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    BGA 0.56MM Search Results

    BGA 0.56MM Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    EVAL-ADUCM430ARDZ Analog Devices BGA Evaluation Board Visit Analog Devices Buy
    EVAL-ADUCM410QSPZ Analog Devices BGA Evaluation Board Visit Analog Devices Buy
    ADSP-BF524KBCZ-4C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy
    ADSP-BF526KBCZ-4C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy
    AD8152JBPZ Analog Devices BGA 3.2Gbps 34x34 Digital Cros Visit Analog Devices Buy
    ADSP-BF525KBCZ-6C2 Analog Devices 12x12/289 BGA WITH CODEC Visit Analog Devices Buy

    BGA 0.56MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    BGA Solder Ball collapse

    Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
    Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to


    Original     		PDF

    BGA 0.56mm

    Abstract: 10X10 SF-BGA100A-B-11 BGA100A
    Text: D Package Code: BGA100A C See BGA pattern code to the right for actual pattern layout Y 11.43mm [0.450"] 0.71mm [0.028"] 11.43mm [0.450"] X Top View reference only 0.56mm [0.022"] 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 0.56mm


    Original     		PDF BGA100A 10X10 SF-BGA100A-B-11 BGA 0.56mm 10X10 BGA100A

    SG-BGA-7089

    Abstract: 16x16 bga
    Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 12.125mm


    Original     		PDF 125mm SG-BGA-7089 16x16 bga

    BGA Solder Ball 0.35mm collapse

    Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
    Text: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right


    Original     		PDF AN-5026 BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543

    SG-BGA-6055

    Abstract: BGA 23X23 0.8
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection 30.50mm Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		PDF 600mm 000mm 100mm 025mm SG-BGA-6055 125mm BGA 23X23 0.8

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    xxxxx

    Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
    Text: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：SALES@PRECIDIP.COM 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码


    Original     		PDF 100VRMS150VDC Preci-DipULE174442 3NMIL-DTL-83734, EIA481 500VAC10 540PLCC PPS-GF30-FR UL94V-O 600VRMS 540PCB xxxxx 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR

    rise mp6

    Abstract: MARKING CODE AA4 BGA 0.56mm P55C VM86 intel 8086 Arithmetic and Logic Unit -ALU BGA OUTLINE DRAWING D44 MARKING CODE
    Text: iDRAGON mP6 IA PROCESSOR A Key Innovation for Information Appliances Doc#: MKTD6510.0 Version 3.01 iDragon™ mP6 IA Processor ™ The Rise iDragon™ mP6 IA processor is the first sixth generation x86-compatible processor optimized for low power consumption, high-performance information appliance applications such as


    Original     		PDF MKTD6510 x86-compatible mP6-500MIPS: mP6-600MIPS: rise mp6 MARKING CODE AA4 BGA 0.56mm P55C VM86 intel 8086 Arithmetic and Logic Unit -ALU BGA OUTLINE DRAWING D44 MARKING CODE

    801-PP-NNN-10-001101

    Abstract: PBT-GF30-FR 803-pp-nnn-10-249101 CuZn36Pb3 pbt-GF30 "electronica" 514-PP-NNNMXX-XXX148 802 PRECIDIP 540-88-068-24-000-1 8PM-SS-0006-01-913
    Text: カタログ14-Japanese swiss world connects Preci-Dip スイス品質の コネクション テクノロジ 内部接続部品 標準品から カスタムデザイン スイス品質を ご覧ください この一つの 工場から 原材料から完成品


    Original     		PDF 14-Japanese ISO9001 ISO14001MIL790 ISO14001 ISO14001Preci-Dip 836mm CH-2800 801-PP-NNN-10-001101 PBT-GF30-FR 803-pp-nnn-10-249101 CuZn36Pb3 pbt-GF30 "electronica" 514-PP-NNNMXX-XXX148 802 PRECIDIP 540-88-068-24-000-1 8PM-SS-0006-01-913

    802 PRECIDIP

    Abstract: IEC-60068-2-43 PBT-GF30-FR 8PM-SS-0006-01-913 801 87 XXX 20 001 514-PP-NNNMXX-XXX148 CH-2800 851-PP-NNN 1NN-65-410101801-87-008 514-11-NNN
    Text: 产品目录14-Chinese swiss world connects PRECI-DIP 瑞士高品质连接技术 互连器件 从标准产品到定制设计 在同一屋檐下 发现一个拥有瑞士品质的世界 整个制造过程完全受控。 从原材料到成品，从产品开发到销售。


    Original     		PDF 14-Chinese 14001MIL-STD-790 836mm 1200km CH-2800 802 PRECIDIP IEC-60068-2-43 PBT-GF30-FR 8PM-SS-0006-01-913 801 87 XXX 20 001 514-PP-NNNMXX-XXX148 851-PP-NNN 1NN-65-410101801-87-008 514-11-NNN

    BGA Solder Ball 0.35mm collapse

    Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
    Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table


    Original     		PDF TB-2241 S1647 S1884 BGA Solder Ball 0.35mm collapse TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm

    ed28 smd diode

    Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
    Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM


    Original     		PDF ED-4701-1 C-113: ed28 smd diode hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet

    ecg semiconductors master replacement guide

    Abstract: transistor SMD marked RNW th 20594 TRANSISTOR si 6822 MIL-STD-202F-201A CT 1975 sam transistors br 6822 sun hold ras 2410 relay TRANSISTOR SMD MARKING CODE jg Mist Ultrasonic Humidifier
    Text: RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY 2. SEMICONDUCTOR RELIABILITY RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY Since its foundation, Mitsubishi Electric has been seeking a philosophy of extending the business and contributing the society with high


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Universal Octal T1/E1/J1 LIU with Integrated Clock Adapter IDT82P5088 FEATURES • • • • • • • - Eight channel T1/E1/J1 long haul/short haul line interfaces Supports HPS Hitless Protection Switching for 1+1 protection without external relays


    Original     		PDF IDT82P5088 772KHz

    220v AC voltage stabilizer schematic diagram

    Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585


    Original     		PDF AD9272 P462-ND LNG295LFCP2U P463-ND LNG395MFTP5U 220v AC voltage stabilizer schematic diagram LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx

    schematic diagram atx Power supply 500w

    Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455


    Original     		PDF P462-ND P463-ND LNG295LFCP2U LNG395MFTP5U US2011) schematic diagram atx Power supply 500w pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS