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    TDK Corporation C3216X7R1C155K

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    C3216X7R1C155K Datasheets Context Search

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    HP3314A

    Abstract: c3216x7r TDK c2012 TDK ceramic capacitor C3216X7R elect capacitor C1005 C1608 C2012 C3216 C3216X7R1C225K
    Text: REV H GENERAL Features Features - NO POLARITY - LOW ESR - IMPEDANCE LINEARITY TO FREQUENCY - 1/2 TO 1/10 CAPACITANCE WILL DO - EXTENDS BATTERY RECHARGE CYCLE - HIGH-RELIABILITY MLC Ta E CHIP Applications Applications - DECOUPLING - SMOOTHING - CHARGE PUMP


    Original     		PDF E22H0003-08 C3216X7R1C155M) 10kHz C3216X7R1C105K C3216X7R1C155K C3216X7R1C225K C3216X5R1A335K 100kHz HP3314A c3216x7r TDK c2012 TDK ceramic capacitor C3216X7R elect capacitor C1005 C1608 C2012 C3216 C3216X7R1C225K

    C3216X7R1C155M

    Abstract: C3216X7R1C684K C3216C0G1H272J C3216X5R0J475M
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C3216 [EIA CC1206] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C3216 CC1206] C3216X7R1C684K C3216X7R1C684M C3216X7R1C824K C3216X7R1C105K C3216X7R1C105M C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C3216C0G1H272J C3216X5R0J475M

    C1005

    Abstract: No abstract text available
    Text: 4112_C1005 1/6 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1005 C3216X7R1E474K C3216X7R1E474M C3216X7R1E684K C3216X7R1E684M C3216X7R1E105K C3216X7R1E105M C3216Y5V1C475Z C3216Y5V1A106Z C3216Y5V1A226Z C1005

    C2012X7R1C104M

    Abstract: C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C1608 [EIA CC0603] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1608 CC0603] C3216X7R1C684K C3216X7R1C684M C3216X7R1C824K C3216X7R1C105K C3216X7R1C105M C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C2012X7R1C104M C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M

    c3216x7r TDK

    Abstract: c3216x7r1c475 C5750X5R1A686M c3216x5r C5750X5R0J107M C3216X5R1A475 C3216X7R1C105K capacitor 1000 uf 25v C5750X5R1C476M C3216X7R1C225
    Text: TDK Hi Caps TDK Electronics Europe GmbH Head Office Wanheimer Straße 57 D - 40472 Düsseldorf, Germany Tel: 49 - 211 - 90 77-0 Fax: 49 - 211 - 41 49 84 E-mail: info@tdk.de TDK Electronics Italy Centro Commerciale Milano Est Scala H, Piano 1, Via Tolstoi 86


    Original     		PDF 10kHz C3216X7R1C105K C3216X7R1C155K C3216X7R1C225K C3216X5R1A335K 100kHz c3216x7r TDK c3216x7r1c475 C5750X5R1A686M c3216x5r C5750X5R0J107M C3216X5R1A475 C3216X7R1C105K capacitor 1000 uf 25v C5750X5R1C476M C3216X7R1C225

    C2012Y5V1A335

    Abstract: C1005
    Text: 4112_C1005 1/7 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1005 C3216X7R1E474K C3216X7R1E474M C3216X7R1E684K C3216X7R1E684M C3216X7R1E105K C3216X7R1E105M C3216X7R1E225K C3216X7R1E225M C3216Y5V1C475Z C2012Y5V1A335 C1005

    TDK C1005 X5R series circuit design

    Abstract: C1005C0G1H200J C1005
    Text: 4112_C1005 1/6 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and


    Original     		PDF C1005 ch16X7R1E684M C3216X7R1E105K C3216X7R1E105M C3216Y5V1C475Z C3216Y5V1A106Z C3216Y5V1A226Z C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K TDK C1005 X5R series circuit design C1005C0G1H200J C1005

    C1005C0G1H200J

    Abstract: TDK C3216 C0G C1005
    Text: 4112_C1005 1/6 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technol- • • • • • ogies that enable the use of multiple thinner ceramic dielectric layers. A monolithic structure ensures superior mechanical strength and


    Original     		PDF C1005 characterist05M C3216Y5V1C475Z C3216Y5V1A106Z C3216Y5V1A226Z C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C3216X7R1C225M C1005 C1005C0G1H200J TDK C3216 C0G

    C1005

    Abstract: No abstract text available
    Text: 4112_C1005 1/8 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1005 C3216Y5V1C475Z C3216Y5V1A106Z C3216Y5V1A226Z C3216X5R0J685K C3216X5R0J685M C3216X5R0J106K C3216X5R0J106M C1005

    TDK C1005 X5R series circuit design

    Abstract: C1005
    Text: 4112_C1005 1/6 Ceramic Capacitors C Series For General Use SMD FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and


    Original     		PDF C1005 ch05M C3216Y5V1C475Z C3216Y5V1A106Z C3216Y5V1A226Z C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C3216X7R1C225M C1005 TDK C1005 X5R series circuit design

    h432j

    Abstract: CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K
    Text: Page: 1 Thursday, May 22, 1997 0603 NPO 50V DC Size Chart mm inches Type Length Width Thickness Max. B/Min. 0603 0.063 (1.6) 0.031 (0.8) 0.035 (0.9) 0.008 (0.2) Packaging Quantities Type Packaging Style 0603 4,000 pieces paper tape file:///smoke/%20CURRENT%20PROJECTS/TDK/


    Original     		PDF 20CURRENT 20PROJECTS/TDK/ 20Web 20Site 20Revisions/htdocs/ CC0603HNPO100D CC0603HNPO120J CC0603HNPO150J CC0603HNPO180J CC0603HNPO220J h432j CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K

    npo 22j

    Abstract: C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105
    Text: CAPACITORS C A P AC ITO R S Ceramic Chip TDK’s n4k> Sub-Miniature chip capacitor additions answer tbe electronics industry’s needfo r , bigber density packaging. TDK’s advanced technology allows fo r smaller size, bigbest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		PDF 30ppm/ VoltageR1C473M CKCA43X7R1C104M CKCA43Y5V1H223Z CKCA43V5V1H473Z CKCA43Y5V1H1 CKCA43X7R1H471M CA43X7R1H102M OCA43X7R1H222M CA43X7R npo 22j C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105

    capacitor 104m z5u 50

    Abstract: 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K
    Text: CAPACITORS Ceramic Chip Electrical Specification Capacitance Range Temperature Characteristic 10pF to 10.0p,F NPO: 0±30ppm /°C -55°C to + 125°C 1Vrms, 1kHz 25°C X7R: NPO 1,000pF and less: 1MHz X5R: ±15% (-55°C to +85°C) Y5V: +22-82% (-30°C to +85°C)


    OCR Scan     		PDF 000pF 30ppm C3216Y5V1H474Z C3216Y5V1H105Z 1206EZ5U CC1206EZ5U224M C3216Z5U1E104M C3216Z5U1E224M CC1210CY5V106Z C3225Y5V1C capacitor 104m z5u 50 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K

    CC0603HNP0

    Abstract: C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J
    Text: CAPACITORS CAPACITORS Ceramic Chip ti TDK’s ndbi Sub-Miniature chip capacitor additions answer tbe electronics industry’s need fo r , higher density packaging. TDK’s advanced technology allows fo r smaller size, highest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		PDF CA43X7R1H CKCA43X7R1H CKCA43Y5V1H223Z CKCA43V5V1H473Z 43Y5V1H C224Z CKCA43Y5V1C474Z CC0603HNP0 C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J