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    BGA 23X23 0.8 Search Results

    BGA 23X23 0.8 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 23X23 0.8 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    BGA 23X23

    Abstract: bga 529 LS-BGA529D-61 BGA 23X23 1
    Text: 19mm [0.748"] Top View 0.7mm [0.028"] 0.7mm [0.028"] 19mm [0.748"] 0.8mm typ. 17.6mm square [0.693"] Side View 1 3.52mm [0.139"] 2 0.2mm dia. [0.008"] 1.67mm [0.066"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		PDF FR4/G10 23x23 LS-BGA529D-61 BGA 23X23 bga 529 BGA 23X23 1

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		PDF 13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20

    BG329

    Abstract: BGA 27X27 pitch
    Text: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines


    Original     		PDF CS128 CS180 BG272 BG313 BG329 FG144 FG256 FG484 FG676 FG896 BGA 27X27 pitch

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    STV0289

    Abstract: sti5189 analog satellite tuner stv0289 ST40-300 STV0289 date code PBGA 23X23 0.8 pitch jtag st dvb-s transmitter design MPX audio ENCODER TUNER transport stream
    Text: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data Brief Features • Extensive connectivity USB 2.0 host/ULPI, Ethernet MAC MII/RMII, MPX, DVB-CI ■ External memory interface supporting NOR, NAND and serial Flash ■


    Original     		PDF STi5189 STV0289 sti5189 analog satellite tuner stv0289 ST40-300 STV0289 date code PBGA 23X23 0.8 pitch jtag st dvb-s transmitter design MPX audio ENCODER TUNER transport stream

    SG-BGA-6110

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm SG-BGA-6110 863mm 025mm 725mm

    404-pin

    Abstract: WK-1 404P 4403-P
    Text: EMBOSSED TAPE CONTAINER Tape Dimensions Unit : mm Symbol φ D0 P2 P0 W S F B0 P E T d de sp tail ro of ck et h K1 K0 ole A0 φ D1 Direction of Feed D0 2 Specification A0 23.2 B0 23.2 K0 2.70 K1 1.55 W 44.0±0.3 F 20.2±0.1 E 1.75±0.1 P 32.0±0.1 P2 2.0±0.1


    Original     		PDF 404-pin SSD-A-H7827 WK-1 404P 4403-P

    GAL20V8B-15LD

    Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
    Text: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.


    Original     		PDF I0162 GAL20V8B-15LD pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2

    SG-BGA-6045

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm micro16/09, 863mm 025mm 725mm SG-BGA-6045 125mm.

    SG-BGA-6055

    Abstract: BGA 23X23 0.8
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection 30.50mm Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		PDF 600mm 000mm 100mm 025mm SG-BGA-6055 125mm BGA 23X23 0.8

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    NP276-11904-3

    Abstract: 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327
    Text: NP276 Series Open Top Ball Grid Array (BGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 30m Ω max. at 10mA/20mV max.


    Original     		PDF NP276 10mA/20mV NP276-11904-x Positioni45 NP276-11904-3 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432

    EA-190-H125-T710

    Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
    Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow


    Original     		PDF UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    17x17 bga thermal resistance

    Abstract: BG728 12x12 bga thermal resistance
    Text: R Thermal Data Thermal Considerations Due to the variety of applications in which Virtex-II FPGA devices are likely to be used, it is traditionally a challenge to predict the power requirements, and thus the thermal management needs, of a particular application. Virtex-II devices in general are


    Original     		PDF UG002 17x17 bga thermal resistance BG728 12x12 bga thermal resistance

    xxxxx

    Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
    Text: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：SALES@PRECIDIP.COM 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码


    Original     		PDF 100VRMS150VDC Preci-DipULE174442 3NMIL-DTL-83734, EIA481 500VAC10 540PLCC PPS-GF30-FR UL94V-O 600VRMS 540PCB xxxxx 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR

    qt2025

    Abstract: QT2225 QT2225-1 S4886 QT2025-1 S19262 AMCC S4882 S4882 S19258 S19233
    Text: ɈɩɳȹɝĘɈअౠ Product Selector Guide ȹȤɃɁ ɕȡɖɪɃȯ ɕɬĘɞɞɃɑ ɇĘȿȳɠǗȕȀ Ɇɬȳɠಞซॾ PHY ɇɐȤȹ Product Selector Guide ࠖซþ૟ঝþࡼ೧ȹɈɬĘȸǻ ۛ‫ژ‬ǻȽɪɥĘȷɧɳȟળԽ ɍɃɈɯĘȯ ȳɳɐĘȸȧɳȹ ɈɪɗɫɗɬȤ


    Original     		PDF QT2022/QT2032 QT2025 QT2025-1 QT2045 QT2225 QT2225-1 S1212/S1220 S1213/S1221 S1216/S1217 S19233/S19256 qt2025 QT2225 QT2225-1 S4886 QT2025-1 S19262 AMCC S4882 S4882 S19258 S19233

    STV0289

    Abstract: sti5189 STV0289 date code st40 jtag analog satellite tuner stv0289 st40 Application CPU ST40-300 DVB-S FEC demodulator jtag st TELETEXT TRANSMITTER
    Text: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data brief Features • Advanced security features, compatible with the latest CA requirements ■ Satellite STBs can be produced with very small BOM and two-layer PCBs ■ DVB-S compliant


    Original     		PDF STi5189 23x23 15x15 16-bit STV0289 sti5189 STV0289 date code st40 jtag analog satellite tuner stv0289 st40 Application CPU ST40-300 DVB-S FEC demodulator jtag st TELETEXT TRANSMITTER

    G770LE

    Abstract: PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide pxa270 PXA270 usb
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 G770LE PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide PXA270 usb

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30