BH158AM
Abstract: BH158
Text: MICROWAVE SILICON COMPONENTS Case styles Cb=0.4pF Cb=0.4pF BH158 BH158am D 4.1 C ∅ 5.10 ∅ 5.50 .200 DIA .216 DIA C ∅ 5.2 B B 4.7 A ∅ 5.7 D 4.00 4.90 4.50 5.30 .157 .193 .177 .209 A ∅ 6.50 ∅ 6.70 .256 DIA .264 DIA SYM min max BOL MILLIMETERS BH165
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BH158
BH158am
BH165
BH165s
BH158AM
BH158
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bh32
Abstract: bH-36 M208D BMH76 M208A BH158AM BH147
Text: MICROWAVE SILICON COMPONENTS Case styles CASE STYLES SURFACE MOUNT DEVICES GENERAL PURPOSE STRIP LINE / M ICRO STRIP A22e SMD3 BH15 BH28 SMD4 BH16 BH32 SMD6 BH36 BH35 SMD8 BH100 BH142a SOD323 BH101 BH142b SOT23 BH143 BH142c SOT143 BH146 BH147 BH142d POWER
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BH142a
BH142b
BH142c
BH142d
BH142e
BH142f
BH165
BH165s
BH167
BH167s
bh32
bH-36
M208D
BMH76
M208A
BH158AM
BH147
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BH204N
Abstract: BH403a M208D BH198 BH202N M208A
Text: MICROWAVE SILICON COMPONENTS Case styles CASE STYLES SURFACE MOUNT DEVICES GENERAL PURPOSE STRIP LINE / MICRO STRIP PAGE PAGE PAGE A22e .12-48 SMD3 .12-56 BH15 .12-48 BH28 .12-48
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BH142a
BH142b
BH142c
BH142d
BH142e
BH142f
BH167
BH167s
BH198
M208a
BH204N
BH403a
M208D
BH202N
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Z0840004PSC
Abstract: Z0853006PSC sumitomo crm1033b Sumitomo CRM 1033B Z84C008 z0840004 Z0847004PSC Z0843006PSC Z0843004PSC Z84C3006PEC
Text: ZiLOG, Inc. 2H - Year 2002 Quality And Reliability Report ZAC03-0004 ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection TABLE OF CONTENTS Chapter Title and Subsection Chapter 1 - ZiLOG’s Quality Culture Reliability And Quality Assurance Policy Statement………………………………. 1 - 1
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ZAC03-0004
2002Quality
Z0840004PSC
Z0853006PSC
sumitomo crm1033b
Sumitomo CRM 1033B
Z84C008
z0840004
Z0847004PSC
Z0843006PSC
Z0843004PSC
Z84C3006PEC
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M208A
Abstract: BMH76
Text: MICROWAVE SILICON COMPONENTS Case styles CASE STYLES SURFACE MOUNT DEVICES GENERAL PURPOSE STRIP LINE / MICRO STRIP PAGE PAGE PAGE A22e .12-48 SMD3 .12-56 BH15 .12-48 BH28 .12-48
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BH142a
BH142b
BH142c
BH142d
BH142e
BH142f
BH167
BH167s
BH198
M208a
BMH76
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sqm1150
Abstract: smd diode f54 sqm1250 DH60034 srd dh294 bh16 transistor step recovery diode dh252 temex DH252 M208 B1 DH294
Text: MICROWAVE SILICON COMPONENTS Contents MICROWAVE SILICON COMPONENTS CONTENTS CONTENTS w e N f o t i y Spir nolog Tech PAGE INTRODUCTION / SYMBOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 All specifications contained in that catalog are subject to change without notice.
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