CERQUAD
Abstract: CERQUAD EIAJ W144B WA80A WA80AQ
Text: Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80A 2000 National Semiconductor Corporation MS101114 www.national.com Cerquad, EIAJ August 1999 Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80AQ www.national.com 2 Cerquad, EIAJ 144 Lead Cerquad, EIAJ
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WA80A
MS101114
WA80AQ
W144B
CERQUAD
CERQUAD EIAJ
W144B
WA80A
WA80AQ
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W120A
Abstract: No abstract text available
Text: 120 Lead Cerquad EIAJ NS Package Number W120A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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W120A
W120A
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W144A
Abstract: No abstract text available
Text: 144 Lead Cerquad EIAJ NS Package Number W144A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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W144A
W144A
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W208A
Abstract: CERQUAD EIAJ
Text: 208 Lead Cerquad EIAJ NS Package Number W208A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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W208A
W208A
CERQUAD EIAJ
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WA80AQ
Abstract: No abstract text available
Text: 80 Lead Cerquad EIAJ EPROM NS Package Number WA80AQ All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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WA80AQ
WA80AQ
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WA80A
Abstract: No abstract text available
Text: 80 Lead Cerquad EIAJ NS Package Number WA80A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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WA80A
WA80A
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W144B
Abstract: No abstract text available
Text: 144 Lead Cerquad EIAJ NS Package Number W144B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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W144B
W144B
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W160A
Abstract: No abstract text available
Text: 160 Lead Cerquad EIAJ NS Package Number W160A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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W160A
W160A
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QFP240-G-3232-0
Abstract: No abstract text available
Text: 240K6X-A Glass seal 240pin 32✕32mm CERQUAD EIAJ Package Code QFP240-G-3232-0.50 Weight g MD e JEDEC Code – 181 1 b2 240 ME HD D 180 I2 Symbol HE E Recommended Mount Pad 121 60 61 120 F L1 A b y A1 c A2 e A A1 A2 b c D E e HD HE L L1 y L Detail F b2 I2
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240K6X-A
240pin
QFP240-G-3232-0
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TO metal package aluminum kovar
Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Text: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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2TC66
Abstract: HPC16004 HPC16064
Text: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16004-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance
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MNHPC16004-20-X
HPC16064
HPC16004
s394143
HPC003U20/883,
HPC083XXX/U/883
HPC004U20/883,
HPC064XXX/U/883
2TC66
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HPC16004
Abstract: HPC16064 core i7 alu HPC003
Text: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16064-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance
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MNHPC16064-20-X
HPC16064
HPC16004
s394143
HPC003U20/883,
HPC083XXX/U/883
HPC004U20/883,
HPC064XXX/U/883
core i7 alu
HPC003
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ic type diagram
Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION
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TSOP 32 thermal resistance
Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance
Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION
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transistor BC 458
Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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MS011795
transistor BC 458
transistor BC 945
ac 1084
transistor bc 577
Transistor BC 585
MS-015-AB
TRANSISTOR A42
bd 743 transistor
uA109
CA 358 AE
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transistor BC 458
Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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Intel 1702 eprom
Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC
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CH02LINK
Intel 1702 eprom
231369
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Side Brazed Ceramic Dual-In-Line Packages
PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC PIN GRID ARRAY CPGA lead frame
CERAMIC PIN GRID ARRAY CPGA lead frame 325
Intel 2164
Side Brazed Ceramic Dual-In-Line Packages 28
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231369
Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array
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A80486DX25SX387
32-Bit
168-Lead
NG80386SX16SX159
16-Bit
100-Lead
231369
TQFP 44 PACKAGE footprint
NG80386SX16
Side Brazed Ceramic Dual-In-Line Packages
CERAMIC PIN GRID ARRAY CPGA lead frame 325
A80486DX-25
TQFP 144 PACKAGE DIMENSION intel
order 231369
600E12
BGA and QFP Package
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27128 eprom
Abstract: MC68HC05L4 000D 001B HC05 MC68HC705L4 Nippon capacitors
Text: MC68HC05L4/D MC68HC05L4 HC05 TECHNICAL DATA MC68HC05L4 MC68HC705L4 TECHNICAL DATA !MOTOROLA !MOTOROLA 1 MC68HC05L4 MC68HC705L4 2 3 High-density Complementary Metal Oxide Semiconductor HCMOS Microcomputer Unit 4 5 6 7 All Trade Marks recognised. This document contains information on a new product. Specifications and information herein are
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MC68HC05L4/D
MC68HC05L4
MC68HC705L4
27128 eprom
MC68HC05L4
000D
001B
HC05
MC68HC705L4
Nippon capacitors
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atmel 93C46
Abstract: 93c46 atmel 93C46 national 93C46 national semiconductor 24c04 Atmel 93c46 I2C atmel 24c04 ATMEL 24c32 atmel 24c02 24c04a atmel
Text: SERIAL EEPROM Serial EEPROM Cross Reference Guide The purpose of this document is to provide a quick way to determine the closest Microchip equivalent to Serial EEPROMs produced by other manufacturers. The cross reference section is broken down by manufacturer and lists all parts from that manufacturer, and the
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DS21090D-page
atmel 93C46
93c46 atmel
93C46 national
93C46 national semiconductor
24c04 Atmel
93c46 I2C
atmel 24c04
ATMEL 24c32
atmel 24c02
24c04a atmel
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MCP4001
Abstract: MCP4002 MCP4004 MCP4008 DV164001 DVA16XP180 tssop 93c76 EM167200 84l transistor PIC16C77A
Text: PRODUCT LINE CARD FOURTH QUARTER 1999 uring Feat nalog/ A New erface Int ucts Prod CURRENT MICROCHIP PRODUCT LINE PICmicro 8-BIT MICROCONTROLLER FAMILY PRODUCTS Program Memory OTP/FLASH Words Analog E PROM Data 8-Bit Com Memory RAM ADC paraBytes Bytes Channels tors
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10-Bits
PIC12CXXX
400ns
PIC12C508
512x12
PIC12C508A
PIC12C509
1024x12
PIC12C509A
MCP4001
MCP4002
MCP4004
MCP4008
DV164001
DVA16XP180
tssop 93c76
EM167200
84l transistor
PIC16C77A
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Untitled
Abstract: No abstract text available
Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.
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O-220)
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TEMIC ecl
Abstract: microcontroller radiation tolerance microcontroller radiation hard CLCC 84 CMOS NAND2
Text: Temic Full Custom: MF Semiconductors 0.8-fxm BiCMOS Gate Array Description MF is a high speed gate array combining 10-GHz n-p-n and integration close to that of CMOS LSIs, keeping low bipolar transistors, with CMOS 0.8-nm, two metal layer power competitiveness.
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10-GHz
10-May-96
TEMIC ecl
microcontroller radiation tolerance
microcontroller radiation hard
CLCC 84
CMOS NAND2
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