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Catalog Datasheet	MFG & Type	PDF	Document Tags
BGA Package 0.35mm pitch Abstract: dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch" Text: AND8317 Board Mounting Considerations for ULLGA Packages Prepared by: Phillip Celaya ON Semiconductor http://onsemi.com Introduction Printed Circuit Board PCB Design Ultra Leadframe Land Grid Array (ULLGA) packages are often the package of choice for optimizing device electrical	Original	PDF	AND8317 AND8317/D BGA Package 0.35mm pitch dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch"

Catalog Datasheet

MFG & Type

PDF

Document Tags

BGA Package 0.35mm pitch

Abstract: dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch"
Text: AND8317 Board Mounting Considerations for ULLGA Packages Prepared by: Phillip Celaya ON Semiconductor http://onsemi.com Introduction Printed Circuit Board PCB Design Ultra Leadframe Land Grid Array (ULLGA) packages are often the package of choice for optimizing device electrical

Original

PDF

AND8317 AND8317/D BGA Package 0.35mm pitch dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch"