BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA 731
Abstract: bga thermal cycling reliability material for ball grid array packaging
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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Surface Insulation Resistance FR 4 PCB
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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VRMS/150
Surface Insulation Resistance FR 4 PCB
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Untitled
Abstract: No abstract text available
Text: BGA Adapter Sockets Ball Grid Array BGA Adapter Sockets Table of Models Description: Standard Socket (S) Material: High Temp. Liquid Crystal Polymer (LCP)* Index: -60°C to 260°C (-76°F to 500°F) Insulator Size: Same size as BGA device body Description: Extraction Socket (SB)
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CAT16-PREVIEW06
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Untitled
Abstract: No abstract text available
Text: Product Number: 582-11-731-17-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 731-17-005 34 X 34
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C17200)
64-56A
64-22A/31A
65-17A
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Abstract: No abstract text available
Text: Product Number: 587-10-731-17-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 731-17-005 34 X 34 # Of Pins Mill-Max Part Number 731 587-10-731-17-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
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C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
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BGA reflow guide
Abstract: No abstract text available
Text: BGA Socket Adapter System Features: • Facilitates easy insertion and withdrawal for high pin count Ball Grid Array devices. • Four extraction screws supplied allow BGA adapter to be easily removed from socket. Screws push off socket insulator without
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AH35
Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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EP20K1000C
652-Pin
672-Pin
020-Pin
AH35
AA10
AM11
AN10
AN11
817 g24
b34 844
AB30
af31
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AA10
Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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EP20K600C
652-Pin
672-Pin
020-Pin
AA10
AE10
AF10
AG10
AJ10
AK10
AF31
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BGA 731
Abstract: No abstract text available
Text: Ball Grid Array BGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Sockets Standard Socket (S): • Mates with Standard Adapter (A)
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63Sn/37Pb,
BGA 731
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F33 1067
Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6
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EP20K1500C
652-Pin
020-Pin
F33 1067
1010 817 f15
AA10
AM11
AN10
837 B34
AM3 940
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292 MAPBGA
Abstract: cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XE S12XEETX4KV2 BA 508 C0 S12XMMCV3
Text: Data Sheet Covers MC9S12XHZ384, MC9S12XHZ256 HCS12X Microcontrollers MC9S12XHZ512 Rev. 1.05 11/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
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MC9S12XHZ384,
MC9S12XHZ256
HCS12X
MC9S12XHZ512
S12XE
11/200OWERED
292 MAPBGA
cluster stepper motor pp e
MC9S12XHZ256
MC9S12XHZ512
HCS12X
MC9S12XHZ384
S12XEETX4KV2
BA 508 C0
S12XMMCV3
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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IC BOSCH 30536
Abstract: Bosch throttle body motor MPC5606SRM MPC5606S 2PCS02 transistor h331 S13 instrument cluster schematic bosch edc 17 EIC 4021 eMIOS200
Text: Devices Supported: MPC5602S MPC5604S MPC5606S MPC5606SRM Rev. 5 4 May 2010 MPC5606S Microcontroller Reference Manual, Rev. 5 Freescale Semiconductor 1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are
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MPC5606S
MPC5606SRM
MPC5602S
MPC5604S
MPC5606S
IC BOSCH 30536
Bosch throttle body motor
2PCS02
transistor h331
S13 instrument cluster schematic
bosch edc 17
EIC 4021
eMIOS200
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mc68302FE16
Abstract: omron liteon power supply PC LITE-ON 18 pin "eye pattern generator" Nippon capacitors differential code shift keying omron e5a valor
Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: ZEUS Freescale Semiconductor, Inc.
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ATM-18
Abstract: CX28229-14 CX28225-14 DG 7-119 GSM modem M10 CX28224-14 CX28225 CX28229 512K16
Text: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-D March 2004 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C
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CX28224/5/9
28229-DSH-001-D
CX28224
CX28224-14
256-pin,
CX28225
CX28225-14
CX28229
CX28229-14
ATM-18
CX28229-14
CX28225-14
DG 7-119
GSM modem M10
CX28224-14
CX28225
CX28229
512K16
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manual PACE PSR 800 Plus
Abstract: Circuit diagram of 3d output surround sound system
Text: DSP56303UM Rev. 2, October 2005 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56303
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DSP56303
DSP56303
DSP56303UM
CH370
Index-14
manual PACE PSR 800 Plus
Circuit diagram of 3d output surround sound system
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Abstract: No abstract text available
Text: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).
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TMS320C6472
SPRS612G
TMS320C6472
500-MHz
625-MHz
737-Pin
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MC9S12XEG384
Abstract: 3M25J LOG RX2 diagram bosch al 1450 dv TCNT20 CPU12XV2 Freescale HCS12X PFlash
Text: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
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MC9S12XEP100
MC9S12XE
HCS12X
MC9S12XEP100RMV1
S12XE-Family
MC9S12XEG384
3M25J
LOG RX2
diagram bosch al 1450 dv
TCNT20
CPU12XV2
Freescale HCS12X PFlash
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)
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3M25J
Abstract: S12XEG256 9S12XEG384 2M53J 5m48h led 30 pin diagram lvds 2949 MC9S12XEG256 9S12XEG128 S12XEQ512 MC9S12XEG384
Text: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
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MC9S12XEP100
MC9S12XE
HCS12X
MC9S12XEP100RMV1
S12XE-Family
3M25J
S12XEG256
9S12XEG384
2M53J
5m48h
led 30 pin diagram lvds 2949
MC9S12XEG256
9S12XEG128
S12XEQ512
MC9S12XEG384
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Untitled
Abstract: No abstract text available
Text: SIEMENS BGA 318 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 Q-gain block • 16 dB typical gain at 1.0 GHz • 12 dBm typical P_1db at 1.0 G • 3 dB-bandwidth: DC to 1.2 G\ R F IN o Circuit Diagram EHM 7312 Type Marking Ordering Code
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OCR Scan
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Q62702-G0043
OT-143
collect38
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Untitled
Abstract: No abstract text available
Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and
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SLC90E42
SLC90E42
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