PRBG0272FA-A
Abstract: BGA272 PBGA272 P-BGA272-21x21-1 P-BGA-272
Text: JEITA Package Code P-BGA272-21x21-1.00 RENESAS Code PRBG0272FA-A Previous Code BP-272/BP-272V MASS[Typ.] 1.3g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e Y W V U T R Reference Symbol P B N Dimension in Millimeters Min Nom Max D 21.0 K E 21.0 J v 0.20 w
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P-BGA272-21x21-1
PRBG0272FA-A
BP-272/BP-272V
PRBG0272FA-A
BGA272
PBGA272
P-BGA-272
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SF-BGA272A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA272A C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] typ. 0.76mm [0.030"] typ. 24.13mm [0.950"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.40mm [Ø 0.0156"] tooling hole X2
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BGA272A
SF-BGA272A-B-11
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PBGA272
Abstract: PBGA-272 P-BGA-272 BGA272
Text: P-BGA272-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA272-2727-1
PBGA272
PBGA-272
P-BGA-272
BGA272
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SF-BGA272B-B-11
Abstract: No abstract text available
Text: D Package Code: BGA272B C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]
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BGA272B
FR4/G10
SF-BGA272B-B-11
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MPC555
Abstract: J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215
Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View LS-BGA272A-01 included PB-BGA-MPC555-01 (included) 16.10mm [0.634"] Plugged 2 1.321mm [0.052"] 5.959mm [0.235"]
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J3-37
J3-38
J1-38
J1-37
LS-BGA272A-01
PB-BGA-MPC555-01
321mm
959mm
C6215
000mm
MPC555
J137
LA-BGA-MPC555-S-B-01
PB-BGA-MPC555-01
C6215
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PBGA272
Abstract: PRBG0272DE-A P-BGA-272
Text: JEITA Package Code P-BGA272-27x27-1.27 RENESAS Code PRBG0272DE-A D Previous Code 272F7X-E MASS[Typ.] 2.8g A D1 A ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA272-27x27-1
PRBG0272DE-A
272F7X-E
PBGA272
PRBG0272DE-A
P-BGA-272
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA272 package SOT579-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA272
OT579-1
OT579-1
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PBGA-272
Abstract: PBGA272 27x27 BGA272 PRBG0272DA-A
Text: JEITA Package Code P-BGA272-27x27-1.27 RENESAS Code PRBG0272DA-A B D Previous Code 272F7X-A MASS[Typ.] 2.3g A ZD A D1 b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA272-27x27-1
PRBG0272DA-A
272F7X-A
PBGA-272
PBGA272
27x27
BGA272
PRBG0272DA-A
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BGA272
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA272:
OT579-1
MS-034
BGA272
MS-034
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BGA272
Abstract: MS-034 sot579
Text: Package outline Philips Semiconductors BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A
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BGA272:
OT579-1
MS-034
BGA272
MS-034
sot579
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BGA272
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA272:
OT579-1
BGA272
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BGA272
Abstract: MS-034 sot698
Text: PDF: 2001 Nov 14 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.75 mm SOT698-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e ∅w M C y y1 C Y W V e U T R P N M L
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BGA272:
OT698-1
MS-034
BGA272
MS-034
sot698
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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circuit diagram for micro controller based caller
Abstract: TDK 78P7200-IH 74FCT164245TPV D44 SOT23 RTD25 Framatome Connectors MS gal programming timing chart 3225 EPCOS Radiall R126 RJ45 to DB9F cable adapter
Text: To o l D es cr ip ti on , DS 1, J ul y 20 00 EASY3445 M 13 F X E v a lu a t i on S y s t e m M 13 M u lt i p le x e r a n d D S 3 F r am e r PEB3445 Datacom N e v e r s t o p t h i n k i n g . Edition 2000-07-15 Published by Infineon Technologies AG, St.-Martin-Strasse 53,
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EASY3445
PEB3445
D-81541
M13FX
EASY3445
circuit diagram for micro controller based caller
TDK 78P7200-IH
74FCT164245TPV
D44 SOT23
RTD25
Framatome Connectors MS
gal programming timing chart
3225 EPCOS
Radiall R126
RJ45 to DB9F cable adapter
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R2A25416SP
Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
Text: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.
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REJ01F0001-0300
R2A25416SP
SH7777
Renesas SH72546
Renesas SH72543
SH72544
car ECU training
sh72543
R5E72546RKBG
SH 72546
Wiring Diagram of NIPPON car center lock system
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272-Pin
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) 29.00±0.20(1.142±.008)SQ 28.50±0.20(1.122±.008)SQ 1.67(.066) 28.50(1.122)
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BGA-272P-M01
50mil
272-pin
BGA-272P-M01)
BGA272001SC-1-2
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Untitled
Abstract: No abstract text available
Text: v4.0 40MX and 42MX FPGA Families Features • QML Certification High Capacity • Ceramic Devices Available to DSCC SMD • • • • • Ease of Integration Single Chip ASIC Alternative 2,000 to 36,000 Available Logic Gates Up to 2.5 Kbits Configurable Dual-Port SRAM
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35-Bit
MIL-STD-883
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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SH7724
Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced
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32-bit
19-069F
SH7724
emmc market trend
BGA 441
R5S72620W144FP
R5F72146BDFA
R8A77240
R5F72167ADFA
R5F72145BDFP
R5F72165BDFP
SH7239
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FSQ510 Equivalent
Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Text: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178
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GP-20)
FSQ510 Equivalent
BTA12 6008
bta16 6008
ZIGBEE interface with AVR ATmega16
Precision triac control thermostat
thyristor t 558 f eupec
gw 5819 diode
transistor a564
A564 transistor
BSM25GP120 b2
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Untitled
Abstract: No abstract text available
Text: Æ ic t e ! v 3.0 - m 40MX and 42MX Families FPGAs Features • Q M L C e rtific a tio n High C a p a c ity • C eram ic Devices A va ila b le to DSCCSM D • S ingle C hip A S IC A lte rn a tiv e Ea se of I n t e g r a t i o n
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OCR Scan
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PBGA272
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PDF
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gvrp
Abstract: PLB2224 ardent Infineon Technologies Ardent
Text: P R O D U C T B R I E F Infineon’s PLB2224 is a highly integrated Layer 2+ switch-on-a-chip with twenty-four 10/100 Mbps and two 10/100/1000 Mbps Ethernet ports. The PLB2224 provides wire-speed, full-duplex switching capability on all ports. On-chip memory for packet buffers and
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PLB2224
PLB2224
B192-H7918-X-X-7600
gvrp
ardent
Infineon Technologies Ardent
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SM 44P Actel
Abstract: ST 1803 DHL
Text: Æ ic te ! v 3 .0 - m 40MXand 42MX Families FPGAs Features • Q M L C e rtific a tio n High C a p a c ity • C eram ic Devices A va ila b le to D X C S M D • S ingle C h ip AS IC A lte rn a tiv e Ea se of I n t e g r a t i o n
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OCR Scan
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40MXand
SM 44P Actel
ST 1803 DHL
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PDF
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led matrix circuits
Abstract: BGA-272P-M01
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)
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BGA-272P-M01
272-pin
BGA-272P-M01)
B272001SC-1-3
led matrix circuits
BGA-272P-M01
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