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    BGA-256 IBM Search Results

    BGA-256 IBM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA-256 IBM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Aries Land Grid Array Socket, 16x16 Grid, 256 Pin, [.050] 1.27 Pitch FEATURES: • Uses same surface mount soldering technology as BGA devices. • LGA device is accurately aligned and seated in socket base prior to mounting of top. • Controlled contact deflection.


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    PDF 16x16 256-LGA16001-V1

    88E1111-BAB

    Abstract: 88E1145-BBM 88E1111-CAA marvell 64360 Marvell 64460 88E1011S-RCJ 88E1141 88E1011S-BAB 88E1043-BCA 88E1111
    Text: S Y S T E M S E L E C T O R G U I D E Microprocessors IBM Power PC PMC-Sierra MIPS CPU Interface Timing Solutions System Controllers ICS Marvell Discovery I, II, III SDRAM/FCRAM Serial Channels Device Bus ROM, flash, logic, etc. Ethernet LEGEND PCI/PCI-X


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    PDF 750CXe Hz-600 88E1111-BAB 88E1145-BBM 88E1111-CAA marvell 64360 Marvell 64460 88E1011S-RCJ 88E1141 88E1011S-BAB 88E1043-BCA 88E1111

    F14J

    Abstract: MA142B GCLR EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B JESD-71 SRS-200
    Text: MAX 7000B プログラマブル・ロジック・ デバイス・ファミリ 2000 年 2 月 ver. 2.0 特長 Data Sheet • Preliminary Information (暫定仕様) ■ 第二世代の MAX®(Multiple Array MatriX)アーキテクチャをベースにし


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    PDF 7000B 7000S EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B F14J MA142B GCLR EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B JESD-71 SRS-200

    D4164

    Abstract: A11458 22H13 EPM7032AE EPM7064AE EPM7128A EPM7128AE EPM7256A EPM7256AE EPM7512AE
    Text: MAX 7000A Includes MAX 7000AE プログラマブル・ロジック・ デバイス・ファミリ 2000 年 8 月 ver. 3.1 特長 Data Sheet • ■ ■ ■ ■ ■ ■ ■ 第二世代の MAX®(Multiple Array MatriX)アーキテクチャをベースにし


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    PDF 7000AE JESD-71 EPM7128A EPM7256A 7000S 7000B EPM7032AE D4164 A11458 22H13 EPM7032AE EPM7064AE EPM7128A EPM7128AE EPM7256A EPM7256AE EPM7512AE

    Sis 968

    Abstract: EPF10K100GC503-4 EPM7160 Transition altera TTL library EPF6024AQC208 EPM7128 EPLD epm7192 PL-BITBLASTER PLMG7192-160 PLMQ7192/256-160NC
    Text: Newsletter for Altera Customers ◆ First Quarter ◆ February 1998 Altera’s 3.3-V ISP-Capable MAX 7000A Devices In recent years, an increasing number of engineers have moved their designs to a 3.3-V supply voltage environment. See Figure␣ 1. However, because the


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    PQFP 256

    Abstract: 256-pin BGA
    Text: Michelangelo Programmable Logic Device Family May 1997, ver. 2 Features Advance Information Brief • ■ Advance Information ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on fourth-generation Multiple Array MatriX


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    PDF 7000S PQFP 256 256-pin BGA

    K4S281632

    Abstract: TSOP sensor ISSD16M16STD micron NAND FLASH BGA
    Text: Short Form Data Sheet Part No. ISSD16M16STD Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 16M x 16 Synchronous DRAM Memory Stack Features:


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    PDF ISSD16M16STD K4S281632 TSOP sensor ISSD16M16STD micron NAND FLASH BGA

    K4S280432

    Abstract: tsop sensor 8291 tsop sensors samsung NAND FLASH BGA micron BGA SDRAM 48 tsop flash pinout
    Text: Data Sheet Part No. ISSD32M8STB Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 32M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


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    PDF ISSD32M8STB K4S280432 tsop sensor 8291 tsop sensors samsung NAND FLASH BGA micron BGA SDRAM 48 tsop flash pinout

    tsop sensor

    Abstract: TSOP 54 PIN footprint K4S280832 ISSD16M16STC tsop sensors 256 pin bga pinout Irvine Sensors
    Text: Data Sheet Part No. ISSD16M16STC Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 16M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


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    PDF ISSD16M16STC tsop sensor TSOP 54 PIN footprint K4S280832 ISSD16M16STC tsop sensors 256 pin bga pinout Irvine Sensors

    ISSD64M4STB

    Abstract: EDO sdram stc 3001
    Text: Data Sheet Part No. ISSD64M4STB Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 64M x 4 Synchronous DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a


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    PDF ISSD64M4STB ISSD64M4STB EDO sdram stc 3001

    K4S280832B

    Abstract: No abstract text available
    Text: Data Sheet Part No. ISSD32M8STC Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 32M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


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    PDF ISSD32M8STC K4S280832B

    tsop sensor

    Abstract: tsop sensors nand flash 128mbit
    Text: Data Sheet Part No. ISDD32M8STB Irvine Sensors Corporation Microelectronics Products Division 256Mbit 32M x 8 DDR DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a


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    PDF ISDD32M8STB 256Mbit 128Mbit tsop sensor tsop sensors nand flash 128mbit

