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    BERGQUIST softface

    Abstract: 61995AB124D1
    Text: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety


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    PDF 619rev2 61995AB124D1S4 61995AB124D1 BERGQUIST softface 61995AB124D1