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Catalog Datasheet	MFG & Type	Document Tags	PDF
BCC92S Abstract: BCC32 BC32 BCC24 BCC-16 Package 48 BCC Text: BCC and BCC+ The size and performance characteristics of Bump Chip Carrier BCC package make it well suited for RF devices, wide area networks, and DWDM systems. BCC is a molded, wire-bonded, leadless Chip Scale Package, and has terminals that are thinly plated on top of the resin bumps. This	Original	BCC32+ BCC92S BCC32 BC32 BCC24 BCC-16 Package 48 BCC	PDF
TL494 car charger schematic diagram Abstract: tl494 buck dc/dc converter Buck converter with tl494 mb39a118 car power inverter TL494 MB39A129 converter dc-dc 24v to 12v tl494 schematic diagram inverter lcd monitor fujitsu MB39A132 mb39a116 Text: Power Management ICs FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact:	Original		PDF

Catalog Datasheet

MFG & Type

Document Tags

PDF

BCC92S

Abstract: BCC32 BC32 BCC24 BCC-16 Package 48 BCC
Text: BCC and BCC+ The size and performance characteristics of Bump Chip Carrier BCC package make it well suited for RF devices, wide area networks, and DWDM systems. BCC is a molded, wire-bonded, leadless Chip Scale Package, and has terminals that are thinly plated on top of the resin bumps. This

Original

BCC32+ BCC92S BCC32 BC32 BCC24 BCC-16 Package 48 BCC

PDF

TL494 car charger schematic diagram

Abstract: tl494 buck dc/dc converter Buck converter with tl494 mb39a118 car power inverter TL494 MB39A129 converter dc-dc 24v to 12v tl494 schematic diagram inverter lcd monitor fujitsu MB39A132 mb39a116
Text: Power Management ICs FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact:

Original

PDF