MACH4A
Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size
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208-Ball
256-Ball
100-Ball
49-Ball
144-Ball
100-Pin
128-Pin
48-Pin
44-Pin
144-Pin
MACH4A
JTAG
jtag mhz
jtag 14
PQFP-144
ispLSI 2128-A
M4A5-64
M5A3-384
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gk 7031
Abstract: No abstract text available
Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.
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W2637A,
W2638A
W2639A
5990-3892EN
gk 7031
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W2639A
Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.
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W2637A,
W2638A
W2639A
an120
5990-3892EN
W2639A
lpddr
W2638A-101
W3635A
N5425
9104a
Oscilloscope Probe to PC
E2678A
specification of Logic Analyzer
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entek Cu-56
Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
Text: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The
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12x12 bga thermal resistance
Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE
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SZZA005
thoseI1450
12x12 bga thermal resistance
SZZA005
micro pitch BGA
A113
TMS320VC549
TMS320VC549GGU
BGA Ball Crack
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
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DDR2-667
Abstract: DDR2-800 PC2-5300 PC2-6400
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
DDR2-667
DDR2-800
PC2-5300
PC2-6400
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digital rf delay line 2 GHz
Abstract: No abstract text available
Text: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable
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MAMUSM0008
MAMUSM0008
MAMUSM0008TR
MAMUSM0008-TB
digital rf delay line 2 GHz
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digital rf delay line 2 GHz
Abstract: rf delay line MAMUSM0008 MAMUSM0008TR 72 vna 10 GHz rf delay line
Text: MAMUSM0008 Digital Switched Delay Line, 1.8 - 2.4 GHz Features V 1.00 BGA Package n 750 pS Dynamic Range, 50 pS Step Size n BGA Package n Parallel Control Interface n Positive Control Logic n Cascadable n No off chip components required Description The M/A-COM MAMUSM0008 is a 0 to 750 pS variable
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MAMUSM0008
MAMUSM0008
digital rf delay line 2 GHz
rf delay line
MAMUSM0008TR
72 vna
10 GHz rf delay line
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0.65mm pitch BGA
Abstract: BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout
Text: Application Report SPRA429A TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land
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SPRA429A
TMS320C6000
C6000
0.65mm pitch BGA
BGA reflow guide
BGA Solder Ball 0.35mm
BGA Package 0.35mm pitch
SSYZ015
TMS320C6202
0.35mm BGA fanout
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BGA reflow guide
Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
Text: Application Report SPRA429B TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land
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SPRA429B
TMS320C6000
C6000
BGA reflow guide
TMS320C6202
0.35mm BGA fanout
0.65mm pitch BGA
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V54C3128
Abstract: LA5A6
Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
LA5A6
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MSAB
Abstract: No abstract text available
Text: MOSEL VITELIC V54C3128 16/80/40 4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
MSAB
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LA5A6
Abstract: V54C3128
Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
LA5A6
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a
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VL393T2863E-E7M/E6M/D5M
128Mx72
240-PIN
VL393T2863E
128Mx8
25-bit
240-pin
240-pin,
80TYP
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H5PS2G83AFR-S6C
Abstract: CAPACITOR CK 158 VN0810 DDR2-800 PC2-6400 DDR2 samsung pc2-6400 samsung dram H5PS2G83AFR
Text: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a
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VL491T2863B-E7S
128Mx72
200-PIN
VL491T2863B
128Mx8
200-pin
200-pin,
VN-081009
H5PS2G83AFR-S6C
CAPACITOR CK 158
VN0810
DDR2-800
PC2-6400
DDR2 samsung pc2-6400
samsung dram
H5PS2G83AFR
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240-PIN
Abstract: DDR2-533 DDR2-667 DDR2-800 PC2-5300 PC2-6400
Text: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a
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VL393T2863E-E7M/E6M/D5M
128Mx72
240-PIN
VL393T2863E
128Mx8
25-bit
240-pin
240-pin,
80TYP
DDR2-533
DDR2-667
DDR2-800
PC2-5300
PC2-6400
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H5PS2G83AFR-S6C
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a
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VL491T2863B-E7S
128Mx72
200-PIN
VL491T2863B
128Mx8
200-pin
200-pin,
VN-081009
H5PS2G83AFR-S6C
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Untitled
Abstract: No abstract text available
Text: ESMT M13S128168A Operation temperature condition -40°C~85°C Revision History Revision 1.0 03 Jan. 2007 - Original Revision 1.1 (19 Mar. 2008) - Add BGA package - Modify the waveform of Power up & Initialization Sequence - Modify the θ value of TSOPII package dimension
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M13S128168A
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Transistor 5C5
Abstract: No abstract text available
Text: IC71V08F32xS08 IC71V16F32xS08 Document Title 3.0 Volt-Only Flash & SRAM COMBO with Stacked Multi-Chip Package MCP - 32 Mbit Simultaneous Operation Flash Memory and 8 Mbit Static RAM Revision History Revision No History Draft Date 0A 0B Initial Draft Add 73 ball BGA package
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IC71V08F32xS08
IC71V16F32xS08
MCP001-0B
73-ball
IC71V16F32CS08-85B73
IC71V16F32DS08-85B73
Transistor 5C5
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Untitled
Abstract: No abstract text available
Text: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).
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TMS320C6472
SPRS612G
TMS320C6472
500-MHz
625-MHz
737-Pin
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TS512MQR72V4T
Abstract: No abstract text available
Text: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Description Placement The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs
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240PIN
4096MB
256Mx4
TS512MQR72V4T
TS512MQR72V4T
72bits
DDR2-400
512Mx4bits
240-pin
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TXS0104EZXUR
Abstract: TXS01xx
Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3
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TXS0104E
SCES651C
000-V
A114-B)
A115-A)
15-kV
TXS0104EZXUR
TXS01xx
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TXS0104EPWR
Abstract: YF04E TXS0104ED TXS0104EYZTR TXS0104EZXUR YF04
Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3
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TXS0104E
SCES651C
000-V
A114-B)
A115-A)
15-kV
TXS0104EPWR
YF04E
TXS0104ED
TXS0104EYZTR
TXS0104EZXUR
YF04
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