SG-BGA-7089 Search Results
SG-BGA-7089 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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SG-BGA-7089 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Type | |
|---|---|---|---|---|---|---|
| SG-BGA-7089 |
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High Density GHz BGA Sockets; Max Pincount: 256; Top Pitch (mm): 0.4; IC Array X: 16; IC Array Y: 16; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1; IC Size X (mm): 7; IC Size Y (mm): 7; IC Size Tolerance (mm): 0.15; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.125; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-Epoxy | Original |