BGA304
Abstract: sot550
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E
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BGA304:
OT550-1
BGA304
sot550
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P-BGA304-31x31-1
Abstract: PBGA-304 PRBG0304DA-A 304F7A
Text: JEITA Package Code P-BGA304-31x31-1.27 RENESAS Code PRBG0304DA-A D Previous Code 304F7A A A ZD A1 b S AB e y S Index mark S ZE AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B D1 MASS[Typ.] 3.1g Reference Symbol 1 2 3 4 5 6 7 8 9 1011 1213141516171819 2021 22 23
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P-BGA304-31x31-1
PRBG0304DA-A
304F7A
PBGA-304
PRBG0304DA-A
304F7A
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BGA304
Abstract: MS-034 sot550
Text: Package outline Philips Semiconductors BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm D SOT550-2 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 ∅v ∅w b e AC AB AA Y W V U T R P N M L K J H G F E D C B A M M y1 C C A B
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BGA304:
OT550-2
MS-034
BGA304
MS-034
sot550
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SF-BGA304A-B-11
Abstract: BGA 23 x 23 array
Text: D Package Code: BGA304A C 27.94mm [1.100"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 27.94mm [1.100"] X 1.27mm [0.050"] Top View reference only 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA304A
SF-BGA304A-B-11
BGA 23 x 23 array
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Untitled
Abstract: No abstract text available
Text: Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b e y y1 C ∅v M C A B ∅w M C AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1 shape 2 optional 4x
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BGA304:
OT550-1
MS-034
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LS-BGA304A-11
Abstract: No abstract text available
Text: BGA304A Tooling hole X2 0.64mm [0.025"] Ø 0.40mm (x2) [Ø 0.016"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] Ø 0.51mm [Ø 0.020"] pad 27.94mm [1.100"] Top View (reference only) X 0.64mm [0.025"] 1 5.33mm [0.210"] 0.64mm [0.025"]
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BGA304A
FR4/G10
LS-BGA304A-11
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BGA304
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 y y1 C ∅v M C A B b e ∅w M C AC AB AA Y W V U T R P N M L
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BGA304:
OT550-1
MS-034
BGA304
MS-034
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FX-BGA304A-S-B-01
Abstract: hdlc transwitch pitch 0.3mm BGA Multi-Channel hdlc Controller
Text: 3.56mm [0.140"] typ. 3.56mm [0.140"] typ. Top View 33.53mm [1.320"] 1.27mm [0.050"] pitch typ. 33.53mm [1.320"] Side View 1 2.18mm [0.086"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.
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FR4/G10
BGA304A)
TXC-05132
FX-BGA304A-S-B-01
hdlc
transwitch
pitch 0.3mm BGA
Multi-Channel hdlc Controller
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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WLAN Module MII
Abstract: CNS1202 CNS1109 RGMII to MII CNS1105 CNS11XX BGA304 CNS12XX CAVIUM cns12
Text: Networks That ThinkTM. Embedded ARM Processors STAR CNS11XX and CNS12XX Connected Home and Office Processors Product Brief OVERVIEW The STAR CNS11XX/CNS12XX family of ARM processors target intelligent, gigabit networking, storage and wireless applications in
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CNS11XX
CNS12XX
CNS11XX/CNS12XX
CNS11XX/12XX
32-bit
8/16-bit
16/32-bit
32-bit/66
BGA-304
WLAN Module MII
CNS1202
CNS1109
RGMII to MII
CNS1105
BGA304
CAVIUM
cns12
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XR2206 application notes
Abstract: pin diagram of ic xr2206 IC XR2206 XR2206 XR2206 pin details for function generator XR2206 monolithic function generator xr2206 circuit peb1756ae fsk modulation and demodulation using Xr2206 MXP2
Text: Communications OTN Multi-Service OTN Muxponder/Mapper Ethernet Transport Ethernet over PDH Ethernet over SONET/SDH PDH over SONET/SDH Port Expanders SONET/SDH Multi-Ch/Multi-Rate Framer+Serdes Mappers + Framers Transceivers/CDR PDH E1 LIUs T1/E1/J1 LIUs BITS Solutions
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acqui010
350MHz
XRT8020
XRT85L61
QFN-16
TSSOP-28
XR2206 application notes
pin diagram of ic xr2206
IC XR2206
XR2206
XR2206 pin details for function generator
XR2206 monolithic function generator
xr2206 circuit
peb1756ae
fsk modulation and demodulation using Xr2206
MXP2
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TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution
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1000-pin
FDH-BGA352
15MHz)
TR6878
H1/1999
fcBGA PACKAGE thermal resistance
EBGA672
FCBGA-160
BGA PACKAGE thermal profile
FR4 GLASS EPOXY stiffener
fbga 12 x 12 thermal resistance
BGA-560P-M01
fine BGA thermal profile
BGA-576
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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BGA304
Abstract: No abstract text available
Text: T—BGA304—3131—1.27C4 Uniti nn Mar,2003
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T-BGA304-3131-1
BGA304
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