TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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D1065
Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Text: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21
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21x21
25x25
28x28
35x35
37x37
38x38
71x43
73x50
D1065
Chomerics* T-405
BERGQUIST softface
Chomerics* T405
Chomerics T710 tape
BGA 21x21
ARCLAD 8223
Chomerics T710
D10650-40
D10650-40 datasheet
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BERGQUIST softface
Abstract: 61995AB124D1
Text: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety
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619rev2
61995AB124D1S4
61995AB124D1
BERGQUIST softface
61995AB124D1
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Cyrix 6x86
Abstract: DC Centaur BERGQUIST softface media gx cyrix
Text: Thermal Solutions for Intel: Pentium, Pentium MM X AMD: K6, K6-2 Cyrix: 6x86, Media GX Features and Benefits : Centaur: W inChip C6 ♦ Compact design heat sinks can comfortably fit a variety of Robust Socket 7 – based PC boxes. ♦ Works with Sockets 5 & 7 processors
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709rev2
709-80AB12
709-100AB12
Cyrix 6x86
DC Centaur
BERGQUIST softface
media gx cyrix
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retention mechanisms
Abstract: AAVID Thermal Products
Text: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with
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103700F00000
103800F00000
103700F00000
103800F00000
retention mechanisms
AAVID Thermal Products
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T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
669-33AB
669-40AB
T405R
Chomerics* T405
BERGQUIST softface
T410R
intel 82495
Bergquist BP-108
intel 80486sx
Intel 82495 Cache Controller
651b
thermal printer 2 inch
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MIL-C-47113
Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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O-220
MIL-C-47113
t405 6000
e595
Chomerics* T-405
deltabond
ARCLAD 8223
T-412 chomerics
KS21343 thermal grease
Chomerics T710
174-9-250P
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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Wakefield Thermal Solutions
Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:
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BGA 64 PACKAGE thermal resistance
Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight
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624-25AB
624-35AB
624-45AB
624-60AB
BGA 64 PACKAGE thermal resistance
BGA PACKAGE thermal resistance
624-25AB
612-Series
643-35AP
655-53AB
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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BERULUB FR 16 B
Abstract: circuit diagram of 5kw smps full bridge thyristor aeg UC3854 5kw harmer simmons BERULUB FR 16 Grease Berulub FR 16 Berulub FR 66 5kw smps pfc ups PURE SINE WAVE schematic diagram
Text: Reliability Reliability General Power semiconductors used in high power electronic equipment are exposed to different conditions compared to plastic encapsulated components applied in equipment used for communication electronics. Controlling and converting of high power
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IXBH40N160,
BERULUB FR 16 B
circuit diagram of 5kw smps full bridge
thyristor aeg
UC3854 5kw
harmer simmons
BERULUB FR 16
Grease Berulub FR 16
Berulub FR 66
5kw smps pfc
ups PURE SINE WAVE schematic diagram
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BERULUB FR 16
Abstract: ixys vuo 52-16 ups PURE SINE WAVE schematic diagram Vienna Rectifier TL 82036 BERULUB FR 43 UC3858 schema inverter welding veridul BERULUB FR 16 B
Text: Application Notes & Technical Information Volume 2 Volume 1 Contents Title Page Standard IGBT "G" Series M1 - 2 What is a HiPerFET Power Mosfet? M1 - 3 New 1600 V BIMOSFET Transistors Open up New Appl. M1 - 5 Comparative Performance of BIMOSFET in FLY Back Converter Circuits
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ISOPLUS247
UC3854A
UC3854B
DN-44,
TDA4817
BERULUB FR 16
ixys vuo 52-16
ups PURE SINE WAVE schematic diagram
Vienna Rectifier
TL 82036
BERULUB FR 43
UC3858
schema inverter welding
veridul
BERULUB FR 16 B
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533002B02551
Abstract: 530614 00 AAVID THERMALLOY COMPOUND 250 577102b04000 63815 MULTIWATT die semiconductors cross index CC 3053 566010B03400 53010-1
Text: PRODUCT SELECTION GUIDE Condensed AAVID THERMALLOY AAVID THERMALLOY PRODUCT SELECTION GUIDE Condensed This condensed catalog features the more popular devices and configurations that Aavid Thermalloy produces today to cool high speed microprocessors and other commonly used semi
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