laptop ic list
Abstract: NS6040 contactor Amkor Technology handler
Text: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective
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NS6040
DS815B
laptop ic list
contactor
Amkor Technology
handler
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Untitled
Abstract: No abstract text available
Text: Amkor MLF full lead design component dimensions. PCB land pattern dimensions
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Abstract: No abstract text available
Text: RELIABILITY REPORT DATE : 2/18/05 QUALITY ENG : PART NUMBER : Dinh Pham MIC3001 PROJECT # : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS 23119-3 MIC3001 4x4 MLF-24L AMKOR 0342 GR61294.8 TSMC G700 TSMC 0.35 24016-1 (MIC3001) 4x4 MLF-24L AMKOR
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MIC3001
MIC3001)
MLF-24L
GR61294
C66021
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Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 5/7 /04 QUALITY ENG : PART NUMBER : DANA TRINH SY88973 408 474-1078 SY88843 PROJECT : PACKAGE TYPE : ASSEMBLY LOC LOT # FAB D/C # ARRAY PROCESS 23096-1 MLF-16 Amkor 3B02021MNI MICREL-6” 321D SL ASSET 2 23096-2 MLF-16 Amkor 3B02021MNE
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SY88973
SY88843
MLF-16
3B02021MNI
3B02021MNE
3B11011MNEH
3B08002MNE
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Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 5/7/04 QUALITY ENG : PART NUMBER : DANA TRINH SY88973 408 474-1078 PROJECT : PACKAGE TYPE : 23096-1 MLF-16 23096-2 23160-1 ASSEMBLY LOC LOT # FAB D/C # ARRAY PROCESS Amkor 3B02021MNI MICREL-6” 321D SL ASSET 2 MLF-16 Amkor 3B02021MNE
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SY88973
MLF-16
3B02021MNI
3B02021MNE
3B11011MNEH
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PCB design for 0.2mm pitch csp package
Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210
Text: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2
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amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
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Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 10/15/03 QUALITY ENG : PART NUMBER : DANA TRINH SY89545 PROJECT : PACKAGE TYPE : ASSEMBLY LOC LOT # FAB D/C # ARRAY PROCESS 23118-1 32 pin MLF AMKOR 2B41003MNC MICREL 0321 SA ASSET 2 2.5V, 3.2Gbps, DIFFERENTIAL 4:1 LVDS Multiplexer WITH Internal Input Termination
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SY89545
2B41003MNC
B134001ED
B650GA
B830GB
B825GA
B141002MED
JESD22-A115
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Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 10/25/04 QUALITY ENG : PRODUCT: DANA TRINH SY89833 PROJECT: 22088-1 PACKAGE TYPE: ASSEMBLY LOCATION 16L-MLF AMKOR D/C # LOT # FAB # ARRAY PROCESS 0219B B146001MNB MICREL SA ASSET 2 SY89833L 3.3V, 2GHz Any Differential INPUT-to-LVDS 1:4 Fanout Buffer/Translator w/Internal Termination
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SY89833
16L-MLF
0219B
B146001MNB
SY89833L
B650GA
JESD78
JESD22-A115
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Untitled
Abstract: No abstract text available
Text: DATE: RELIABILITY REPORT 9/1/04 QUALITY ENG : PART NUMBER : DANA TRINH SY58031UMI 408 474-1078 Die Size PACKAGE TYPE : ASSEMBLY LOC MLF 32L AMKOR 1.33mmx1.36 mm LOT # FAB 2B32003MNE MICREL D/C # ARRAY 0304E GA PROCESS SiGe QUAL PURPOSE: To qualify new Product using GA base array.
