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    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


    Original     		PDF AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D

    APP3534

    Abstract: MAX1681 AN3534 Switched-Capacitor Voltage Converters
    Text: Maxim > App Notes > POWER-SUPPLY CIRCUITS Keywords: charge pumps, switched-capacitor voltage converters, voltage inverters Jun 08, 2005 APPLICATION NOTE 3534 Charge Pump Converts -5V to +5V Abstract: For applications requiring output currents of 100mA or less, a circuit converts -5V to +5V by


    Original     		PDF 100mA MAX1681 com/an3534 MAX1681: AN3534, APP3534, Appnote3534, APP3534 AN3534 Switched-Capacitor Voltage Converters