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    BGA 40 X 40 MM ST Search Results

    BGA 40 X 40 MM ST Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation
    7MMV4101S15BG Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    BGA 40 X 40 MM ST Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BCM84848

    Abstract: CAT6A cables BCM984848 DSQ128 MACsec QSFP DAC macsec otn interr_mlc 10GBASE-T 1000BASE-T
    Text: B ro ad co m B CM 8 4 8 4 8 Q u ad 10 GBAS E- T Tra n s ce i ve r FOUR-PORT 10GBASE-T TRANSCEIVER Overview Highlights • The BCM84848 delivers a second-generation 40 nm 10GBASE-T PHY in a small 23 x 23 mm BGA package. • Standard 1RU switching platforms can implement a singlerow PHY design with this 23 x 23


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    10GBASE-T 1588v2 BCM84848 100BASE-TX, 1000BASE-T 48-port CAT6A cables BCM984848 DSQ128 MACsec QSFP DAC macsec otn interr_mlc PDF

    Wakefield Thermal Solutions

    Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
    Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:


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    LQFP-48 thermal pad

    Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
    Text: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized


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    G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144 PDF

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


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    WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 PDF

    BGA 64 PACKAGE thermal resistance

    Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
    Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight


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    624-25AB 624-35AB 624-45AB 624-60AB BGA 64 PACKAGE thermal resistance BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB PDF

    EP1S60

    Abstract: No abstract text available
    Text: 1. Introduction S51001-3.2 Introduction The Stratix family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper SRAM process, with densities of up to 79,040 logic elements LEs and up to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal


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    S51001-3 420-MHz 484-Pin 672-Pin 780-Pin EP1S20 EP1S25 EP1S10 956-Pin EP1S60 PDF

    EP1S60

    Abstract: No abstract text available
    Text: Chapter 1. Introduction S51001-3.1 Introduction The Stratix family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper SRAM process, with densities of up to 79,040 logic elements LEs and up to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal


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    S51001-3 420-MHz EP1S20 EP1S25 EP1S10 672-Pin 956-Pin 508-Pin 020-Pin EP1S30 EP1S60 PDF

    7476

    Abstract: P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB
    Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 , PowerPC™ 601 659 SERIES Standard P/N 659-65AB ̆ 14 x 14, 38, 40 mm CQFP Base Dimensions in. mm Height in. (mm)


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    Am386 659-65AB 7476 P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB PDF

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


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    C4 to BGA

    Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
    Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball


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    MX23L1612 16M-BIT D15/A-1 JUN/23/2003 C4 to BGA MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815 PDF

    Untitled

    Abstract: No abstract text available
    Text: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put


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    CY62137CV25/30/33 CY62137CV CY62137V 70-ns 48-ball PDF

    Untitled

    Abstract: No abstract text available
    Text: CY62147DV30 4-Mbit 256K x 16 Static RAM Features • Temperature Ranges — Industrial: –40°C to +85°C — Automotive: –40°C to +125°C • Very high speed: 45 ns • Wide voltage range: 2.20V–3.60V • Pin-compatible with CY62147CV25, CY62147CV30, and


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    CY62147DV30 CY62147CV25, CY62147CV30, CY62147CV33 48-ball 44-pin 70-ns 45-ns 44-lead PDF

    Untitled

    Abstract: No abstract text available
    Text: MX23L3214 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2Mb x 16 word mode only • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V


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    MX23L3214 32M-BIT H28/2001 JUL/11/2001 JUL/13/2001 SEP/27/2001 MAR/12/2002 MAR/31/2003 PDF

    capacitance in BGA package

    Abstract: MX23L3214XI-90G MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 top 48 C1 C4 to BGA
    Text: MX23L3214 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2Mb x 16 word mode only • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V


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    MX23L3214 32M-BIT MAY/30/2005 capacitance in BGA package MX23L3214XI-90G MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 top 48 C1 C4 to BGA PDF

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V ultra fine pitch BGA
    Text: CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


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    CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V ultra fine pitch BGA PDF

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V
    Text: 38CV25/30/3 CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


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    38CV25/30/3 CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: EnablY62138CV CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V PDF

    MX23L3214

    Abstract: MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 MX23L3214XI-90G
    Text: MX23L3214 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2Mb x 16 word mode only • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V


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    MX23L3214 32M-BIT MX23L3214 MX23L3214TI-80 MX23L3214TI-90 MX23L3214XI-10 MX23L3214XI-70 MX23L3214XI-90 MX23L3214XI-90G PDF

    Micro-ACE-TE

    Abstract: No abstract text available
    Text: Micro-ACE , Micro-ACE-TE, and PCI Micro-ACE-TE Product Brief Models: BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 DDC's Micro-ACE series of MIL-STD-1553 terminals with 1553 protocol, memory, and either +3.3V or +5V transceiver, in a small plastic BGA. This series is ideal for use in mixed voltage applications where PC board space is limited.


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    BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 MIL-STD-1553 MIL-STD-1760 128-ball 324-ball AS9100 Micro-ACE-TE PDF

    Untitled

    Abstract: No abstract text available
    Text: 128K x36/32 and 256K x18 4Mb, ECC, PIPELINE 'NO WAIT' STATE BUS SYNCHRONOUS SRAM MARCH 2014 FEATURES • 100 percent bus utilization • No wait cycles between Read and Write


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    NLP12836EC/IS61 NVP12836EC/IS61 NLP12832EC NVP12832EC/IS61 NLP25618EC/IS61 NVP25618EC x36/32 100-pin PDF

    Untitled

    Abstract: No abstract text available
    Text: CY62147DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH or both BLE and BHE are HIGH). The


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    CY62147DV30 I/O15) CY62147CV25, CY62147CV30, CY62147CV33 70-ns 45-ns 44-lead PDF

    CY62146CV30

    Abstract: CY62146DV30 CY62146DV30L
    Text: CY62146DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through


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    CY62146DV30 I/O15) CY62146CV30 CY62146DV30 45-ns 44-lead CY62146CV30 CY62146DV30L PDF

    Untitled

    Abstract: No abstract text available
    Text: THIS SPEC IS OBSOLETE Spec No: 38-05339 Spec Title: CY62146DV30 MoBL R 4-Mbit (256K x 16) Static RAM Sunset Owner: Anuj Chakrapani (AJU) Replaced by: None CY62146DV30 MoBL 4-Mbit (256K x 16) Static RAM Features an automatic power-down feature that significantly reduces


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    CY62146DV30 I/O15) PDF

    CY62146CV30

    Abstract: CY62146DV30 CY62146DV30L
    Text: CY62146DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through


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    CY62146DV30 I/O15) CY62146CV30 CY62146DV30 45-ns 44-lead CY62146CV30 CY62146DV30L PDF

    CY62137CV

    Abstract: CY62137CV25 CY62137CV30 CY62137CV33 CY62137V ba48
    Text: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Features Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put


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    CY62137CV25/30/33 CY62137CV I/O15) CY62137CV25 CY62137CV30 CY62137CV33 CY62137V ba48 PDF