Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CERAMIC DUAL IN-LINE PACKAGE Search Results

    CERAMIC DUAL IN-LINE PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    CERAMIC DUAL IN-LINE PACKAGE Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CERAMIC DUAL-IN-LINE PACKAGE National Semiconductor Ceramic Dual-in-Line Package (Cerdip) Original PDF
    Ceramic Dual-In-Line Packages Cypress Semiconductor Ceramic Dual-In-Line Packages Original PDF

    CERAMIC DUAL IN-LINE PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ceramic package

    Abstract: CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ
    Text: Ceramic Dual-in-Line Package Cerdip 8 Lead Ceramic Dual-in-Line Package NS Package Number J08A 2000 National Semiconductor Corporation MS101109 www.national.com Ceramic Dual-in-Line Package (Cerdip) August 1999 Ceramic Dual-in-Line Package (Cerdip) 14 Lead Ceramic Dual-in-Line Package


    Original
    MS101109 ceramic package CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ PDF

    D24K

    Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
    Text: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com


    Original
    MS101104 D24K d28j D14D D24H D08C D16C D18A D20A D20B D24C PDF

    ca0555

    Abstract: CA555
    Text: Nomenclature Guide CA Types CA3260 A T PART NUMBER CAXXXX ELECTRICAL OPTIONS A, B, C, Blank PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal SBDIP E: Dual-In-Line Plastic (PDIP) F: Ceramic Dual-In-Line Frit-Seal (CERDIP) J: Ceramic Leadless Chip Carrier (CLCC)


    Original
    CA3260 CA555 CA0555. 1-888-INTERSIL ca0555 PDF

    PQL176

    Abstract: CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100
    Text: SECTION 4 PHYSICAL DIMENSIONS CD 020 20-Pin Ceramic Dual In Line Package .4-3 CD3024 24-Pin Slim Ceramic Dual In Line Package .4-4


    Original
    20-Pin CD3024 24-Pin 48-Pin PD3024 PQL176 176-Pin PQL176 CD3024 PD3024 PQB132 28-pin quad packages Thin Quad flat package PQT144 Ceramic Dual-In-Line Packages PQJ144 PQR100 PDF

    CD4067 DATASHEET

    Abstract: cd4067 CD4097 ALL CD4067
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original
    SCHS052A CD4067 CD4097 24-lead 24-lead CD4067 DATASHEET ALL CD4067 PDF

    CD4067BE

    Abstract: cd4067 cd4067 harris CD4097be
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original
    SCHS052A CD4067 CD4097 24-lead CD4067B, 16-Channel CD4067BNSR CD4067BE cd4067 harris CD4097be PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide AD Types ADC0803LC PART NUMBER Converters AD, ADC 1 WM -T PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal Seal (SBDIP) H: TO-52 Can N: Dual-In-Line Plastic (PDIP) WM: Small Outline Plastic (SOIC)


    Original
    ADC0803LC 1-888-INTERSIL PDF

    ordering information

    Abstract: No abstract text available
    Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack


    Original
    24-pin, MS-027-AC 28-pin, MS-027-AA 32-pin, ordering information PDF

    oki cross

    Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
    Text: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)


    Original
    82CXXX 80CXXX: 82CXXX: 80C86 10MHz 12MHz oki cross CERAMIC LEADLESS CHIP CARRIER CLCC PDF

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original
    follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Dimensional Outlines Dual-In-Line Welded-Seal Ceramic Packages D S U F F I X (J E D E C MO-OOI-AD) 14-Lead Dual-In-Line Welded-Seal Ceramic Package (D) S U F F I X (J E D E C MO-OOI-AE) 16-Lead Dual-ln-Line Welded-Seal Ceramic Package A INCHES MIN. MAX.


    OCR Scan
    14-Lead 16-Lead 51HES 28-Lead PDF

    CD4093

    Abstract: CD4093 applications cd4093 harris cd4093 Data SCHS115B
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original
    SCHS115B CD4093 14-lead 14-lead CD4093 applications cd4093 harris cd4093 Data SCHS115B PDF

    CD4093

    Abstract: CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original
    SCHS115B CD4093 14-lead 14-lead CD4093BPW CD4093BM96 CD4093BNSR CD4093BPWR CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic PDF

    cd4093

    Abstract: CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original
    SCHS115B CD4093 14-lead 14-lead PCD4093BF3A CD4093BM CD4093BM96 CD4093BNSR CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application PDF

    cd40106b

    Abstract: CD40106BE CD-40106BE
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original
    SCHS097B CD40106B 14-lead CD40106BNSR CD40106BPW CD40106BPWR CD40106BE CD-40106BE PDF

    sot133bh3

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SOT133BH3 18-pin ceramic dual in-line F package


    Original
    OT133BH3 18-pin sot133bh3 PDF

    CD4093 applications

    Abstract: CD4093 cd4093 harris CD4093 Types OF CD4093
    Text: Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form


    Original
    SCHS115A CD4093 14-lead 14-lead CD4093 applications cd4093 harris CD4093 Types OF CD4093 PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Harris I: Intersil 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 4: Ceramic Leadless Chip Carriers (CLCC)


    Original
    O-257 1-888-INTERSIL PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Heritage Products I: New Products 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP)


    Original
    O-257 1-888-INTERSIL PDF

    CD4041UB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original
    SCHS039A CD4041UB 14-lead 14-lead PDF

    173KB

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original
    SCHS108A CD40257B 16-lead SCAU001A, SDYZ001A, CD40257BE CD40257BF3A 173KB PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


    Original
    2002/95/EC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    CD40257B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline


    Original
    SCHS108A CD40257B 16-lead 16-lead PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline


    Original
    SCHS039A CD4041UB 14-lead SDYZ001A, CD4041UBE CD4041UBF CD4041UBF3A PDF