BGA 0.8MM PITCH 49 BALLS Search Results
BGA 0.8MM PITCH 49 BALLS Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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BGA 0.8MM PITCH 49 BALLS Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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BGA Solder Ball collapse
Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
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g10 fr4 7mm
Abstract: SF-BGA49B-B-62 bga 0.8mm pitch 49 balls
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Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA49B-B-62 g10 fr4 7mm bga 0.8mm pitch 49 balls | |
49-BGA
Abstract: 2032VE 2064VE 2128VE 2192VE 100-Ball PB1106 lattice 2096ve PLSI
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PB1106 2000VE 2000E 2032VE 2128VE 1-888-ISP-PLDS 49-BGA 2064VE 2192VE 100-Ball PB1106 lattice 2096ve PLSI | |
2032VE
Abstract: 2064VE 2096VE 2128VE 2192VE 100BGA Lattice pDS Version 3.0 PB1108
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PB1108 2000VE 2000VE 2064VE, 2096VE 2192VE. 2032VE 2128VE, 200MHz 2064VE 2128VE 2192VE 100BGA Lattice pDS Version 3.0 PB1108 | |
sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
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0.65mm pitch BGA
Abstract: BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout
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SPRA429A TMS320C6000 C6000 0.65mm pitch BGA BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 TMS320C6202 0.35mm BGA fanout | |
Untitled
Abstract: No abstract text available
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FC512 512Mbit 32-bit FC512 512Mbits 216-ball, 100ms 13x13mm 216-ball | |
SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
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025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 | |
BGA reflow guide
Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
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SPRA429B TMS320C6000 C6000 BGA reflow guide TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA | |
LCMXO2-1200
Abstract: CEL-9750ZHF CEL-9750ZHF10
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LCMXO2-1200-25WLCSP LCMXO2-1200 CEL-9750ZHF CEL-9750ZHF10 | |
smd transistor mark E13
Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
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SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 | |
PCB design for very fine pitch csp package
Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
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SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A | |
CBG064-052A
Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
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TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
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1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576 | |
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mk22fn
Abstract: KE06
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eh 11757
Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
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"0.4mm" bga "ball collapse" height
Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
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SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST | |
Atmel part numbering
Abstract: FBGA48 TFBGA48 te28f320b3bd 49XX TSOP32 Package TE28F320B3TD MBM29F080A tsop48 te28f320c3bd
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CRNORFLASH1005 Atmel part numbering FBGA48 TFBGA48 te28f320b3bd 49XX TSOP32 Package TE28F320B3TD MBM29F080A tsop48 te28f320c3bd | |
cte table bga
Abstract: datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow
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SPRA471A cte table bga datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow | |
vantis jtag schematic
Abstract: ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd
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2000VE 2064E 2000E I0100 vantis jtag schematic ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd | |
BGA reflow guide
Abstract: Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin
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REJ11K0001-0200Z BGA reflow guide Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin | |
texas instruments reliability report
Abstract: cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU
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SPRA471A texas instruments reliability report cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU | |
Untitled
Abstract: No abstract text available
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DS706-00007-1v0-E 32-bit MB9B100 MB9BF104N/R, F105N/R, F106N/R Copyright2010-2011 | |
MB9BF404
Abstract: MB9BF404R MB9BF404NPMC MB9B400 MB9BF405R transistor AL P09
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DS706-00009-1v0-E 32-bit MB9B400 MB9BF404N/R, F405N/R, F406N/R Copyright2010-2011 MB9BF404 MB9BF404R MB9BF404NPMC MB9BF405R transistor AL P09 |