Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BGA 0.8MM PITCH 49 BALLS Search Results

    BGA 0.8MM PITCH 49 BALLS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 0.8MM PITCH 49 BALLS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA Solder Ball collapse

    Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
    Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to


    Original     		PDF

    g10 fr4 7mm

    Abstract: SF-BGA49B-B-62 bga 0.8mm pitch 49 balls
    Text: 7mm [0.276"] Top View 1.1mm [0.043"] 1.1mm [0.043"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 7mm [0.276"] -62 Sn96.5Ag3.0Cu0.5 0.8mm typ. -62F* *RoHS Compliant 4.8mm [0.189"] Side View Detail A 2 Detail A 2.83mm [0.112"] 2.48mm [0.098"]


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA49B-B-62 g10 fr4 7mm bga 0.8mm pitch 49 balls

    49-BGA

    Abstract: 2032VE 2064VE 2128VE 2192VE 100-Ball PB1106 lattice 2096ve PLSI
    Text: Product Bulletin December 1998 #PB1106 Lattice Releases The World's Fastest 3.3-Volt High-Density ISPTM PLDs Introduction Lattice Semiconductor has just released a new family of true 3.3-volt high-density programmable logic devices that combine both high performance and low voltage


    Original     		PDF PB1106 2000VE 2000E 2032VE 2128VE 1-888-ISP-PLDS 49-BGA 2064VE 2192VE 100-Ball PB1106 lattice 2096ve PLSI

    2032VE

    Abstract: 2064VE 2096VE 2128VE 2192VE 100BGA Lattice pDS Version 3.0 PB1108
    Text: Product Bulletin April 1999 #PB1108 Lattice Completes Release of SuperFAST 3.3V ispLSI 2000VE Family Introduction Lattice Semiconductor has completed the release of its 3.3V SuperFAST ispLSI 2000VE Family with the introduction of the ispLSI 2064VE, 2096VE and 2192VE. These three


    Original     		PDF PB1108 2000VE 2000VE 2064VE, 2096VE 2192VE. 2032VE 2128VE, 200MHz 2064VE 2128VE 2192VE 100BGA Lattice pDS Version 3.0 PB1108

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    0.65mm pitch BGA

    Abstract: BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout
    Text: Application Report SPRA429A TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		PDF SPRA429A TMS320C6000 C6000 0.65mm pitch BGA BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 TMS320C6202 0.35mm BGA fanout

    Untitled

    Abstract: No abstract text available
    Text: FPGA Configurator FC512 Interconnect Systems, Inc. www.isipkg.com DATA SHEET FEATURES DESCRIPTION • Ultra-Compact Configuration Solution  512Mbit Flash + Controller  Supports up to 32-bit wide Fast Passive Parallel FPP configuration bus The FC512 is a single device configuration solution that


    Original     		PDF FC512 512Mbit 32-bit FC512 512Mbits 216-ball, 100ms 13x13mm 216-ball

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    BGA reflow guide

    Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
    Text: Application Report SPRA429B TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		PDF SPRA429B TMS320C6000 C6000 BGA reflow guide TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA

    LCMXO2-1200

    Abstract: CEL-9750ZHF CEL-9750ZHF10
    Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The


    Original     		PDF LCMXO2-1200-25WLCSP LCMXO2-1200 CEL-9750ZHF CEL-9750ZHF10

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    mk22fn

    Abstract: KE06
    Text: TM August 2013 • Kinetis Portfolio - Baseline • Kinetis K – CSP Packaging • Kinetis K – Security Expansion • Kinetis K - Memory Expansion • Kinetis K – FPU Expansion • Kinetis L - Low Power • Kinetis E - 5V Robust • Kinetis V – Motor Control


    Original     		PDF

    eh 11757

    Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
    Text: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		PDF SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST

    Atmel part numbering

    Abstract: FBGA48 TFBGA48 te28f320b3bd 49XX TSOP32 Package TE28F320B3TD MBM29F080A tsop48 te28f320c3bd
    Text: Standard NOR Flash family Cross-reference guide September 2005 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties


    Original     		PDF CRNORFLASH1005 Atmel part numbering FBGA48 TFBGA48 te28f320b3bd 49XX TSOP32 Package TE28F320B3TD MBM29F080A tsop48 te28f320c3bd

    cte table bga

    Abstract: datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow
    Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate


    Original     		PDF SPRA471A cte table bga datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow

    vantis jtag schematic

    Abstract: ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd
    Text: Lattice Semiconductor Corporation • Fall 1999 • Volume 6, Number 2 In This Issue SuperFAST 3.3V ispLSI 2000VE Family Complete! New Phone Numbers 3.3V ispGDXV™: The Next Generation Speedy ispLSI 2064E Rounds Out ispLSI 2000E Family Reference Design Program


    Original     		PDF 2000VE 2064E 2000E I0100 vantis jtag schematic ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd

    BGA reflow guide

    Abstract: Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin
    Text: Renesas Surface Mount Package Rev.2.00 2003.12.1 Renesas Surface Mount Package User's Manual REJ11K0001-0200Z Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is


    Original     		PDF REJ11K0001-0200Z BGA reflow guide Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin

    texas instruments reliability report

    Abstract: cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU
    Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate


    Original     		PDF SPRA471A texas instruments reliability report cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS706-00007-1v0-E 32-bit ARMTM CortexTM-M3 based Microcontroller FM3 MB9B100 Series MB9BF104N/R, F105N/R, F106N/R  DESCRIPTION The MB9B100 Series are a highly integrated 32-bit microcontroller that target for high-performance and


    Original     		PDF DS706-00007-1v0-E 32-bit MB9B100 MB9BF104N/R, F105N/R, F106N/R Copyright2010-2011

    MB9BF404

    Abstract: MB9BF404R MB9BF404NPMC MB9B400 MB9BF405R transistor AL P09
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS706-00009-1v0-E 32-bit ARMTM CortexTM-M3 based Microcontroller FM3 MB9B400 Series MB9BF404N/R, F405N/R, F406N/R  DESCRIPTION The MB9B400 Series are a highly integrated 32-bit microcontroller that target for high-performance and


    Original     		PDF DS706-00009-1v0-E 32-bit MB9B400 MB9BF404N/R, F405N/R, F406N/R Copyright2010-2011 MB9BF404 MB9BF404R MB9BF404NPMC MB9BF405R transistor AL P09