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    Skyworks Solutions Inc SI5389C-A13494-GMR

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    Skyworks Solutions Inc SI5389C-A13494-GM

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    A13494 Datasheets Context Search

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    a13493

    Abstract: a1349 A13492 A13488 66244 A1348
    Text: Ordering number : ENN*6624 CMOS IC LC35W1000BM, BTS-70U/10U Asynchronous Silicon Gate 1M 131,072 words x 8 bits SRAM Preliminary Overview Package Dimensions The LC35W1000BM and LC35W1000BTS-70U/10U are asynchronous silicon gate CMOS static RAM devices with


    Original     		PDF LC35W1000BM, BTS-70U/10U LC35W1000BM LC35W1000BTS-70U/10U 072-word 205A-SOP32 LC35W1000BM-70U/10U] a13493 a1349 A13492 A13488 66244 A1348

    intel mch 945gc

    Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
    Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR


    Original     		PDF E20724-001 E40825-001 945GC E37585-001 intel mch 945gc bga dye pry UL1439 PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet

    Chomerics T710

    Abstract: A13494
    Text: COLUSA 860 CHIP SET COOLING SOLUTIONS Part # 23408 Part # 23409 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 860 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available


    Original     		PDF A13494 Chomerics T710 A13494

    intel g31 chipset motherboard

    Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
    Text: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


    Original     		PDF 82G35 OTH97; D29081 intel g31 chipset motherboard BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42

    intel 945 ich7 family motherboard

    Abstract: ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance
    Text: Mobile Intel 945GME Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide June 2007 308623-002 Mobile Intel® 945GME Express Chipset GMCH Thermal Design Guide ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 945GME intel 945 ich7 family motherboard ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance

    Intel A80856 Socket 478 Cooling Fan

    Abstract: a80856-002 intel a80856 a57855-001 Nidec A80856 a38001-003 a57855 Nidec a38001-003 a80856 a38001
    Text: Intel Pentium® 4 Processor and Intel® Celeron® Processor in the 478-Pin Package Thermal Design Guide for Embedded Applications January 2004 Order Number: 273704-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF 478-Pin 886-2-29952666ext. Intel A80856 Socket 478 Cooling Fan a80856-002 intel a80856 a57855-001 Nidec A80856 a38001-003 a57855 Nidec a38001-003 a80856 a38001

    82915GV

    Abstract: 915Gv Intel 915G Intel 915p Intel desktop design guide intel 915g express PCM45F Passive Heatsink FCBGA intel server board xeon lga 775 775 Intel Processor
    Text: Intel 82915GV Express Chipset Thermal Design Guide for Embedded Applications September 2004 Revision 1.0 Reference Number: 303729 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 82915GV 915GV Intel 915G Intel 915p Intel desktop design guide intel 915g express PCM45F Passive Heatsink FCBGA intel server board xeon lga 775 775 Intel Processor

    intel 845

    Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide January 2002 Document Number: 298586-002 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 intel 845 MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard

    Chomerics T710

    Abstract: A13494 a1349
    Text: TEHAMA 850 CHIP SET COOLING SOLUTIONS Part # 23410 Part # 23411 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 850 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available


    Original     		PDF A13494 Chomerics T710 A13494 a1349

    Intel 41210

    Abstract: foxconn A1349 27887
    Text: Intel 41210 Serial to Parallel PCI Bridge Datasheet Product Features • PCI Express Specification, Revision 1.0 • Support for single x8 or single x4 PCI • 2-level programmable round-robin internal arbiter with Multi-Transaction Timer MTT Express operation.


    Original     		PDF 64-bit 32-bit 16-bit Intel 41210 foxconn A1349 27887

    JESD51-1

    Abstract: AP-720 a1349 foxconn motherboard T-710 82801BA 82801BAM JESD-51-1 FIN26
    Text: R Intel 850 Chipset: Thermal Considerations Application Note AP-720 January 2001 Document Number: 292268-002 ® Intel 850 Chipset: Thermal Considerations R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF AP-720) T-710) 69-12-22066-T710) A20097-001 TEH-1000-001) A20932-001 A13494-002 JESD51-1 AP-720 a1349 foxconn motherboard T-710 82801BA 82801BAM JESD-51-1 FIN26

    intel 82945g chipset motherboard layout

    Abstract: socket lga 1156 945P 945G intel ICH7 air velocity sensors 82945 intel 945G transistor 945P GMCH of motherboard
    Text: Intel 945G Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide August 2005 Order #308643-001 Intel® 945G Express Chipset GMCH Thermal Design Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF

