vFBGA* 96 bALL
Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are
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amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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95Pb
Abstract: FCCSP amkor RDL
Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the
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WLCSP flip chip
Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters
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E679
Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking
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CCL-HL832NX-A
Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize
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CO-029)
CCL-HL832NX-A
Nitto GE100LFCS
Sumitomo G750
GE100LFCS
GE-100-LFC
CCL-HL832NX
GE100LFCS nitto
GE-100LFCS
CCL-HL-832
CCL-HL832
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MS-029
Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through
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Untitled
Abstract: No abstract text available
Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe
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EL B17 A017
Abstract: EL B17 C007 CodeTAP manual W002 SLOT PGA 370 applied microsystems power tap probe tip EL B17 C012 ampliflex D-10 EL B17 C017
Text: Rev. 4 80960Rx Debug Connector Design Guide August, 1997 Order Number: 272812-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s
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80960Rx
PI-PCI32/64)
80960Rx
EL B17 A017
EL B17 C007
CodeTAP manual
W002
SLOT PGA 370
applied microsystems power tap probe tip
EL B17 C012
ampliflex
D-10
EL B17 C017
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Abstract: HP 16520a CodeTAP manual AMP 140 pin connector HP lcd connector 40 pin to 30 pin to 7 pin corelis JTAG CONNECTOR EL B17 C007 ampliflex SLOT PGA 370 corelis jtag
Text: 80960Rx Debug Connector Design Guide Rev. 4 April 1998 Order Number: 272812-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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80960Rx
PI-PCI32/64)
80960Rx
CodeTAP
HP 16520a
CodeTAP manual
AMP 140 pin connector
HP lcd connector 40 pin to 30 pin to 7 pin
corelis JTAG CONNECTOR
EL B17 C007
ampliflex
SLOT PGA 370
corelis jtag
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Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Text: RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25
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75GHz
50-80grams
Turn-Key
Adapters
Sockets
Product Presentations
Giga-snaP™ BGA SMT Adapters
Receptacles
Prototyping Adapters
Surface Mount Package Emulation
Probing and Analysis Adapters
BGA Sockets
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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