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    BGA PACKAGE OUTLINE Search Results

    BGA PACKAGE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: MAIN INDEX GO TO WEB The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA Thin BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP


    Original     		PDF

    82439TX

    Abstract: 324-Pin f 324
    Text: 82439TX System Controller MTXC 37.0 MTXC Package Information This specification outlines the mechanical dimensions for the MTXC. The package is a 324 pin ball grid array (BGA). Figure 98. MTXC 324-pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW


    Original     		PDF 82439TX 324-pin f 324

    ADV9912

    Abstract: MO-151 Assembly Locations
    Text: CUSTOMER ADVISORY FineLine BGA Packages Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA package outline thickness*, which will result in a


    Original     		PDF MO-151. ADV9912 ADV9912 MO-151 Assembly Locations

    4-Layer

    Abstract: PIIX4 82371AB 324-PIN f 324 data sheet of Ball grid array
    Text: 82371AB PCI ISA IDE Xcelerator PIIX4 19.0 PIIX4 Package Information This specification outlines the mechanical dimensions for PIIX4. The package is a 324-pin ball grid array (BGA). Figure 36. PIIX4 324-Pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW


    Original     		PDF 82371AB 324-pin 324-P2 4-Layer PIIX4 f 324 data sheet of Ball grid array

    Untitled

    Abstract: No abstract text available
    Text: 2 Gigabit Stacked DDR2 SDRAM DD53E 256Mb x 8 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls


    Original     		PDF DD53E 256Mb 2D256M82U4BA DD53E

    U48B

    Abstract: DDR2 Mechanical Dimensions
    Text: 2 Gigabit Stacked DDR2 SDRAM DD52E 512Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls


    Original     		PDF DD52E 512Mb 2D512M42U4BA DD52E U48B DDR2 Mechanical Dimensions

    cqfp package outline

    Abstract: ceramic
    Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK


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    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		PDF SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack

    Untitled

    Abstract: No abstract text available
    Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been


    Original     		PDF DS3802 380mAh DS3802EXT DS3802 DS3816 DS3832

    DALLAS CAP

    Abstract: DS3802 DS3832C-311 nv sram
    Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been


    Original     		PDF DS3802 380mAh DS3802 DS3832C-311 DALLAS CAP nv sram

    reflow temperature rohs bga

    Abstract: No abstract text available
    Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been


    Original     		PDF DS3802 380mAh DS3802EXT DS3802 DS3816 DS3832 reflow temperature rohs bga

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    HMC265CB1

    Abstract: No abstract text available
    Text: HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.


    Original     		PDF HMC265CB1 HMC265CB1

    Untitled

    Abstract: No abstract text available
    Text: HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2000 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.


    Original     		PDF HMC265CB1 HMC265CB1

    land pattern BGA 0.75

    Abstract: BGA reflow guide BGA and CSP bo 137
    Text: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus


    Original     		PDF 96GKE/114GKF com/design/flcomp/packdata/297846 land pattern BGA 0.75 BGA reflow guide BGA and CSP bo 137

    digital rf delay line 2 GHz

    Abstract: No abstract text available
    Text: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable


    Original     		PDF MAMUSM0008 MAMUSM0008 MAMUSM0008TR MAMUSM0008-TB digital rf delay line 2 GHz

    underfill

    Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
    Text: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling


    Original     		PDF

    digital rf delay line 2 GHz

    Abstract: rf delay line MAMUSM0008 MAMUSM0008TR 72 vna 10 GHz rf delay line
    Text: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable


    Original     		PDF MAMUSM0008 MAMUSM0008 digital rf delay line 2 GHz rf delay line MAMUSM0008TR 72 vna 10 GHz rf delay line

    374124B00035G

    Abstract: T411
    Text: TAPE Attachment Method Part Number: 374124B00035G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Plastic T411 Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package


    Original     		PDF 374124B00035G 50gth 374124B00035G T411

    T411

    Abstract: 374424B00035G
    Text: TAPE Attachment Method Part Number: 374424B00035G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Plastic T411 Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package


    Original     		PDF 374424B00035G 50gth T411 374424B00035G

    T405R

    Abstract: No abstract text available
    Text: TAPE Attachment Method Part Number: 375024B00032G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Metal T405R Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package


    Original     		PDF 375024B00032G T405R T405R

    T405R

    Abstract: No abstract text available
    Text: TAPE Attachment Method Part Number: 374724B00032G This part is in stock and available for immediate delivery Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Metal T405R Black Anodize Features and Benefits • Configurations are available for a wide range of BGA package


    Original     		PDF 374724B00032G T405R T405R

    V54C3128

    Abstract: LA5A6
    Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3


    Original     		PDF V54C3128 128Mbit LA5A6

    MSAB

    Abstract: No abstract text available
    Text: MOSEL VITELIC V54C3128 16/80/40 4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3


    Original     		PDF V54C3128 128Mbit MSAB