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    BGA 40 X 40 MM ST Search Results

    BGA 40 X 40 MM ST Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 40 X 40 MM ST Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BCM84848

    Abstract: CAT6A cables BCM984848 DSQ128 MACsec QSFP DAC macsec otn interr_mlc 10GBASE-T 1000BASE-T
    Text: B ro ad co m B CM 8 4 8 4 8 Q u ad 10 GBAS E- T Tra n s ce i ve r FOUR-PORT 10GBASE-T TRANSCEIVER Overview Highlights • The BCM84848 delivers a second-generation 40 nm 10GBASE-T PHY in a small 23 x 23 mm BGA package. • Standard 1RU switching platforms can implement a singlerow PHY design with this 23 x 23


    Original     		PDF 10GBASE-T 1588v2 BCM84848 100BASE-TX, 1000BASE-T 48-port CAT6A cables BCM984848 DSQ128 MACsec QSFP DAC macsec otn interr_mlc

    Wakefield Thermal Solutions

    Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
    Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:


    Original     		PDF

    LQFP-48 thermal pad

    Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
    Text: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized


    Original     		PDF G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


    Original     		PDF WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412

    BGA 64 PACKAGE thermal resistance

    Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
    Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight


    Original     		PDF 624-25AB 624-35AB 624-45AB 624-60AB BGA 64 PACKAGE thermal resistance BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB

    7476

    Abstract: P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB
    Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 , PowerPC™ 601 659 SERIES Standard P/N 659-65AB ̆ 14 x 14, 38, 40 mm CQFP Base Dimensions in. mm Height in. (mm)


    Original     		PDF Am386 659-65AB 7476 P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB

    C4 to BGA

    Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
    Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball


    Original     		PDF MX23L1612 16M-BIT D15/A-1 JUN/23/2003 C4 to BGA MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815

    capacitance in BGA package

    Abstract: MX23L3214XI-90G MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 top 48 C1 C4 to BGA
    Text: MX23L3214 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2Mb x 16 word mode only • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V


    Original     		PDF MX23L3214 32M-BIT MAY/30/2005 capacitance in BGA package MX23L3214XI-90G MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 top 48 C1 C4 to BGA

    MX23L3214

    Abstract: MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 MX23L3214XI-90G
    Text: MX23L3214 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2Mb x 16 word mode only • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V


    Original     		PDF MX23L3214 32M-BIT MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 MX23L3214XI-90G

    Untitled

    Abstract: No abstract text available
    Text: CY62147DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH or both BLE and BHE are HIGH). The


    Original     		PDF CY62147DV30 I/O15) CY62147CV25, CY62147CV30, CY62147CV33 70-ns 45-ns 44-lead

    CY62146CV30

    Abstract: CY62146DV30 CY62146DV30L
    Text: CY62146DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through


    Original     		PDF CY62146DV30 I/O15) CY62146CV30 CY62146DV30 45-ns 44-lead CY62146CV30 CY62146DV30L

    IS61LPS12832A

    Abstract: No abstract text available
    Text: IS61 64 LPS12832A IS61(64)LPS12836A IS61(64)VPS12836A IS61(64)LPS25618A IS61(64)VPS25618A DECEMBER 2013 128K x 32, 128K x 36, 256K x 18 4 Mb SYNCHRONOUS PIPELINED, Single CYCLE DESELECT STATIC RAM FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write


    Original     		PDF LPS12832A LPS12836A VPS12836A LPS25618A VPS25618A IS61LPS12832A

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V
    Text: CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


    Original     		PDF CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    780 AC

    Abstract: gx 552 734 10 pins
    Text: 1. Introduction SIIGX51001-1.6 The Stratix II GX family of devices is Altera’s third generation of FPGAs to combine high-speed serial transceivers with a scalable, high-performance logic array. Stratix II GX devices include 4 to 20 high-speed transceiver channels, each incorporating clock and data


    Original     		PDF SIIGX51001-1 780 AC gx 552 734 10 pins

    Untitled

    Abstract: No abstract text available
    Text: 1. Introduction SIIGX51001-1.5 The Stratix II GX family of devices is Altera’s third generation of FPGAs to combine high-speed serial transceivers with a scalable, high-performance logic array. Stratix II GX devices include 4 to 20 high-speed transceiver channels, each incorporating clock and data


    Original     		PDF SIIGX51001-1

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    strataflash 512 p30

    Abstract: Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-N S29GL-A S29GL-M
    Text: Migrating to the Spansion S29GL-N Flash Family from Intel StrataFlash Memory J3 /Embedded Memory (P30) Devices Application Note Introduction This application note provides conversion guidelines to Spansion™ S29GL-N Flash Family devices from Intel StrataFlash® Memory (J3) and Intel StrataFlash® Embedded Memory (P30) devices.


    Original     		PDF S29GL-N S29GL-N J3/P30 strataflash 512 p30 Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-A S29GL-M

    CY62138CV25

    Abstract: CY62138CV30 CY62138CV33 CY62138V
    Text: MoBL CY62138CV25/30/33 MoBL 2M 256K x 8 Static RAM Features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has an automatic power-down feature that significantly reduces power consumption


    Original     		PDF CY62138CV25/30/33 CY62138CV25: CY62138CV30: CY62138CV33: CY62138V CY62138CV25/30/33 CY62138CV25 CY62138CV30 CY62138CV33 CY62138V

    top 48 C1

    Abstract: TSOP 86 Package MX23L8103 MX23L8103TC-12 MX23L8103TC-70 MX23L8103TC-90 MX23L8103TI-12 MX23L8103TI-70 MX23L8103TI-90 commercial grade item
    Text: MX23L8103 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)


    Original     		PDF MX23L8103 D15/A-1 MAY/03/2004 top 48 C1 TSOP 86 Package MX23L8103 MX23L8103TC-12 MX23L8103TC-70 MX23L8103TC-90 MX23L8103TI-12 MX23L8103TI-70 MX23L8103TI-90 commercial grade item

    GS8662D08E-333

    Abstract: GS8662D08E-167 GS8662D08E-200 GS8662D08E-250 GS8662D08E-300 GS8662D09GE-200
    Text: Preliminary GS8662D08/09/18/36E-333/300/250/200/167 72Mb SigmaQuad-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		PDF GS8662D08/09/18/36E-333/300/250/200/167 165-Bump 144Mb 165-bump, GS8662D36GE-250I GS8662D36GE-200I GS8662D36GE-167I GS8662D08E-333 GS8662D08E-167 GS8662D08E-200 GS8662D08E-250 GS8662D08E-300 GS8662D09GE-200

    GS8342Q10BD-357

    Abstract: GS8342Q37BD-200I 8342Q07101937B
    Text: GS8342Q07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8342Q07/10/19/37BD-357/333/300/250/200 165-Bump 165-bump, GS8342QxxBD-300T. GS8342Q10BD-357 GS8342Q37BD-200I 8342Q07101937B

    GS8662DT19BD-400

    Abstract: No abstract text available
    Text: GS8662DT07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662DT07/10/19/37BD-450/400/350/333/300 165-Bump 165-bump, GS8662DTxxD-300T. GS8662DT19BD-400

    GS8182D

    Abstract: No abstract text available
    Text: GS8182D08/09/18/36BD-400/375/333/300/250/200/167 18Mb SigmaQuad-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		PDF 08/09/18/36BD-400/375/333/300/250/200/167 165-Bump 144Mb 165-bump, GS8182D