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ACX Multilayer Chip Abstract: BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	BL201210B3700_ ACX Multilayer Chip BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz	PDF

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ACX Multilayer Chip

Abstract: BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz
Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,

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BL201210B3700_ ACX Multilayer Chip BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz

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