    855GM

    Abstract: 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 852GME foxconn motherboard T411 845G 855GME T-710
    Text: Intel 855GME and Intel® 852GME Chipset Memory Controller Hub MCH Thermal Design Guide for Embedded Applications October 2003 Revision 1.0 Order Number: 273838-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF 855GME 852GME 852GME 855GM 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT foxconn motherboard T411 845G T-710

    thermal test vehicle -intel

    Abstract: PCM45F honeywell thermocouple
    Text: Intel 3100 Chipset Thermal Design Guide November 2008 Order Number: 313457-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


    Original     		PDF 313457-004US thermal test vehicle -intel PCM45F honeywell thermocouple

    Loctite 7452

    Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


    Original     		PDF 631xESB/632xESB Loctite 7452 PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001

    P64H2

    Abstract: flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934
    Text: R Intel E7500/E7501/E7505 Chipset Thermal Design Guide For the Intel® E7500/E7501/E7505 Chipset Memory Controller Hub MCH December 2002 Document Number: 298647-003 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF E7500/E7501/E7505 E7500/E7501/E7505 P64H2 flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934

    hall 503

    Abstract: AH 503 hall 82801CA 82870P2 ATA-33 E7500 P64H2 T-710 foxconn motherboard
    Text: R Intel E7500 Chipset Design Guide E7500 Memory Controller Hub MCH Thermal and Mechanical Design Guidelines February 2002 Document Number: 298647-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF E7500 hall 503 AH 503 hall 82801CA 82870P2 ATA-33 P64H2 T-710 foxconn motherboard

    intel 82801DB

    Abstract: 82801CA 82801DB 82870P2 ATA-33 E7500 E7505 P64H2 chipset reflow profile Chomerics T710
    Text: R Intel E7500/E7505 Chipset Thermal Design Guide Intel® E7500/E7505 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 298647-002 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF E7500/E7505 E7500 intel 82801DB 82801CA 82801DB 82870P2 ATA-33 E7505 P64H2 chipset reflow profile Chomerics T710

    b1492

    Abstract: FCBGA Trx-idle-det M66EN PAR64 REQ64 intel 27887 2164 intel Intel 41210 foxconn
    Text: Intel 41210 Serial to Parallel PCI Bridge Datasheet Product Features • PCI Express Specification, Revision 1.0 • Support for single x8 or single x4 PCI • 2-level programmable round-robin internal arbiter with Multi-Transaction Timer MTT Express operation.


    Original     		PDF 64-bit 32-bit 16-bit b1492 FCBGA Trx-idle-det M66EN PAR64 REQ64 intel 27887 2164 intel Intel 41210 foxconn

    Loctite 7452

    Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		PDF 315344-001US Loctite 7452 TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor

    PCM45F

    Abstract: pcm45 316273 intel 965 motherboard chipset 965 Interpret Assembly drawings
    Text: Mobile Intel GME 965 Chipset Thermal Design Guide August 2007 Order Number: 317567-001US INFORMATION Legal Lines andIN Disclaimers THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original     		PDF 317567-001US A69230-001 D82048-002 PCM45F pcm45 316273 intel 965 motherboard chipset 965 Interpret Assembly drawings

    thermal design guide -intel

    Abstract: 82801CA E7500 E7501 E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset
    Text: Intel E7500 and Intel® E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number: 273819-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF E7500 E7501 E7501 thermal design guide -intel 82801CA E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset

    845GL

    Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
    Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF 845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard

    DA1349

    Abstract: No abstract text available
    Text: • mi G E C P L E S S E Y DS3335-1.2 DA1349-2/49-4 MINATURE TWO PORT HARMONIC MIXERS The D A1349-2 and D A1349-4 are m inature tw o port harm onic m ixers spe cifica lly designed fo r use w ith EIP frequency counters. FEATURES ■ 50 to 110GHz Coverage ■


    OCR Scan     		PDF DS3335-1 DA1349-2/49-4 A1349-2 A1349-4 110GHz DA1349-2 DA1349-4 UG-385/U UG-387/U DA1349