FDA approved compounds • Mounts directly to floor or structural support
|
Original
|
5016-0133W
65086-TWA
08-Apr-05
Weighing scale circuit
biomedical
datasheet food storage tanks
|
PDF
|
photodiode ge
Abstract: TSAL6200 TSFF5410 TSHA550 TSHF5410 TSUS540 detect radiation
Text: Physics and Technology Vishay Semiconductors Physics and Technology EMITTERS Materials Infrared emitting diodes IREDs can be produced from a range of different III-V compounds. Unlike the elemental semiconductor silicon, compound III-V semiconductors consist of two or more different elements of group three (e.g.,
|
Original
|
26-Aug-08
photodiode ge
TSAL6200
TSFF5410
TSHA550
TSHF5410
TSUS540
detect radiation
|
PDF
|
abb fid
Abstract: flame detector burner PGC2009 FID detector CE-EX pressure reducing valve air transistor NEC D 586 AIR FLOW DETECTOR applications ABB 12 30 01 ATEX flame detector
Text: General Specifications PGC2009 E2 Fast Temperature Programmed Process Gas Chromatographs Application Usage The PGC2009 E2 Fast Temperature Programmed Gas Chromatograph GC uses component separation to analyze liquid samples and performs specialty analysis for separation of wide boiling point range compounds. The analyzer
|
Original
|
PGC2009
BUASC1A-16-0609
abb fid
flame detector burner
FID detector
CE-EX
pressure reducing valve air
transistor NEC D 586
AIR FLOW DETECTOR applications
ABB 12 30 01
ATEX flame detector
|
PDF
|
Physics and Technology
Abstract: physics pn junction diode structure
Text: Physics and Technology www.vishay.com Vishay Semiconductors Physics and Technology EMITTERS Materials Infrared emitting diodes IREDs can be produced from a range of different III-V compounds. Unlike the elemental semiconductor silicon, compound III-V semiconductors
|
Original
|
06-Oct-14
Physics and Technology
physics
pn junction diode structure
|
PDF
|
Assmann Electronics v6515
Abstract: Thermagon kluber grease t-pli 210 v6515 kluber T-PLI 200 thermagon FSF52 Thermagon thermal grease T-PLI 210 thermagon
Text: Application Note from Europe for the World European PowerSemiconductor and Electronics Company Comparison of thermal compounds and heat conducting foils The following information is the result of a comparative investigation of different heat conductive materials in the eupec laboratory. The examined types only represent a small
|
Original
|
705PSA
FSF-52/98
V6515
Assmann Electronics v6515
Thermagon
kluber grease
t-pli 210
v6515
kluber
T-PLI 200 thermagon
FSF52
Thermagon thermal grease
T-PLI 210 thermagon
|
PDF
|
RS 199-1468
Abstract: RS 195-978 199-1468 UL-492 optically clear adhesive curing
Text: Data Pack G Issued March 1998 262-0426 Potting compounds Data Sheet A range of potting compounds for encapsulation of electronic components and sub-assemblies, for use in laboratories or in manufacturing. Each potting compound is supplied in two parts resin and hardener/catalyst which require mixing and
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PB7220-2000-T/R Two-Channel Portable Frequency Domain Terahertz Spectrometer DATASHEET | MAY 2014 TERAHERTZ SYSTEMS Compact, Portable Terahertz Spectroscopy System EMCORE’s versatile PB7220-2000-T/R Spectroscopy Platform is designed for scanning complex compounds to precise specifications with greater accuracy and control. The
|
Original
|
PB7220-2000-T/R
PB7220
|
PDF
|
|
|
In-Sil-8
Abstract: 619-1001 161000F00000 188958F00000 101600F00000 100500F00000
Text: A a v i d Thermalloy Heat Sinks, Conductive Adhesive and Compounds, and IN-SIL-8 Pads ª All material is aluminum alloy with a black, anodized finish unless otherwise noted. Slip-On for TO-92 4 Foot Length Extrusion Cut, Deburred and Washed Not Anodized
|
Original
|
500-Up
575200B00000
O-220
10-Up
574502B00000*
574502B03300*
600502F00000
600552F00000
188958F00000
In-Sil-8
619-1001
161000F00000
188958F00000
101600F00000
100500F00000
|
PDF
|
cho-bond 1086
Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Text: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s
|
Original
|
MIL-I-45208.
