Untitled
Abstract: No abstract text available
Text: B DIM CfO.IO D NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP., UL94V-0; 1.2 CONTACT: COPPER ALLOY 2. FINISH: 2.1 CONTACT: 1 0 0 ~ 2 00 u " TIN PLATING ON SOLDER TAILS, 5 0 ~ 1 0 0 u ” NICKEL UNDERPLATING OVERALL. 3. WAVE SOLDER CAPABLE TO 230* C PER ACES SPEC.
|
OCR Scan
|
PDF
|
UL94V-0;
APP970142
50318-XXXXX-XXX
|
Untitled
Abstract: No abstract text available
Text: B D C NOTES: 1. MATERIAL: HOUSING:Halogen Eree PLASTIC, HIGH TEMP, U L94V-0 TERMINALCOPPER ALLOY t=0.20 FITTING NAIL:COPPER ALLOY(t=0.2) 2. PLATING: Pis. see P /N LEGEND 3. THE SPEC. PLS REFER TO P S -50214-X X X X X . 4. PACKAGE PLS. REFER TO 91 2 1 0-XXXXX-TRP
|
OCR Scan
|
PDF
|
L94V-0
-50214-X
APP970142)
|
Untitled
Abstract: No abstract text available
Text: E_ |_ F D B NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP., UL94V-0; 1.2 CONTACT: COPPER ALLOY 2. FINISH: 2.1 CONTACT: 100u" MIN. MATT TIN PLATING OVERALL 50u* MIN. NICKEL UNDERPLATING OVERALL A 3 . SPEC. PLS. REFER TO PS-50326-XXXXX-XXX
|
OCR Scan
|
PDF
|
UL94V-0;
PS-50326-XXXXX-XXX
91205-XXXX-TUBE
ECN-0903251
APP970142
50327-XXXXX-XXX
|
Untitled
Abstract: No abstract text available
Text: D B NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP., UL94V-0; 1.2 CONTACT: COPPER ALLOY 2. FINISH: 2.1 CONTACT: 10Ou” MIN. MATT TIN PLATING OVERALL 50u” MIN. NICKEL UNDERPLATING OVERALL. 3. SPEC. PLS. REFER TO PS-50326-XXXXX-XXX DIM. D
|
OCR Scan
|
PDF
|
UL94V-0;
PS-50326-XXXXX-XXX
91205-XXXX-TUBE
50326-XXXXX-XXX
|