BALL GRID ARRAY IMAGE Search Results
BALL GRID ARRAY IMAGE Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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SN65LVDS324ZQER |
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High Definition Image Sensor Receiver 80-BGA MICROSTAR JUNIOR -40 to 85 |
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SN65LVDS324ZQE |
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High Definition Image Sensor Receiver 80-BGA MICROSTAR JUNIOR -40 to 85 |
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TRS8E65H |
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SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L |
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TBAW56 |
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Switching Diode, 80 V, 0.215 A, SOT23 |
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TRS10E65H |
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SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L |
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BALL GRID ARRAY IMAGE Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
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transistor nec 8772
Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
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AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry | |
NXR-1400
Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
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AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC | |
Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
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Untitled
Abstract: No abstract text available
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CAT16-PREVIEW06 | |
jesd 51-7
Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
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SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000 | |
Recommended land pattern smd-0.5
Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
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TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 | |
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Abstract: No abstract text available
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CY14B108L CY14B108N 44-/54-pin 48-ball CY14B108L) CY14B108N) | |
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Abstract: No abstract text available
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CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball | |
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Abstract: No abstract text available
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CY14B104LA, CY14B104NA CY14B104LA) CY14B104NA) 44-/54-pin 48-ball | |
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Abstract: No abstract text available
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CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball | |
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Abstract: No abstract text available
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CY14B104LA, CY14B104NA 44-/54-pin 48-ball CY14B104LA) CY14B104NA) | |
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Abstract: No abstract text available
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CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball | |
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Abstract: No abstract text available
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CY14B104LA, CY14B104NA CY14B104LA) CY14B104NA) 44-/54-pin 48-ball | |
smartphone MOTHERBOARD CIRCUIT diagram
Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
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02-DT-0704-00 smartphone MOTHERBOARD CIRCUIT diagram AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball | |
DM270
Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
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02-DT-0704-00 DM270 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash | |
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Abstract: No abstract text available
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ELPIDA 512MB NOR FLASH
Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
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97-DT-0304-00 ELPIDA 512MB NOR FLASH nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100 | |
MCP 256M nand toshiba
Abstract: Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3
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91-DT-0504-00 MCP 256M nand toshiba Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3 | |
PCN0517
Abstract: BGA652 bt 600 c BT diode EPF10K200E EP20K400 EP20K400C EP20K400E EP20K600C EP20K600E
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PCN0517 BGA652 PCN0517 BGA652 bt 600 c BT diode EPF10K200E EP20K400 EP20K400C EP20K400E EP20K600C EP20K600E | |
zif socket 1.27mm pitch
Abstract: micro pitch BGA PGA zif socket
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51289Series zif socket 1.27mm pitch micro pitch BGA PGA zif socket | |
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Abstract: No abstract text available
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TMS320C6204 SPRS152A TMS320C6204 200-MHz 32-Bit C6204 C6202/02B/03 TMS320C62x 32-/40-Bit) 16-Bit | |
CYUSB301X
Abstract: No abstract text available
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CYUSB301X 10-mm CYUSB301X |