T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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D1065
Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Text: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21
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21x21
25x25
28x28
35x35
37x37
38x38
71x43
73x50
D1065
Chomerics* T-405
BERGQUIST softface
Chomerics* T405
Chomerics T710 tape
BGA 21x21
ARCLAD 8223
Chomerics T710
D10650-40
D10650-40 datasheet
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E7221
Abstract: 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD
Text: R Intel E7221 Memory Controller Hub MCH Thermal/Mechanical Design Guide September 2004 Document Number: 303632-001 R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.
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E7221
865g Motherboard
775 motherboard
BGA reflow guide
Chomerics T710
6700PXH
6702PXH
chipset reflow profile
FOXCONN 865gv
foxconn MOTHERBOARD
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amd Power and Thermal
Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
Text: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers
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Chomerics T710
Abstract: A13494
Text: COLUSA 860 CHIP SET COOLING SOLUTIONS Part # 23408 Part # 23409 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 860 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available
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A13494
Chomerics T710
A13494
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Chomerics T710
Abstract: A13494 a1349
Text: TEHAMA 850 CHIP SET COOLING SOLUTIONS Part # 23410 Part # 23411 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 850 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available
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A13494
Chomerics T710
A13494
a1349
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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Intel reflow soldering profile BGA
Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710
Text: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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MIL-C-47113
Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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O-220
MIL-C-47113
t405 6000
e595
Chomerics* T-405
deltabond
ARCLAD 8223
T-412 chomerics
KS21343 thermal grease
Chomerics T710
174-9-250P
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T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
669-33AB
669-40AB
T405R
Chomerics* T405
BERGQUIST softface
T410R
intel 82495
Bergquist BP-108
intel 80486sx
Intel 82495 Cache Controller
651b
thermal printer 2 inch
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retention mechanisms
Abstract: AAVID Thermal Products
Text: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with
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103700F00000
103800F00000
103700F00000
103800F00000
retention mechanisms
AAVID Thermal Products
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Chomerics T710
Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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A65066-001
A67031-001
A61203-001
A13494-005
HB96030-DW
A67625-001
PHC029C02012
Chomerics T710
PHC029C02012
845 motherboard
foxconn motherboard
intel 845
845 motherboard circuit
a1349
INTEL 845 sdr
845 motherboard check point
ICH2
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Untitled
Abstract: No abstract text available
Text: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm
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FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
FHE40-40-40/T710/T
RevD1014
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855GM
Abstract: 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 852GME foxconn motherboard T411 845G 855GME T-710
Text: Intel 855GME and Intel® 852GME Chipset Memory Controller Hub MCH Thermal Design Guide for Embedded Applications October 2003 Revision 1.0 Order Number: 273838-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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855GME
852GME
852GME
855GM
82801DB
intel chipset g 41 motherboard no display
intel 845gv MOTHERBOARD CIRCUIT
foxconn motherboard
T411
845G
T-710
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845GL
Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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845G/845GL/845GV
82845G/82845GL/82845GV
Pkg760
845GL
845gv motherboard
intel 845GL motherboard
845GV
82801DB
foxconn motherboard
Passive Heatsink FCBGA
chipset reflow profile
MOTHERBOARD INTEL 845
GMCH of motherboard
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CEBF0145451601
Abstract: EBF45001-20B CEBF0145451601-00 heatsink Chomerics T710
Text: Model : CEBF0145451601-00 For 45 x 45 mm Chip Set BGA Cooler EBF45001-20B SPECIFICATION COOLER FAN Total dimension 45*45*20 h mm Weight 35g Rth 1.3 ° C/W HEATSINK Dimension 40*40*10(h)mm. Bearing Vapo Voltage 5V.DC Current 0.07Amp Speed 7000 R.P.M. Material of fin
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CEBF0145451601-00
EBF45001-20B
07Amp
UL94-V0)
CEBF0145451601
EBF45001-20B
CEBF0145451601-00
heatsink
Chomerics T710
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Chomerics T710
Abstract: CEBF0135351602-00 heatsink plastic ul94v0 air cooler fan 5V cooler EBF35001-16BK
Text: Model : CEBF0135351602-00 For 35 x 35mm Chip Set BGA Cooler EBF35001-16BK SPECIFICATION COOLER FAN Total dimension 35*35*16 h mm Weight 18g Rth 2.32 ° C/W HEATSINK Dimension 30*30*6(h)mm. Bearing Vapo Voltage 5V.DC Current 0.13Amp Speed 9500 R.P.M. Material
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CEBF0135351602-00
EBF35001-16BK
13Amp
UL94-V0)
Chomerics T710
CEBF0135351602-00
heatsink
plastic ul94v0
air cooler fan
5V cooler
EBF35001-16BK
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intel 845
Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide January 2002 Document Number: 298586-002 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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A65066-001
A67031-001
A61203-001
A13494-005
HB96030-DW
A67625-001
PHC029C02012
intel 845
MOTHERBOARD INTEL 845
INTEL 845 sdr
82801BA
ATA-33
T-710
intel pin grid array package
intel 82845
foxconn motherboard
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extrusion
Abstract: heatsink CEBF0142421601-00 Chomerics T710 VAPO
Text: Model : BGA Cooler CEBF0142421601-00 For 42.5 x 42.5 mm Chip Set EBF42.5001-20BK SPECIFICATION COOLER FAN Total dimension 42.5*42.5*16 h mm Weight 30g Rth 1.5 ° C/W HEATSINK Dimension 40*40*10(h)mm. Bearing Vapo Voltage 5V.DC Current 0.07Amp Speed 7000 R.P.M.
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CEBF0142421601-00
EBF42
5001-20BK
07Amp
UL94-V0)
extrusion
heatsink
CEBF0142421601-00
Chomerics T710
VAPO
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Chomerics T710
Abstract: heatsink 27X27MM
Text: Model : CEBF0127271803-00 For 27 x 27mm Chip Set BGA Cooler EBF27005-18BK SPECIFICATION COOLER FAN Total dimension 27*27*18 h mm Weight 13g Rth 3.62 °C/W HEATSINK Dimension 20*20*8(h)mm. Bearing Vapo Voltage 5V.DC Current 0.17Amp Speed 15000 R.P.M. Material
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CEBF0127271803-00
EBF27005-18BK
17Amp
UL94-V0)
Chomerics T710
heatsink
27X27MM
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Radian Heatsinks
Abstract: Chomerics T710 heatsink CS2290 IXF1110 Intricast Company
Text: 25mm Round Pin BGA Heatsink / 5-Pack home > shop > additional heatsinks > cs2290 Submit Query 25mm Round Pin BGA Heatsink / 5-Pack CS2290 Thermal Resistance °C/W Heatsink Size Weight (W x L x H) oz. 200 lfm 400 lfm 600 lfm 25.0 mm x 25.0 mm x 9.8 mm (0.2)
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cs2290
IXF1110
10-port
CS2290:
com/cs2290
html5/22/2005
Radian Heatsinks
Chomerics T710
heatsink
CS2290
Intricast Company
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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27x27
40x40
RevA0614
FHP27-27-21
/T710
/T410
/T411
/T412
FHP27-27-21/T710/T
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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35x35
40x40
sup35-20
FEX40-40-20
/T710
/T410
/T411
/T412
withT710
FEX40-40-20/T710/T
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0
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21x21
45x45
FHE35-35-26
/T410
/T411
/T412
FHE43-43-26/T710/T
RevB1014
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