BGA 31 X 31 TRAY Search Results

BGA 31 X 31 TRAY Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

BGA 31 X 31 TRAY Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
tray 20 x 14 Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type	Original	E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray	PDF
LGA 2011 Socket diagram Abstract: senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.1.01 Mar 2011 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please	Original	propert8175-9600, R50ZZ0003EJ0101 REJ11K0001-0900) LGA 2011 Socket diagram senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray	PDF
SPANSION S29GL128 Abstract: s29gl128 S29GL128* FOOTPRINT GL128N GL256N S29GL128N S29GL256N FAA064 0C700000 SA148 Text: S29GL128/256N MirrorBit Flash with Alternative BGA Pinout 128 and 256 Megabit, 3.0 Volt-only Page Mode Flash Memory featuring 110 nm MirrorBit Process Technology ADVANCE INFORMATION Data Sheet Supplement Notice to Readers: The Advance Information status indicates that this	Original	S29GL128/256N SPANSION S29GL128 s29gl128 S29GL128* FOOTPRINT GL128N GL256N S29GL128N S29GL256N FAA064 0C700000 SA148	PDF
s29al004d55 Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032 Text: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)	Original	Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG s29al004d55 S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032	PDF
spansion part marking Abstract: Spansion S29GL256N spansion top marking SPANSION s29al016d s29al016 S29AL016D90TAI020 Am29LV256MH113REI S29AL016D70BAI010 S29GL128N10FAI010 S29AL016D70TFI020 Text: FLASH MEMORY OPN MAP GUIDE November, 2004 Release for: S29AL016D S29AL016M S29JL032H S29GL032M S29GL064M S29GL128N S29GL256N Spansion Order Part Number OPN Mapping Guide Use this tool to map an AMD OPN to its corresponding Spansion OPN. NOTE: This list may not include every available OPN. Please consult the	Original	S29AL016D S29AL016M S29JL032H S29GL032M S29GL064M S29GL128N S29GL256N spansion part marking Spansion S29GL256N spansion top marking SPANSION s29al016d s29al016 S29AL016D90TAI020 Am29LV256MH113REI S29AL016D70BAI010 S29GL128N10FAI010 S29AL016D70TFI020	PDF
PCB design for very fine pitch csp package Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A	PDF
smd transistor mark E13 Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4	PDF
CM16C550P Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of	Original	74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP	PDF
philips diode PH 33J Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY Text: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without	Original	10-BIT QS3L384) QS3L2384 QS3L384 QS3L2384 philips diode PH 33J UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY	PDF
UM61256FK-15 Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624 Text: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch	Original	74F257, 74FCT257, 74FCT257T QS32257 QS3257 QS32257 UM61256FK-15 YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624	PDF
socket 939 Abstract: foxconn Text: SPECIFICATIONS BGA 939 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”]Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.	Original	13kgf 750gf 240gf 1000m Type50 31X31 socket 939 foxconn	PDF
footprint jedec MS-026 TQFP 128 Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original	FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228	PDF
schematic impulse sealer Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original	FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481	PDF
schematic impulse sealer Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").	Original	PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN	PDF

TB-2082 Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02	Original	TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
reballing Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.	Original		PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
spansion part marking Abstract: GL032M10F Text: �� S29GL032M MirrorBit Flash Memory TM 32 Megabit 2 M x 16-Bit / 4 M x 8-Bit Spansion Overview FEATURES AND BENEFITS	Original	S29GL032M 16-Bit ISO/TS16949 ISO9001 S29GL032M10FA1010 GL032M10FAI01. Am29LV320MT/B MBM29PL32T/BM 1-866-SPANSION 3018A spansion part marking GL032M10F	PDF
Untitled Abstract: No abstract text available Text: �� S29AL016M MirrorBit Flash Memory TM 16 Megabit 1 M x 16-Bit / 2 M x 8-Bit Spansion Overview FEATURES AND BENEFITS	Original	S29AL016M 16-Bit ISO/TS16949 ISO9001 S29AL016M10FA1010 AL016M10FAI01. 1-866-SPANSION 3023A	PDF
NtRAM Abstract: BGA package tray 64 Text: High Speed SRAM Code Information 1/4 Last Updated : November 2008 K7XXXXXXXX - XXXXXXX 1 2 3 4 5 6 1. Memory (K) 2. Sync SRAM : 7 3. Small Classification A : Sync Pipelined Burst B : Sync Burst D : Double Data Rate I : Double Data Rate II, Common I/O J : Double Data Rate II, Seperate I/O	Original	TSOP2-400 NtRAM BGA package tray 64	PDF
N04T1630C1BTR Abstract: N04T1630C2BZ TSOP2-44 Text: N04T1630C1B N04T1630C2B NanoAmp Solutions, Inc. 1982 Zanker Road, San Jose, CA 95112 ph: 408-573-8878, FAX: 408-573-8877 www.nanoamp.com 4Mb Ultra-Low Power Asynchronous CMOS SRAM 256Kx16 bit Overview Features The N04T1630C2B is an integrated memory device containing a low power 4 Mbit SRAM built	Original	N04T1630C1B N04T1630C2B 256Kx16 N04T1630C2B N04T1630C1BTR N04T1630C2BZ TSOP2-44	PDF

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BGA 31 X 31 TRAY Search Results

BGA 31 X 31 TRAY Result Highlights (5)

BGA 31 X 31 TRAY Datasheets Context Search

tray 20 x 14

LGA 2011 Socket diagram

SPANSION S29GL128

s29al004d55

spansion part marking

PCB design for very fine pitch csp package

smd transistor mark E13

CM16C550P

philips diode PH 33J

UM61256FK-15

socket 939

footprint jedec MS-026 TQFP 128

schematic impulse sealer

schematic impulse sealer

TB-2082

BFG95

xilinx topside marking

XILINX/part marking Hot

reballing

qfn 3x3 tray dimension

spansion part marking

Untitled

NtRAM

N04T1630C1BTR