Untitled
Abstract: No abstract text available
Text: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x
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BGA316:
OT531-1
MS-034
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PBGA-316
Abstract: PRBG0316DB-A 316F
Text: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DB-A D Previous Code 316F7A MASS[Typ.] 2.6g A ZD A B D1 φb φx M S AB e y S Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 1011121314151617181920 S Index mark Reference Symbol
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P-BGA316-27x27-1
PRBG0316DB-A
316F7A
PBGA-316
PRBG0316DB-A
316F
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PRBG0316DA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DA-A D Previous Code 316F7X-A A MASS[Typ.] 2.6g A B D1 ZD b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA316-27x27-1
PRBG0316DA-A
316F7X-A
PRBG0316DA-A
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BGA316
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K
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BGA316:
OT531-1
MS-034
BGA316
MS-034
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BGA316
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M Y W V U T R P N M L K J H G F E D C B A
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BGA316:
OT531-1
BGA316
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SF-BGA316B-B-11
Abstract: BGA316 FR4 substrate with 0.762mm thickness
Text: D Package Code: BGA316B C 0.635mm See BGA pattern code to the right for actual pattern layout Y .0225" dia. tooling holes X2 non plated (optional) 0.762mm 0.025" dia. pad X Top View (reference only) 24.13mm 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA316B
635mm
762mm
FR4/G10
SF-BGA316B-B-11
BGA316
FR4 substrate with 0.762mm thickness
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BGA316
Abstract: sot531
Text: PDF: 1999 Sep 14 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P N M L K J H G F E D C B A e 1 2
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BGA316:
OT531-1
BGA316
sot531
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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B0BC9R000008 DIODE
Abstract: B0BC6R100010 B0BC01700015 B0BC9R000008 varistor k271 Diode C65 004 LYNX3DM transistor C388 B0BC3R700004 3225 K30
Text: ORDER NO. CPD0207023C0 Personal Computer CF-R1 This is the Service Manual for the following areas. M …for U.S.A. and Canada E …for U.K. G …for Germany F …for France T …for Italy P …for Spain Model No. CF-R1P82ZV1 2 1: Operation System G: Microsoft Windows® XP Professional
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CPD0207023C0
CF-R1P82ZV1
DTA144EE
BRPY1211F
LN1361C
B0BC9R000008 DIODE
B0BC6R100010
B0BC01700015
B0BC9R000008
varistor k271
Diode C65 004
LYNX3DM
transistor C388
B0BC3R700004
3225 K30
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kbc 1070 nu
Abstract: toshiba c850 JRC 386 amp LYNXEM4 D5024 hosiden DC motor 12V DFWP0125WA R5C475 Matsua inverter MID manual B9017
Text: ORDER NO. CPD0102001C0 Notebook Computer CF-28 This is the Service Manual for the following areas. M .for U.S.A. and Canada E .for U.K. G .for Germany F .for France S .for Sweden When this product is repaired, the Access Key is necessary to release security of electrical and mechanical.
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CPD0102001C0
CF-28
CF-28
kbc 1070 nu
toshiba c850
JRC 386 amp
LYNXEM4
D5024
hosiden DC motor 12V
DFWP0125WA
R5C475
Matsua inverter MID manual
B9017
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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diagram lcd tv Philips 32
Abstract: high level block diagram for i2c controller jpeg encoder block diagram of digital TV RS-232 to i2c converter saa8 SAA8122 PR3001 digital DSC controller digital still camera controller
Text: INTEGRATED CIRCUITS DATA SHEET SAA8122 Digital Still Camera Preliminary specification Supersedes data of File under Integrated Circuits, ICXX 1999 sep 01 Philips Semiconductors Preliminary specification Digital Still Camera SAA8122 FEATURES • Support a wide range of CCD VGA,SVGA,QGA,XGA,EQGA
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SAA8122
PR3001
diagram lcd tv Philips 32
high level block diagram for i2c controller
jpeg encoder
block diagram of digital TV
RS-232 to i2c converter
saa8
SAA8122
digital DSC controller
digital still camera controller
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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