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    BGA 10X10 Search Results

    BGA 10X10 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 10X10 Price and Stock

    KEMET Corporation C1210X103MBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 0.01uF 20% C0G 1210 Flex Term
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1210X103MBGACTU
    • 1 -
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    • 1000 -
    • 10000 $0.51
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    KEMET Corporation C1210X103JBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 0.01uF 5% C0G 1210 Flex Term
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1210X103JBGACTU
    • 1 -
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    • 10000 $0.6
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    Fischer Elektronik GmbH & Co KG ICK BGA 10 X 10 X 10

    Heat Sink; Thermal Resistance:28.5°C/W; Packages Cooled:Bga; External Width - Metric:10Mm; External Height - Metric:10.01Mm; External Length - Metric:10Mm; External Diameter - Metric:-; Heat Sink Material:Aluminum; Product Range:- Rohs Compliant: Yes |Fischer Elektronik ICK BGA 10 X 10 X 10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 10 X 10 X 10 Bulk 1,571 1
    • 1 $2.74
    • 10 $2.74
    • 100 $2.74
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    TME ICK BGA 10 X 10 X 10 803 1
    • 1 $1.23
    • 10 $1
    • 100 $0.77
    • 1000 $0.77
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    Fischer Connectors ICK BGA 10X10X10 (ALTERNATE: 6744747)

    Heatsink, BGA, 28.5K/W, 10 x 10 x 10mm, Adhesive Foil, Conductive Foil Mount | Fischer ICK BGA 10X10X10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ICK BGA 10X10X10 (ALTERNATE: 6744747) Bulk 1
    • 1 $0.99
    • 10 $0.79
    • 100 $0.79
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    Fischer Elektronik GmbH & Co KG ICKBGA10X10

    Heatsink: extruded; black; L: 10mm; W: 10mm; H: 6mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICKBGA10X10 260 1
    • 1 $1.05
    • 10 $0.94
    • 100 $0.74
    • 1000 $0.74
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    Find more BGA 10X10 price and stock on Findchips.com

    BGA 10X10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    DIN 13715

    Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
    Text: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA


    Original     		PDF N08L6182A 48-BGA N08L63W2A N04L63W2A 44-TSOP2, N04L63W1A DIN 13715 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP

    RDKF

    Abstract: bga 6150 PCI express design PEX8111-aa66
    Text: Issue No. 5 PEX 8111 Key Features ♦ Small Package Size o o ♦ ♦ ♦ ♦ 10x10mm Fine-Pitch BGA 13x13mm Easy-Pitch BGA Low Power 400mW design Single x1 PCI Express Lane 32-bit/66 MHz PCI Interface Large 8KB Internal FIFO Other Features ♦ Supports Both Forward and


    Original     		PDF 10x10mm 13x13mm 400mW 32-bit/66 6150-SIL-EA-1 RDKF bga 6150 PCI express design PEX8111-aa66

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		PDF SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack

    60068-2-14Na

    Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
    Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.


    Original     		PDF E174442. 16x16 19x19 20x20 60068-2-14Na 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    0.8mm pitch BGA

    Abstract: LS-BGA100C-11
    Text: Tooling hole X2 BGA100C 7.20mm [0.283"] See BGA pattern code to the right for actual pattern layout Y 7.20mm [0.283"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1


    Original     		PDF BGA100C FR4/G10 10x10 LS-BGA100C-11 0.8mm pitch BGA

    292 MAPBGA

    Abstract: cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XE S12XEETX4KV2 BA 508 C0 S12XMMCV3
    Text: Data Sheet Covers MC9S12XHZ384, MC9S12XHZ256 HCS12X Microcontrollers MC9S12XHZ512 Rev. 1.05 11/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


    Original     		PDF MC9S12XHZ384, MC9S12XHZ256 HCS12X MC9S12XHZ512 S12XE 11/200OWERED 292 MAPBGA cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XEETX4KV2 BA 508 C0 S12XMMCV3

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    SG-BGA-6079

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 5M-1994. SG-BGA-6079

    micron 100 ball BGA

    Abstract: SG-BGA-6026 IC 651
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 725mm. SG-BGA-6026 micron 100 ball BGA IC 651

    SG-BGA-6213

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 16.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 10x10 SG-BGA-6213

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    10123982-001LF

    Abstract: 84512-102 74221-101LF
    Text: BOARD TO BOARD CONNECTORS MEG-Array MEZZANINE Connector system HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by


    Original     		PDF 10123982-291LF 74221-091LF 74221-191LF 74221-291LF 74388-091LF 74388-191LF 74388-291LF 74390-091LF 74390-191LF 74390-291LF 10123982-001LF 84512-102 74221-101LF

    BGA 0.56mm

    Abstract: 10X10 SF-BGA100A-B-11 BGA100A
    Text: D Package Code: BGA100A C See BGA pattern code to the right for actual pattern layout Y 11.43mm [0.450"] 0.71mm [0.028"] 11.43mm [0.450"] X Top View reference only 0.56mm [0.022"] 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 0.56mm


    Original     		PDF BGA100A 10X10 SF-BGA100A-B-11 BGA 0.56mm 10X10 BGA100A

    MC9S12XEG384

    Abstract: 3M25J LOG RX2 diagram bosch al 1450 dv TCNT20 CPU12XV2 Freescale HCS12X PFlash
    Text: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010


    Original     		PDF MC9S12XEP100 MC9S12XE HCS12X MC9S12XEP100RMV1 S12XE-Family MC9S12XEG384 3M25J LOG RX2 diagram bosch al 1450 dv TCNT20 CPU12XV2 Freescale HCS12X PFlash

    pitch 0.4mm BGA

    Abstract: 10X10 SF-BGA100B-B-11 0.4mm pitch BGA
    Text: C Package Code: BGA100B D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 9.00mm [0.354"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]


    Original     		PDF BGA100B FR4/G10 10X10 SF-BGA100B-B-11 pitch 0.4mm BGA 10X10 0.4mm pitch BGA

    3M25J

    Abstract: S12XEG256 9S12XEG384 2M53J 5m48h led 30 pin diagram lvds 2949 MC9S12XEG256 9S12XEG128 S12XEQ512 MC9S12XEG384
    Text: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010


    Original     		PDF MC9S12XEP100 MC9S12XE HCS12X MC9S12XEP100RMV1 S12XE-Family 3M25J S12XEG256 9S12XEG384 2M53J 5m48h led 30 pin diagram lvds 2949 MC9S12XEG256 9S12XEG128 S12XEQ512 MC9S12XEG384

    Untitled

    Abstract: No abstract text available
    Text: MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010


    Original     		PDF MC9S12XEP100 MC9S12XE HCS12X MC9S12XEP100RMV1 S12XE-Family

    Untitled

    Abstract: No abstract text available
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY MEZZANINE CONNECTOR SYSTEM HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the


    Original     		PDF 55715-001LF 55715-101LF 55715-201LF 84513-001LF 84513-101LF 84513-201LF 84517-001LF 84517-101LF 84517-201LF 55724-001LF

    ADC 7815

    Abstract: china usb player for tv circuit diagram MC13892 MC13892 registers MC13892VL CHINA tv kit service mode USB Headset MC13892VK MX37 mp3 player circuit diagram 2009
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.


    Original     		PDF MC13892VK MC13892VL MC13892PB MC13892 MC13892 ADC 7815 china usb player for tv circuit diagram MC13892 registers CHINA tv kit service mode USB Headset MX37 mp3 player circuit diagram 2009