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    TDK Corporation C2012X7R1H471KT0Y9N

    CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.00047 uF, SURFACE MOUNT, 0805 (Also Known As: C2012X7R1H471K)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components C2012X7R1H471KT0Y9N 37,105
    • 1 $0.04
    • 10 $0.04
    • 100 $0.04
    • 1000 $0.04
    • 10000 $0.0075
    		Buy Now
    C2012X7R1H471KT0Y9N 37,105
    • 1 $0.04
    • 10 $0.04
    • 100 $0.04
    • 1000 $0.04
    • 10000 $0.0075
    		Buy Now

    C2012X7R1H471K Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    C2012SL1H101K

    Abstract: C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C2012 [EIA CC0805] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C2012 CC0805] C2012Y5V1E154Z C2012Y5V1E224Z C2012Y5V1E334Z C2012Y5V1E474Z C2012Y5V1C224Z C2012Y5V1C334Z C2012Y5V1C474Z C2012Y5V1C684Z C2012SL1H101K C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K

    C2012X7R1C104M

    Abstract: C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C1608 [EIA CC0603] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1608 CC0603] C3216X7R1C684K C3216X7R1C684M C3216X7R1C824K C3216X7R1C105K C3216X7R1C105M C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C2012X7R1C104M C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M

    h432j

    Abstract: CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K
    Text: Page: 1 Thursday, May 22, 1997 0603 NPO 50V DC Size Chart mm inches Type Length Width Thickness Max. B/Min. 0603 0.063 (1.6) 0.031 (0.8) 0.035 (0.9) 0.008 (0.2) Packaging Quantities Type Packaging Style 0603 4,000 pieces paper tape file:///smoke/%20CURRENT%20PROJECTS/TDK/


    Original     		PDF 20CURRENT 20PROJECTS/TDK/ 20Web 20Site 20Revisions/htdocs/ CC0603HNPO100D CC0603HNPO120J CC0603HNPO150J CC0603HNPO180J CC0603HNPO220J h432j CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K

    npo 22j

    Abstract: C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105
    Text: CAPACITORS C A P AC ITO R S Ceramic Chip TDK’s n4k> Sub-Miniature chip capacitor additions answer tbe electronics industry’s needfo r , bigber density packaging. TDK’s advanced technology allows fo r smaller size, bigbest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		PDF 30ppm/ VoltageR1C473M CKCA43X7R1C104M CKCA43Y5V1H223Z CKCA43V5V1H473Z CKCA43Y5V1H1 CKCA43X7R1H471M CA43X7R1H102M OCA43X7R1H222M CA43X7R npo 22j C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105

    H070D

    Abstract: 1608C0G1H080D 3216X7R E472M H220K h432j C5650C 1608X7R 1H104M C2012SL1H010D
    Text: Multilayer Ceramic Chip Capacitors C Series TDK Multilayer Ceramic Chip Capacitors are the product of many years of experience in material and production technology. All products manufactured are, therefore, highly reliable. FEATURES • Thin layers in ceramic dielectric and multilayer


    OCR Scan     		PDF

    CC0603HNP0

    Abstract: C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J
    Text: CAPACITORS CAPACITORS Ceramic Chip ti TDK’s ndbi Sub-Miniature chip capacitor additions answer tbe electronics industry’s need fo r , higher density packaging. TDK’s advanced technology allows fo r smaller size, highest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		PDF CA43X7R1H CKCA43X7R1H CKCA43Y5V1H223Z CKCA43V5V1H473Z 43Y5V1H C224Z CKCA43Y5V1C474Z CC0603HNP0 C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J

    473m ceramic capacitors

    Abstract: C2012CH1H C2012PH1H101J 1H273K C2012X7R1H 331J COG 100 C2012X7R1C103K C2012CH1H130J 111J C2012X8R1H
    Text: Multilayer Ceramic Chip Capacitors C Series C2012 TYPE [EIA: CC0805] SHAPES AND DIMENSIONS 2 ± 0.2 c\j ö +i Dimensions in mm -0 .2 min. T Thickness 0.6±0.15_ 0.85±0.15_ 1.25±0.2_ • gg |K i CAPACITANCE RANGE/CLASS I (TEMPERATURE COMPENSATION)


    OCR Scan     		PDF C2012 CC0805] 30ppm/ C2012C0G1H080D C2012C0G1H080F C2012C0G1H5Z 2012Y 1E472Z 1E682Z 473m ceramic capacitors C2012CH1H C2012PH1H101J 1H273K C2012X7R1H 331J COG 100 C2012X7R1C103K C2012CH1H130J 111J C2012X8R1H