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    BALL GRID ARRAY IMAGE Search Results

    BALL GRID ARRAY IMAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SN65LVDS324ZQER Texas Instruments High Definition Image Sensor Receiver 80-BGA MICROSTAR JUNIOR -40 to 85 Visit Texas Instruments
    SN65LVDS324ZQE Texas Instruments High Definition Image Sensor Receiver 80-BGA MICROSTAR JUNIOR -40 to 85 Visit Texas Instruments
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TRS10E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation

    BALL GRID ARRAY IMAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    Untitled

    Abstract: No abstract text available
    Text: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.


    Original     		PDF CAT16-PREVIEW06

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    Untitled

    Abstract: No abstract text available
    Text: CY14B108L CY14B108N 8-Mbit 1024 K x 8/512 K × 16 nvSRAM 8-Mbit (1024 K × 8/512 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B108L CY14B108N 44-/54-pin 48-ball CY14B108L) CY14B108N)

    Untitled

    Abstract: No abstract text available
    Text: CY14B108L CY14B108N 8-Mbit 1024 K x 8/512 K × 16 nvSRAM 8-Mbit (1024 K × 8/512 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball

    Untitled

    Abstract: No abstract text available
    Text: CY14B104LA, CY14B104NA 4-Mbit 512 K x 8/256 K × 16 nvSRAM 4-Mbit (512 K × 8/256 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B104LA, CY14B104NA CY14B104LA) CY14B104NA) 44-/54-pin 48-ball

    Untitled

    Abstract: No abstract text available
    Text: CY14B108L CY14B108N 8-Mbit 1024 K x 8/512 K × 16 nvSRAM 8-Mbit (1024 K × 8/512 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball

    Untitled

    Abstract: No abstract text available
    Text: CY14B104LA, CY14B104NA 4-Mbit 512 K x 8/256 K × 16 nvSRAM 4-Mbit (512 K × 8/256 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B104LA, CY14B104NA 44-/54-pin 48-ball CY14B104LA) CY14B104NA)

    Untitled

    Abstract: No abstract text available
    Text: CY14B108L CY14B108N 8-Mbit 1024 K x 8/512 K × 16 nvSRAM 8-Mbit (1024 K × 8/512 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B108L CY14B108N CY14B108L) CY14B108N) 44-/54-pin 48-ball

    Untitled

    Abstract: No abstract text available
    Text: CY14B104LA, CY14B104NA 4-Mbit 512 K x 8/256 K × 16 nvSRAM 4-Mbit (512 K × 8/256 K × 16) nvSRAM Features • Packages ❐ 44-/54-pin thin small outline package (TSOP) Type II ❐ 48-ball fine-pitch ball grid array (FBGA) Pb-free and restriction of hazardous substances (RoHS)


    Original     		PDF CY14B104LA, CY14B104NA CY14B104LA) CY14B104NA) 44-/54-pin 48-ball

    smartphone MOTHERBOARD CIRCUIT diagram

    Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		PDF 02-DT-0704-00 smartphone MOTHERBOARD CIRCUIT diagram AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball

    DM270

    Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		PDF 02-DT-0704-00 DM270 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash

    Untitled

    Abstract: No abstract text available
    Text: IRVINE SENSORS CORPORATION NEWS RELEASE CONTACT: Investor Relations Irvine Sensors Corporation 714-444-8718 investorrelations@irvine-sensors.com FOR IMMEDIATE RELEASE IRVINE SENSORS ANNOUNCES NEW LINE OF STACKED MEMORY PRODUCTS First Ball Grid Array BGA product is stack of Double Data Rate parts


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    ELPIDA 512MB NOR FLASH

    Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		PDF 97-DT-0304-00 ELPIDA 512MB NOR FLASH nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100

    MCP 256M nand toshiba

    Abstract: Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3
    Text: DiskOnChip -Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, September 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		PDF 91-DT-0504-00 MCP 256M nand toshiba Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3

    PCN0517

    Abstract: BGA652 bt 600 c BT diode EPF10K200E EP20K400 EP20K400C EP20K400E EP20K600C EP20K600E
    Text: PROCESS CHANGE NOTIFICATION PCN0517 INTRODUCING KINSUS BT SUBSTRATE FOR BGA 600 AND 652 PACKAGES Change Description: Altera is introducing the Kinsus BT-based EBGA substrate as an additional substrate source for Altera’s ball grid array BGA cavity-down 600 and 652 packages. Kinsus is a fully


    Original     		PDF PCN0517 BGA652 PCN0517 BGA652 bt 600 c BT diode EPF10K200E EP20K400 EP20K400C EP20K400E EP20K600C EP20K600E

    zif socket 1.27mm pitch

    Abstract: micro pitch BGA PGA zif socket
    Text: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512899592 Planned for Obsolescence 1.27mm .050" Pitch, ZIF Micro PGA Socket, 959 Circuits with Ball Grid Array (BGA) Solder, with Cover Tape, 0.30µm (12µ") Gold (Au) Plating


    Original     		PDF 51289Series zif socket 1.27mm pitch micro pitch BGA PGA zif socket

    Untitled

    Abstract: No abstract text available
    Text: TMS320C6204 FIXED-POINT DIGITAL SIGNAL PROCESSOR SPRS152A – OCTOBER 2000 – REVISED JUNE 2001 D D D D D Signal Processor DSP – TMS320C6204 – 5-ns Instruction Cycle Time – 200-MHz Clock Rate – Eight 32-Bit Instructions/Cycle – 1600 MIPS C6204 GLW Ball Grid Array (BGA) Package


    Original     		PDF TMS320C6204 SPRS152A TMS320C6204 200-MHz 32-Bit C6204 C6202/02B/03 TMS320C62x 32-/40-Bit) 16-Bit

    CYUSB301X

    Abstract: No abstract text available
    Text: CYUSB301X EZ-USB FX3 SuperSpeed USB Controller Features • Independent power domains for core and I/O ❐ Core operation at 1.2 V 2 ❐ I S, UART, and SPI operation at 1.8 to 3.3 V 2 ❐ I C operation at 1.2 V ■ 10- x 10-mm, 0.8-mm pitch Pb-free ball grid array BGA


    Original     		PDF CYUSB301X 10-mm CYUSB301X