    100 PIN tQFP ALTERA DIMENSION

    Abstract: epm7128stc100 84 pin plcc lattice dimension TQFP 144 PACKAGE footprint 256-pin Plastic BGA 17 x 17 epm7192 footprint tqfp 208 PLMQ7192/256-160NC SVF pcf EPF10K100B
    Text: Newsletter for Altera Customers ◆ Third Quarter ◆ August 1998 Raphael: Embedded PLD Family for System-Level Integration The new RaphaelTM programmable logic device PLD family, based on the revolutionary MultiCoreTM architecture, meets system-level design challenges by


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    nec 10f

    Abstract: CMOS-9HD electrical house wiring NEC PC 324 C CMOS9HD UPD65943 IC Ensemble NEC C 324 C nec cmos PS 229
    Text: 0.35 µm CMOS Gate Array CMOS-9HD Family .35 d e t gra e t n i ly h g i h tion uction a r e n -ge cost red d n o c Se le b a r e d Consi ay r r a e gat S O M µm C New s t c u d o r P FEATURES The CMOS-9HD Family is a channel-less type gate array that uses the 0.35-µm leading-edge process and realizes 960,000


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    PDF A12852EJ3V0PF00 nec 10f CMOS-9HD electrical house wiring NEC PC 324 C CMOS9HD UPD65943 IC Ensemble NEC C 324 C nec cmos PS 229

    PD65946

    Abstract: pd65943 PD65944 CMOS9HD 8l05 A12852JJ3V0PF00 PD65945 QFP160
    Text: 0.35 µm CMOSゲートアレイ CMOS-9HDファミリ イ ゲー S O CM m µ 0.35 現 実 積 を 高集 ダウン 代 第2世 コスト な 大幅 レ トア New s t c u Prod 特 長 CMOS-9HDファミリは,0.35 mの最先端プロセスを適応したチャネルレス・ゲートアレイで,


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    PDF CMOS-930 CMOS-8L30kCMOS-9HD53k 30kCMOS-8L A12852JJ3V0PF00 PD131ps PD107ps PD229ps PD222ps PD1396ps PD65946 pd65943 PD65944 CMOS9HD 8l05 A12852JJ3V0PF00 PD65945 QFP160

    LA-BGA-750CX-S-B-01

    Abstract: TLA700 LS-BGA256A-01 SF-BGA256A-B-02 PB-BGA-750CX-01
    Text: 67.31mm [2.650"] 23mm [0.905"] 34.79mm [1.370"] 80.01mm [3.150"] Top View 2 LS-BGA256A-01 included 12.19mm [0.480"] Side View 23.77mm [0.936"] assembled 1 8.94mm [0.352"] assembled 5.46mm [0.215"] 3 21.73mm [0.855"] PB-BGA-750CX-01 (included) SF-BGA256A-B-02


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    PDF LS-BGA256A-01 PB-BGA-750CX-01 SF-BGA256A-B-02 750CX/750CXe TLA700 LA-BGA-750CX-S-B-01 LS-BGA256A-01 SF-BGA256A-B-02 PB-BGA-750CX-01

    diodes t25 4 l9

    Abstract: EPF10K30AB356 EPF10K200E
    Text: FLEX 10KE Embedded Programmable Logic Family August 1998, ver. 1 Features. Data Sheet • Preliminary Information ■ ■ ■ Embedded programmable logic device PLD family, providing system integration in a single device – Enhanced embedded array for implementing megafunctions


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    PDF 16-bit diodes t25 4 l9 EPF10K30AB356 EPF10K200E

    toshiba laptop battery pack pinout

    Abstract: GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM
    Text: 4 volume 4 A publication of IBM Microelectronics IBM Helps Juniper Networks Produce Revolutionary Internet Backbone Router Nancy Adinolfe, R. K. Anand, and Alison Seaman In This Issue Introduction Fourth Quarter 1998, Vol. 4, No.4 1 IBM Helps Juniper Networks Produce


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    PDF 64-bit S/390TM 256-Mb 60-micron 10-mil toshiba laptop battery pack pinout GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM

    BGA PACKAGE thermal resistance

    Abstract: PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    PDF MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set

    BGA PACKAGE thermal resistance

    Abstract: PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    PDF MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604

    tdb 158 dp

    Abstract: tdb 0124 ap0aa
    Text: MPR604HSU-01 IBM Order Number MPC604EC/D (Motorola Order Number) 2/95 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    PDF MPR604HSU-01 MPC604EC/D A25/862-1, R0260, tdb 158 dp tdb 0124 ap0aa

    BGA PACKAGE thermal resistance

    Abstract: cmos 4008 304X MPC604 604 semiconductor Nippon capacitors
    Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of


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    PDF MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance cmos 4008 304X MPC604 604 semiconductor Nippon capacitors

    Altera TQFP-48

    Abstract: sparcstation
    Text: MAX 7000B Programmable Logic Devices May 1999, ver. 1 Features. Advance Inform ation Brief • ■ P re lim in a ry Inform ation ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on fifth-generation Multiple Array MatriX


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    PDF 7000B 7000S IA-AIB-M7000B-01 7000B 100-pin 144-pin 208-pin 256-pin EPM7256B Altera TQFP-48 sparcstation

    PPC604 instruction set

    Abstract: diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors
    Text: MPR604HSU-01 IBM Order Number MPC604EC/D (Motorola Order Number) 2/95 POWi A dvance Information PowerPC 604” RIS Hardware Specificali lementation of the PowerPC family of microprocessors. This document contains The PowerPC 604 microproces reduced instruction set confQ tç


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    PDF MPR604HSU-01 MPC604EC/D MOTOS263 A25/862-1, R0260, 1ATX31869-0 PPC604 instruction set diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors