Untitled
Abstract: No abstract text available
Text: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
L37-3L
L37-3L
D2240
10psi
D5470
50psi
100psi
|
Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
|
Original
|
PDF
|
|
d412
Abstract: No abstract text available
Text: TG4040S High Performance Thermal Interface Materials Features Low hardness Naturally tacky Low oil bleed Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc. DDR II Module / DVD Applications / Hand-Set applications etc.
|
Original
|
PDF
|
TG4040S
D5470
D2250
10psi
50psi
100psi
d412
|
Untitled
Abstract: No abstract text available
Text: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
L37-3L
L37-3L
D2240
10psi
D5470
50psi
100psi
|
Untitled
Abstract: No abstract text available
Text: TG2030S Series High Performance Thermal Interface Materials Features Low hardness Naturally tacky Low oil bleed Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
TG2030S
TG2030S
D5470
D2250
10psi
100psi
50psi
|
Untitled
Abstract: No abstract text available
Text: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
H48-2K
H48-2K
Thick37/0
50psi
100psi
10psi
D5470
|
Untitled
Abstract: No abstract text available
Text: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
H48-2K
H48-2K
50psi
100psi
10psi
D5470
|
ASTM D5470
Abstract: ASTM D412 ASTM D2240 D2240
Text: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
H48-2K
10psi
50psi
100psi
D5470
D2240
ASTM D5470
ASTM D412
ASTM D2240
|
Untitled
Abstract: No abstract text available
Text: H48-2K Thermal Conductive Pad on rolls Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
|
Original
|
PDF
|
H48-2K
H48-2K
50psi
100psi
10psi
|
Untitled
Abstract: No abstract text available
Text: L37-5S Thermal Conductive Silicone Gel Pad on rolls Features Ultra soft Low Oil Bleeding Low Contact Resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
|
Original
|
PDF
|
L37-5S
D5470
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier
|
Original
|
PDF
|
1500S30
E1269
D2240
1500S30
|
E1269
Abstract: ADHESIVE GAP PAD SIL-PAD heat capacity ASTM d792 GPVOUS-0.100-AC-0816-NA SIL-PAD D575 SIL-PAD density young D149
Text: SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 11 Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
|
Original
|
PDF
|
1500R
E1269
|
ASTM D374
Abstract: 1500S30
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K • Highly conformable / low hardness PROPERTY Color IMPERIAL VALUE
|
Original
|
PDF
|
1500S30
1500S30
ASTM D374
|
|
|
Untitled
Abstract: No abstract text available
Text: Introducing RMW Rugged, medium wall RMW tubing is specifically designed for use in a broad range of low-voltage applications. RMW is tough and flexible, making it particularly suited for the insulation and protection of cable joints in low voltage electrical systems as well as for cable repair. Uncoated RMW provides insulation
|
Original
|
PDF
|
|
ASTM d792
Abstract: astm D150 conductivity meter circuit for second tear C351 D149 D150 D2240 D257 D374
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R • Thermal conductivity = 1.5 W/mK • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
|
Original
|
PDF
|
1500R
D2240
ASTM d792
astm D150
conductivity meter circuit
for second tear
C351
D149
D150
D2240
D257
D374
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE
|
Original
|
PDF
|
5000S35
5000S35
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
|
Original
|
PDF
|
1500R
E1269
|
a3000
Abstract: No abstract text available
Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating
|
Original
|
PDF
|
A3000
E1269
a3000
|
Untitled
Abstract: No abstract text available
Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating
|
Original
|
PDF
|
E1269
|
Untitled
Abstract: No abstract text available
Text: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,
|
Original
|
PDF
|
HC1000
E1269
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness
|
Original
|
PDF
|
E1269
D2240
|
Untitled
Abstract: No abstract text available
Text: Gap Pad A2000 High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Electrically isolating
|
Original
|
PDF
|
A2000
E1269
D2240
|
Untitled
Abstract: No abstract text available
Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very
|
Original
|
PDF
|
2000S40
2000S40
|
