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    BGA TRAY 150 Search Results

    BGA TRAY 150 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    EVAL-ADUCM430ARDZ Analog Devices BGA Evaluation Board Visit Analog Devices Buy
    EVAL-ADUCM410QSPZ Analog Devices BGA Evaluation Board Visit Analog Devices Buy
    ADSP-BF524KBCZ-4C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy
    ADSP-BF526KBCZ-4C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy
    AD8152JBPZ Analog Devices BGA 3.2Gbps 34x34 Digital Cros Visit Analog Devices Buy
    ADSP-BF525KBCZ-6C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy

    BGA TRAY 150 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		PDF 480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    nec 2565

    Abstract: SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576
    Text: TRAY CONTAINER HEAT PROOF PPE 150°C MAX 40.25 42.3 30.6 40.25 A' 25.65 A PBGA 40x40 42.3 7 84.6 3×7=21 253.8 315 322.6 SECTION A – A' 40.25 4.74 7.62 6.35 135.9 Unit : mm Applied Package Quantity (pcs) 416-pin Plastic BGA (40×40) 500-pin Plastic BGA (40×40)


    Original     		PDF 500-pin 576-pin 644-pin 416-pin SSD-A-H6921 nec 2565 SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576

    nec 2565

    Abstract: tray bga 576 tray datasheet bga
    Text: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40


    Original     		PDF 500-pin 576-pin SSD-A-H6757-1 nec 2565 tray bga 576 tray datasheet bga

    tray datasheet bga

    Abstract: tray bga
    Text: 150°C MAX 135.9 80 BGA 45 x 45 2 × 6 = 12 PPE 7 HEAT PROOF Unit : mm 45.3 A 48 37.5 45.3 240 315 322.6 SECTION A – A' 45.3 44 4.72 7.62 6.35 27.95 A' BGA 45 × 45 Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C 12 less than 1 × 10 Ω /


    Original     		PDF 480-pin 580-pin 672-pin tray datasheet bga tray bga

    tray datasheet bga

    Abstract: jedec tray BGA
    Text: TRAY CONTAINER UNIT : mm A' 7 150° C MAX. 41.45 BGA50 x 50A 50.15 53.00 51.50 50.15 NEC 53.00 135.9 2 × 5=10 PPE A 212.0 315.0 322.6 SECTION A-A' 8.10 8.50 11.50 50.15 Applied Package Quantity (pcs) 2209-pin Plastic BGA (50×50) (FLIP CHIP TYPE) 10 MAX.


    Original     		PDF BGA50 2209-pin BGA50 SSD-A-H7711 tray datasheet bga jedec tray BGA

    tray datasheet bga

    Abstract: No abstract text available
    Text: HEAT PROOF PPE 150°C MAX 40.25 42.3 30.6 40.25 A' 25.65 A PBGA 40x40 42.3 7 84.6 3×7=21 253.8 315 322.6 SECTION A – A' 40.25 4.74 7.62 6.35 135.9 Unit : mm Applied Package Quantity pcs 416-pin Plastic BGA ( 40) MAX. 21 Tray PBGA 40×40 Material Carbon PPE


    Original     		PDF 416-pin tray datasheet bga

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		PDF 15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    tray datasheet bga

    Abstract: fujitsu ic trays sol
    Text: Packing for Shipment • Packing form The packaging used to deliver products consits of tubes, trays, tapes, inner boxes, and an outer box. See Figures 1 to 7. The tubes, trays, and tapes are designed to protect the products from damage. After unpacking


    Original     		PDF DB81-10008-2E DB81-10005-1E tray datasheet bga fujitsu ic trays sol

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    reballing

    Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
    Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MR2A16A FEATURES 256K x 16 MRAM Memory • Fast 35 ns Read/Write cycle • SRAM compatible timing, uses existing SRAM controllers without redesign • Unlimited Read & Write endurance • Data non-volatile for >20 years at temperature • One memory replaces Flash, SRAM, EEPROM and


    Original     		PDF MR2A16A AEC-Q100 44-pin 48-ball MR2A16A

    Untitled

    Abstract: No abstract text available
    Text: MR0A16A FEATURES • • • • • • • • • 64K x 16 MRAM Memory 3.3 Volt power supply Fast 35ns read/write cycle SRAM compatible timing Unlimited read & write endurance Commercial, Industrial, and Extended Temperatures


    Original     		PDF MR0A16A AEC-Q100 44-pin 48-ball 1-877-347-MRAM EST00354 MR0A16A

    MR2A16AMYS35

    Abstract: MR2A16A MR2A16AMA35
    Text: MR2A16A FEATURES 256K x 16 MRAM Memory • Fast 35 ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Non-volatile for >20 years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in


    Original     		PDF MR2A16A AEC-Q100 MR2A16A 304-bit MR2A16AMYS35 MR2A16AMA35

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Burn-in & test socket BI TS Series Clamshell, BG A/ LGA Type 1.27 mm [.05”] Pitch Mechanical Durability: 10’000 cycles min. Actuation force: 1.5kgf max. DUT Heat Dissipation: 150W max. under 6 CFM. 41x41 Grid Size Max. Compressed Contact Design


    Original     		PDF 41x41 1000M

    DQU12

    Abstract: No abstract text available
    Text: MR0A16A FEATURES 64K x 16 MRAM Memory • 3.3 Volt power supply • Fast 35ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Commercial, Industrial, and Extended Temperatures


    Original     		PDF MR0A16A 44-pinâ 48-ballâ 1-877-347-MRAMâ EST00354 MR0A16A 080512a DQU12