BA2 CAPACITOR Search Results

BA2 CAPACITOR Result Highlights (5)

Part	Manufacturer	Description
NFM15PC755R0G3D	Murata Manufacturing Co Ltd	Feed Through Capacitor,
NFM15PC435R0G3D	Murata Manufacturing Co Ltd	Feed Through Capacitor,
NFM15PC915R0G3D	Murata Manufacturing Co Ltd	Feed Through Capacitor,
DE6B3KJ151KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

BA2 CAPACITOR Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
DA2B105 Abstract: No abstract text available Text: 30/08/2013 Wrap & Fill, Axial Leads, Oval RA2, DA2, BA2 Series Search Products Applications Industries Partners Support About Us You are here: Home > Products > Film Capacitors > Metallized Polycarbonate > Wrap & Fill, Axial Leads, Oval (RA2, DA2, BA2 Series)	Original	ROUND-CYLINDRICA100 com/category-s/105 DA2B105	PDF
rf microwave amplifier with S Parameters Abstract: BA2 capacitor BA11 02238 Text: BIPOLARICS, INC. Part Number BA2 CASCADABLE SILICON BIPOLAR MONOLITHIC MICROWAVE INTEGRATED AMPLIFIER PRODUCT SPECIFICATION FEATURES: • Wide 3dB bandwidth - DC to 2.7 GHz in ceramic Micro-X - DC to 2.6 GHz in plastic packages • Suitable for 7V systems	Original		PDF
A-1275 Abstract: No abstract text available Text: BA-2 LF - Series 2 Watt Isolated DC-DC Converter 1 . Features 4 Pin SIL / 8 Pin SIL Package Low Ripple And Noise Input / Output Isolation：1K Vdc 100% Burn-In Input Filter With Internal Capacitor Custom Design Available Net Weight﹕1.4 g / 1.8 g Typical	Original		PDF
K7000 Abstract: capacitor Russian metal oxide as dielectric used in capacitor 1200C corning tantalum Text: KEMET T E C H T O P I C S … T H E L E A D I N G E D G E V OL . 2, N O . 1 y P UBLISHED BY KEMET E LECTRONICS C ORP . y P. O. B OX 5928 y G REENVILLE , SC 29606 y 864 963-6300 y J AN 1992 The workhorse dielectric for multilayer ceramic capacitors is barium titanate, which was originally considered for capacitors nearly 50 years ago.	Original		PDF
18CO Abstract: No abstract text available Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch	Original	W3H64M64E-XSBX 18CO	PDF
Untitled Abstract: No abstract text available Text: W3H264M16E-XBX ADVANCED* 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s*  Larger ball pitch for higher reliability  Package:  Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm	Original	W3H264M16E-XBX 256MB W3H64M16E 128MB"	PDF
Untitled Abstract: No abstract text available Text: W3H64M64E-XSBX 512MB – 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  58% Space Savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  43% I/O reduction vs FBGA	Original	W3H64M64E-XSBX 512MB 667Mbs 533Mbs 400Mbs	PDF
W3H128M72E-XSBX Abstract: 84 FBGA Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Package:  CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	W3H128M72E-XSBX 775mA 975mA -100ps 250ps 350ps 400ps W3H128M72E-XSBX 84 FBGA	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H64M72E-XSBX	PDF
Untitled Abstract: No abstract text available Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA	Original	W3H128M72ER-XNBX	PDF
Untitled Abstract: No abstract text available Text: W3H64M64E-XSBX 512MB – 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  58% Space Savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  43% I/O reduction vs FBGA	Original	W3H64M64E-XSBX 512MB 667Mbs 533Mbs 400Mbs	PDF
W3H64M72E-XSBX Abstract: No abstract text available Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm	Original	W3H64M72E-XSBX W3H64M72E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm	Original	W3H64M72E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H64M72E-XSBX PRELIMINARY* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H64M72E-XSBX	PDF

Untitled Abstract: No abstract text available Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs	PDF
84 FBGA Abstract: W3H64M72E-XSBX fbga84 ccd400 Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 72 • 1.0mm pitch Weight: W3H64M72E-XSBX - 2.5 grams typical	Original	W3H64M72E-XSBX W3H64M72E-XSBX 84 FBGA fbga84 ccd400	PDF
Untitled Abstract: No abstract text available Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs	PDF
Untitled Abstract: No abstract text available Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA	Original	W3H128M72ER-XNBX	PDF
W3H128M72E-XSBX Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	W3H128M72E-XSBX W3H128M72E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H64M72E-XSBX 667Mbs	PDF
W3H128M72ER-XSBX Abstract: LDM-1 W3H128M72 Text: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Posted CAS additive latency: 0, 1, 2, 3 or 4  Package:  Write latency = Read latency - 1* tCK  Commercial, Industrial and Military Temperature	Original	W3H128M72ER-XNBX W3H128M72ER-XSBX LDM-1 W3H128M72	PDF
DNU-A13 Abstract: No abstract text available Text: W3H64M16E-XBX 128MB – 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s  Larger ball pitch for higher reliability  Package:  Pinout compatible with 2-Rank Version • 79 Plastic Ball Grid Array PBGA , 11 x 14mm	Original	W3H64M16E-XBX 128MB DNU-A13 128MB"	PDF
W3H128M72E-XSBX Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XSBX PRELIMINARY* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	W3H128M72E-XSBX A0-12 A0-13 W3H128M72E-XSBX	PDF
RC9626LL Abstract: RC9626 RC24BKJ AN8065 R96DFX Remote Control Toy TRANSMITTER IC monofax r96dfx RC24BK Text: RC9626LL Modem Designer's Guide Preliminary Rockwell International Digital Communications Division 01992 Rockwell International All Rights Reserved Order No. 896 October 1992 RC9626LL Modem Designer's Guide NOTICE Information furnished by Rockwell International Corporation is believed to be accurate and	OCR Scan	RC9626LL RC9626 RC24BKJ AN8065 R96DFX Remote Control Toy TRANSMITTER IC monofax r96dfx RC24BK	PDF

BA2 CAPACITOR Search Results

BA2 CAPACITOR Result Highlights (5)

BA2 CAPACITOR Datasheets Context Search

DA2B105

rf microwave amplifier with S Parameters

A-1275

K7000

18CO

Untitled

Untitled

W3H128M72E-XSBX

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W3H64M72E-XSBX

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84 FBGA

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W3H128M72E-XSBX

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W3H128M72ER-XSBX

DNU-A13

W3H128M72E-XSBX

RC9626LL