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    AN-450

    Abstract: No abstract text available
    Text: The SO small outline package has been developed to meet customer demand for ever-increasing miniaturization and component density. COMPONENT SIZE COMPARISON S.O. Package AN008766-1 AN008766-3 Standard DIP Package FIGURE 1. AN008766-2 Because of its small size, reliability of the product assembled


    Original     		PDF AN008766-1 AN008766-3 AN008766-2 an008766 AN-450

    AN-450

    Abstract: No abstract text available
    Text: National Semiconductor Application Note 450 Josip Huljev W. K. Boey February 1987 The SO small outline package has been developed to meet customer demand for ever-increasing miniaturization and component density. In order to achieve reliability performance comparable to


    Original     		PDF