cho-bond 1086
cho-bond 1075
Cho-Bond 584-29
cho-bond 1029
584-29
cho-bond primer 1086
RTV silicone viscosity
51-00-1035-0000
50-02-1075-0000
CHO-SEAL 1285
|
PDF
|
SDR7045
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material SDR7045 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.276 Average mass (%) Sum (%) Iron & Compounds N/A Remainder
|
Original
|
SDR7045
04-October-2004
Sn100%
Cu/Ni/Sn100%
SDR7045
|
PDF
|
SRR0618
Abstract: polyester resin enamelled copper wire
Text: MATERIAL DATA SHEET Material SRR0618 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.05 Average mass (%) Sum (%) Iron & Compounds N/A Remainder 100
|
Original
|
SRR0618
04-October-2004
Sn100%
Cu/Ni/Sn100%
SRR0618
polyester resin
enamelled copper wire
|
PDF
|
SRR7032
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material SRR7032 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.324 Average mass (%) Sum (%) Iron & Compounds N/A Remainder
|
Original
|
SRR7032
04-October-2004
Sn100%
Cu/Ni/Sn100%
SRR7032
|
PDF
|
SRR7045
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material SRR7045 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.373 Average mass (%) Sum (%) Iron & Compounds N/A Remainder
|
Original
|
SRR7045
04-October-2004
Sn100%
Cu/Ni/Sn100%
SRR7045
|
PDF
|
VOC sensor
Abstract: QPA84 automatic room power controller acetone gas sensor STAEFA "VOC Sensor" Siemens room temperature sensor landis and staefa 1571S02 1571S
Text: 1 Indoor Air Quality Controller 571 QPA84 With integrated VOC 1 ) sensor, operating voltage AC 230 V, two-position output non-potential-free relay contact) 1) VOC = Volatile Organic Compounds Use In ventilation plant to optimize the indoor air quality and the consumption of energy by
|
Original
|
QPA84
QAP84
dampe0-2-11
1571G01
CM1N1571E
1571M01
VOC sensor
QPA84
automatic room power controller
acetone gas sensor
STAEFA
"VOC Sensor"
Siemens room temperature sensor
landis and staefa
1571S02
1571S
|
PDF
|
TSOP 48 bonding
Abstract: AMI Semiconductor ROM
Text: AMI A M I MEM l C O N D U C T O R % Packaging Capabilities TSOP Description Surface Mount The Thin Small Outline Package TSOP is a thin ends only package. This package is constructed using the latest low stress molding compounds and bonding technology to provide a package with total body thickness of less then 1.90 mm.
|
OCR Scan
|
28formation
TSOP 48 bonding
AMI Semiconductor ROM
|
PDF
|
gordos relays
Abstract: gordos relay gordos relay 4705 gordos 4705
Text: a Crouzet REED RELAYS 47 SERIES MINI-SIP DRY REED RELAY 74 SERIES SIP DRY REED RELAY FEATURES: • These Gordos Relays are molded in semiconductor-grade molding compounds that meet Underwriters Laboratories 94V-0 flammability rating. ■ Compatible with automatic insertion
|
OCR Scan
|
741C-1
741C-2
gordos relays
gordos relay
gordos relay 4705
gordos 4705
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Data sheet E 9/3.707 - VISHAY SIL 5 - 6-8 9-10 11598 cermet resistor networks SIL circuits are networks of resistors using a screen printing process of cermet compounds on alumina substrates. The tinned connecting pins are parallel to the substrate plane. A confor
|
OCR Scan
|
|
PDF
|