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SY58031UMI
33mmx1
2B32003MNE
0304E
1000H
2000H
2B31003MNH
SY58023
3B05001MNCH
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Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 10/25/04 QUALITY ENG : PRODUCT: DANA TRINH SY89873 PROJECT: 22092-1 PACKAGE TYPE: ASSEMBLY LOCATION 16L MLF AMKOR D/C # LOT # FAB # ARRAY PROCESS 224F B146002MME MICREL SA ASSET 2 2000H COMMENTS 3.3V, 2.0GHz Any Diff. In-to-LVDS Programmable Clock Divider/Fanout Buffer w/Internal Termination
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SY89873
B146002MME
2000H
SY100EP111
B650GA
B134001ED
B830GB
B825GA
2B20002MEC
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amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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SY68730ZC
Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
Text: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18
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KS8695PX
KSZ8695PX
KS8721BL
KS8995M
KS8995X
KS8995E
SY68730ZC
MIC29302BT
SY68730
sy10s897
0343a
KS8721BL
Unisem
tsmc cmos
tsmc cmos 0.35
KSZ8695PX
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ATML
Abstract: ATML U 0420g MIC5205M5 ATML H Unisem 0116E ATML 28 SPN860003 MIC2211
Text: High Temp Bias Moisture Life Test TA = 85C / 85%RH at rated voltage or Highly Accelerated Stress Test HAST +131C / 85%RH MSL Pkg Lds Device D/C Process L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 L2 6 6 6 10 10 10 10
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0144B
0207B
0217B
0219B
0245B
0252C
0307E
0321D
0321E
SY88923KC
ATML
ATML U
0420g
MIC5205M5
ATML H
Unisem
0116E
ATML 28
SPN860003
MIC2211
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B1340
Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC
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Q1-2004-MICREL-
MIC2027
MIC2527
MIC2177
MIC1700B
SY69952ZC
SY87701V
B1340
sy10s897
TSMC 0.18 um CMOS
2A243
bcd3
cmos tsmc 0.18
TSMC 0.25Um
MIC29203BU
Unisem
B816E
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Untitled
Abstract: No abstract text available
Text: SPECIFICATION NO. REV. 2300-0011 A DOCUMENT TITLE: THERMAL CHARACTERISTICS OF MICREL IC ASSEMBLY OWNER: PACKAGE ENGINEER REQUIRED APPROVALS: PACKAGE ENGINEER DIRECTOR OF PACKAGING AND SUBCONTRACT ENGINEERING RELIABILITY MANAGER QUALITY VP AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION
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K8692
K8942
OT223
MLF1212D,
TMLF1010Q
TMLF2025Q
102607PM01
121008PM01
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MEMS blood pressure sensor
Abstract: "Blood Pressure Sensor" MEMS pressure sensor silicon mems microphone capacitor mems gas sensor mems microphone mems amkor microphone MEMS Filter MEMS optical tunable filters
Text: solution microelectromechanical systems technology MEMS Technology Microelectromechanical systems MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated
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ISO-9002,
ISO-9001,
QS-9000
ISO-9001
TS-16949,
MEMS blood pressure sensor
"Blood Pressure Sensor"
MEMS pressure sensor
silicon mems microphone
capacitor mems gas sensor
mems microphone
mems
amkor microphone
MEMS Filter
MEMS optical tunable filters
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EME-6300
Abstract: eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000
Text: MOISTURE SENSITIVITY CLASSIFICATION OF MICREL SURFACE MOUNT PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 3 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL
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O-263
SC-70
MIC2529
MIC2527
SY69952
MIC5400
EME6300
150X150
EME-6300
eme6600cs
EME6600
EME6300
G700
eme-6600cs
JESD22-A113
mp8000
EME-7351
MP-8000
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copper wire datasheet
Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
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22V10A
Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
sizCMOS25
LVCMOS18
ispGAL22V10A
1800adapter
1-800-LATTICE
LVCMOS33
QFN PACKAGE thermal resistance
LVCMOS25
QFN footprint
amkor mlf qfn
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22V10
Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
1800adapter
1-800-LATTICE
22V10
LVCMOS25
LVCMOS33
ABEL
plastron
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Untitled
Abstract: No abstract text available
Text: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m
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28XZ8m
A51200
A52135
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