Untitled
Abstract: No abstract text available
Text: PCB Chip Types PCB Chip, Cylindrical Top with Inner Lens TCI Part No. TSP3-WL3212A2 TSP3-WL3216T1A2 TSP3-CL3216 TSP3-BL3216A2 TSP3-BL3216C2 TSP3-TL3216C2 TSP3-FL3216E2 TSP3-XL3216A2 TSP3-XL3216A3 TSP3-QL3216A2 TSP3-QL3216A3 Chip Matrial Emitted Color InGaN
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TSP3-WL3212A2
TSP3-WL3216T1A2
TSP3-CL3216
TSP3-BL3216A2
TSP3-BL3216C2
TSP3-TL3216C2
TSP3-FL3216E2
TSP3-XL3216A2
TSP3-XL3216A3
TSP3-QL3216A2
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ACX Multilayer Chip
Abstract: BL3216 ACX balun multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series【Preliminary】 Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321607B1900_
ACX Multilayer Chip
BL3216
ACX balun
multilayer GHz
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ACX Multilayer Chip
Abstract: ACX balun multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321620B2100_
ACX Multilayer Chip
ACX balun
multilayer GHz
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ACX Multilayer Chip
Abstract: ACX balun multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321610B0900_
ACX Multilayer Chip
ACX balun
multilayer GHz
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hcl l54
Abstract: t538 LM3935 TXC7A dr3 c502 7A14300038 T596 quanta b30 c300 - 1 South Bridge ALI M1535
Text: 5 4 3 2 1 Model MODEL REV MK3 M/B BOARD 1A 2A CHANGE LIST MK3 M/B BOARD Page FM 1 1A 2 3A PAGE 8 Layout change add R420,R423 for U25 OSC32K,Y3 BOM del 3 3B PAGE11 Layout change add C648 for HWPG,U5 and TC1&D2 BOM del First Release PAGE 2 Layout change add U37,R411,R412,R413,R414,R415,C647 for AMD recommand
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OSC32K
PAGE11
PAGE12
PAGE13
PAGE15
PAGE16
PAGE17
C620for
102K/F
1U/25V
hcl l54
t538
LM3935
TXC7A
dr3 c502
7A14300038
T596
quanta
b30 c300 - 1
South Bridge ALI M1535
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Untitled
Abstract: No abstract text available
Text: 2-1 TEL: 852-26909605 FAX: 852-26909606 E-mail: grandhalo@hutchcity.com b CERAMIC BASIC TYPE HIGH-PERFORMANCE LEDs Rev: B 陶瓷型高效率發光二極體 Date: 2005/4/10 GH-3216 Series Electro-Optical Characteristics: Code for parts GH-XXXXX Lighting Color
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GH-3216
RQ3216TC-DPE
OV3216TC-DPE
YU3216TC-DPE
GB3216TC-DPJ
G33216TC-JPH
BL3216TC-JPH
RS-481
3000pcs/Reel
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ACX balun
Abstract: ACX Multilayer Chip multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series【Preliminary】 Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321607B1200_
ACX balun
ACX Multilayer Chip
multilayer GHz
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ACX balun
Abstract: ACX Multilayer Chip multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321620B0900_
ACX balun
ACX Multilayer Chip
multilayer GHz
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ACX Multilayer Chip
Abstract: ACX balun multilayer GHz
Text: ACX Advanced Ceramic X BL 3216 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,
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BL321620B1800_
ACX Multilayer Chip
ACX balun
multilayer GHz
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